1. Overview of the Agilex™ 7 FPGAs and SoCs
2. Agilex™ 7 FPGAs and SoCs Family Plan
3. Second Generation Hyperflex® Core Architecture
4. Adaptive Logic Module in Agilex™ 7 FPGAs and SoCs
5. Internal Embedded Memory in Agilex™ 7 FPGAs and SoCs
6. Variable-Precision DSP in Agilex™ 7 FPGAs and SoCs
7. Core Clock Network in Agilex™ 7 FPGAs and SoCs
8. General Purpose I/Os in Agilex™ 7 FPGAs and SoCs
9. I/O PLLs in Agilex™ 7 FPGAs and SoCs
10. External Memory Interface in Agilex™ 7 FPGAs and SoCs
11. Hard Processor System in Agilex™ 7 SoCs
12. Heterogeneous 3D SiP Transceivers in Agilex™ 7 FPGAs and SoCs
13. Heterogeneous 3D Stacked HBM2E DRAM Memory in Agilex™ 7 FPGAs and SoCs M-Series
14. High-Performance Symmetric Cryptographic Accelerator in Agilex™ 7 FPGAs and SoCs F-Series and I-Series
15. Configuration via Protocol Using PCIe* for Agilex™ 7 FPGAs and SoCs
16. Device Configuration and the SDM in Agilex™ 7 FPGAs and SoCs
17. Partial and Dynamic Configuration of Agilex™ 7 FPGAs and SoCs
18. Device Security for Agilex™ 7 FPGAs and SoCs
19. SEU Error Detection and Correction in Agilex™ 7 FPGAs and SoCs
20. Power Management for Agilex™ 7 FPGAs and SoCs
21. Software and Tools for Agilex™ 7 FPGAs and SoCs
22. Revision History for the Agilex® 7 FPGAs and SoCs Device Overview
1.1.1. Intel® Agilex™ F-Series SoC FPGAs
Intel® Agilex™ F-Series SoC FPGAs are optimized for a wide range of applications that require an optimal balance of power and performance, with the power efficiency of Intel’s industry-leading 10-nm SuperFin Technology. These devices deliver on average a 50% increase in core fabric performance compared to the previous generation of Intel FPGAs and contain up to 2.7 million LEs and 287 Mb of on-chip RAM. They also feature general purpose transceivers, PCIe* Gen4 x16, and 3200 Mbps DDR4 external memory interface performance. The transceivers are capable of up to 32 Gbps (NRZ) and 58 Gbps (PAM4). The SoC devices contain an embedded quad-core 64-bit Arm* Cortex* -A53 hard processor system.