4.3.2. Intel® Agilex™ Temperature Monitor Design Guidelines
- Connect the remote TSD pins to external temperature sensing devices to monitor the on-chip temperature.
- To interface with the remote TSD, use temperature sensing chips with features that allow you to perform calibration and measurement compensation to improve accuracy, such as:
- Configurable ideality factor
- Offset adjustment with or without Beta compensation
- Keep the resistance of both board traces to the remote TSD p and n pins to less than 0.2 Ω.
- Route both traces in equal lengths and shield them.
- Intel recommends a 10-mils width and space for both traces.
- Route both traces through the most minimum number of vias and crossunders possible to minimize the thermocouple effects.
- Ensure that the number of vias for both traces are the same.
- To avoid coupling, insert a GND plane between the remote TSD pins traces and high-frequency toggling signals, such as clocks and I/O signals.
- To filter high-frequency noise, place an external capacitor between the traces close to the external sensors.
- If you use only the local temperature sensors, you can leave the remote TSD p and n pins unconnected.
For details about device specifications and connection guidelines, refer to the external temperature sensor manufacturer's documentation.
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