1. Overview of the Agilex™ 7 FPGAs and SoCs
2. Agilex™ 7 FPGAs and SoCs Family Plan
3. Second Generation Hyperflex® Core Architecture
4. Adaptive Logic Module in Agilex™ 7 FPGAs and SoCs
5. Internal Embedded Memory in Agilex™ 7 FPGAs and SoCs
6. Variable-Precision DSP in Agilex™ 7 FPGAs and SoCs
7. Core Clock Network in Agilex™ 7 FPGAs and SoCs
8. General Purpose I/Os in Agilex™ 7 FPGAs and SoCs
9. I/O PLLs in Agilex™ 7 FPGAs and SoCs
10. External Memory Interface in Agilex™ 7 FPGAs and SoCs
11. Hard Processor System in Agilex™ 7 SoCs
12. Heterogeneous 3D SiP Transceivers in Agilex™ 7 FPGAs and SoCs
13. Heterogeneous 3D Stacked HBM2E DRAM Memory in Agilex™ 7 FPGAs and SoCs M-Series
14. High-Performance Crypto Blocks in Agilex™ 7 FPGAs and SoCs F-Series and I-Series
15. Configuration via Protocol Using PCIe* for Agilex™ 7 FPGAs and SoCs
16. Device Configuration and the SDM in Agilex™ 7 FPGAs and SoCs
17. Partial and Dynamic Configuration of Agilex™ 7 FPGAs and SoCs
18. Device Security for Agilex™ 7 FPGAs and SoCs
19. SEU Error Detection and Correction in Agilex™ 7 FPGAs and SoCs
20. Power Management for Agilex™ 7 FPGAs and SoCs
21. Software and Tools for Agilex™ 7 FPGAs and SoCs
22. Revision History for the Agilex™ 7 FPGAs and SoCs Device Overview
1. Overview of the Agilex™ 7 FPGAs and SoCs
The Agilex™ 7 FPGA product family includes the highest performance FPGAs and SoCs in the industry. Comprising of the high-performance F-Series, I-Series, and M-Series FPGAs, the Agilex™ 7 FPGAs and SoCs provide a range of premium features for the most demanding applications.
- Transceivers with the highest data rate in the industry—up to 116 Gbps
- The industry's first PCI Express* ( PCIe* ) 5.0 and Compute Express Link* ( CXL* ) support
- Options to integrate in-package HBM2E memory, delivering the highest memory bandwidth in the industry—over 1 terabytes per second (TBps).
- System-in-package (SiP) chiplet architecture
- Provides tailored and flexible solutions by integrating heterogeneous technologies in a SiP for highly-specific applications
- Using advanced 3D packaging technology, such as the Embedded Multi-die Interconnect Bridge (EMIB), Intel combines the traditional FPGA die with purpose-built semiconductor chiplet in a single device package
The Agilex™ 7 FPGA product family delivers on average 50% higher fabric performance and up to 40% lower total power consumption compared to previous generation Intel® FPGAs. To achieve this improvement, the product family leverages these key innovations and techniques:
- Advanced Intel® 10-nm SuperFin and Intel® 7 technologies
- Second generation Hyperflex® FPGA architecture
- High level of system integration
- SmartVID standard power devices
- Power islands, power gating, and other power reduction techniques
These capabilities and advanced features enable customized connectivity and acceleration for the most compute-intensive, bandwidth-intensive, and memory-intensive applications. The applications span across many segments including communications, high-performance computing, video and broadcast equipments, high-end test and measurement, medical electronics, data centers, and defense.
Note: The information contained in this document is preliminary and subject to change.