Agilex™ 7 Power Management User Guide

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ID 683373
Date 11/25/2024
Public
Document Table of Contents
Document Table of Contents x
1. Agilex™ 7 Power Management Overview 2. Agilex™ 7 Power Basics 3. Agilex™ 7 Power and I/O State Sequencing 4. Agilex™ 7 Sensor Monitoring System 5. Agilex™ 7 Power Optimization Techniques and Features 6. Document Revision History for the Agilex™ 7 Power Management User Guide
1. Agilex™ 7 Power Management Overview x
1.1. Power System Design Phases 1.2. Power Supplies
1.1. Power System Design Phases x
1.1.1. Choosing a Power Tree 1.1.2. Power Estimation 1.1.3. Power Optimization 1.1.4. Power Generation
2. Agilex™ 7 Power Basics x
2.1. Power Consumption 2.2. Power Estimation Basics 2.3. Power and Thermal Calculator 2.4. Power Analyzer
3. Agilex™ 7 Power and I/O State Sequencing x
3.1. Overview 3.2. Power-Up Sequence Requirements 3.3. Power-Down Sequence Requirements for Agilex™ 7 Devices with E-Tile 3.4. Power-Down Sequence Requirements for the Agilex™ 7 M-Series Devices 3.5. Floating Voltage 3.6. Power-On Reset
3.2. Power-Up Sequence Requirements x
3.2.1. Guidelines for I/O Pins in GPIO, HPS, SDM Banks, and UIB Subsystem During Power Sequencing
3.6. Power-On Reset x
3.6.1. Power Supplies Monitored by the POR Circuitry
4. Agilex™ 7 Sensor Monitoring System x
4.1. Voltage Monitoring System 4.2. Temperature Monitoring System 4.3. Sensors Design Considerations 4.4. Temperature Reading Design Example
4.1. Voltage Monitoring System x
4.1.1. Voltage Sensor Transfer Function
4.2. Temperature Monitoring System x
4.2.1. Local Temperature Sensor 4.2.2. Remote Temperature Sensing Diode 4.2.3. Temperature Sensor Locations 4.2.4. Retrieving Local Temperature Sensor Reading 4.2.5. Temperature Sensor Error Codes
4.2.3. Temperature Sensor Locations x
4.2.3.1. Getting Approximate Locations of the Transceiver Banks
4.3. Sensors Design Considerations x
4.3.1. Voltage Monitor Design Guidelines 4.3.2. Temperature Monitor Design Guidelines 4.3.3. Transceiver Tile Local Temperature Sensor Design Guidelines 4.3.4. Guidelines: Calibrate Temperature Sensing Chip Interfacing the Agilex™ 7 Remote TSD 4.3.5. Guidelines: Reading the R-Tile Local Temperature Sensor
4.4. Temperature Reading Design Example x
4.4.1. Directory Structure 4.4.2. Hardware and Software Requirements 4.4.3. Temperature Reading Design Example Description 4.4.4. Using the Temperature Reading Design Example 4.4.5. Verifying the Interaction between the Design Example and the Mailbox Client with Avalon® Streaming Interface IP
4.4.4. Using the Temperature Reading Design Example x
4.4.4.1. Opening the Temperature Reading Design Example 4.4.4.2. Compiling the Temperature Reading Design Example and Generating the Software Object File 4.4.4.3. Programming and Starting Up the Temperature Reading Design Example 4.4.4.4. Sending Commands to the Temperature Reading Design Example
4.4.4.4. Sending Commands to the Temperature Reading Design Example x
4.4.4.4.1. Default Commands for the Temperature Reading Design Example
5. Agilex™ 7 Power Optimization Techniques and Features x
5.1. SmartVID Standard Power Devices 5.2. DSP and M20K Power Gating 5.3. Clock Gating 5.4. Power Sense Line 5.5. Power Optimization Techniques in the Quartus® Prime Software
5.1. SmartVID Standard Power Devices x
5.1.1. SmartVID Feature Implementation in Agilex™ 7 Devices 5.1.2. SDM Power Manager 5.1.3. Temperature Compensation 5.1.4. Agilex™ 7 Power Management and VID Implementation Guide
5.1.2. SDM Power Manager x
5.1.2.1. PMBus Master Mode 5.1.2.2. PMBus Slave Mode 5.1.2.3. Fail Safe Mechanism 5.1.2.4. Fault Management and Error Reporting
5.1.4. Agilex™ 7 Power Management and VID Implementation Guide x
5.1.4.1. Specifying Power Management and VID Parameters and Options
5.1.4.1. Specifying Power Management and VID Parameters and Options x
5.1.4.1.1. Configuration Pin Parameters 5.1.4.1.2. Power Management and VID Parameters 5.1.4.1.3. Power Management and VID Interface QSF Constraint Guide
1. Agilex™ 7 Power Management Overview
2. Agilex™ 7 Power Basics
3. Agilex™ 7 Power and I/O State Sequencing
4. Agilex™ 7 Sensor Monitoring System
5. Agilex™ 7 Power Optimization Techniques and Features
6. Document Revision History for the Agilex™ 7 Power Management User Guide

4.2.3. Temperature Sensor Locations

The Agilex™ 7 local and remote TSDs are located in the core fabric and tiles. There are several local temperature sensor locations within the core fabric and one location in each transceiver or HBM2E tile.
Figure 10. Temperature Sensing Diode LocationsThis figure shows approximate locations of the temperature sensors and is not to scale. The figure shows the view of the die as shown in the Quartus® Prime Chip Planner. In the Pin Planner, this corresponds to the "Bottom View".
Note: Availability of the transceiver tiles varies among different Agilex™ 7 series, densities, and packages. The HPS block is available only in SoC FPGAs. The HBM2E tiles are only available in M-Series FPGAs.
  • To monitor the HPS temperature, use TSD 1 in location 4.
  • To monitor the SDM temperature, use the TSD in location 0.
Table 10.  Temperature Sensor Locations Availability—Core FabricThis table lists the availability of the temperature sensor locations and TSDs in the core fabric for different Agilex™ 7 device densities. For more information about the device densities, refer to the Agilex™ 7 device overview.
Location TSD F-Series I-Series M-Series

AGF 006

AGF 008

AGF 019

AGF 023

AGF 012

AGF 014

AGF 022

AGF 027

AGI 019

AGI 023

AGI 022

AGI 027

AGI 035

AGI 040

AGI 041

AGM 032

AGM 039
0 1 Yes Yes Yes Yes Yes
1 1 Yes Yes Yes Yes Yes
2 — Yes — Yes Yes
2 1 Yes Yes Yes Yes Yes
2 — Yes — Yes Yes
3 1 Yes Yes Yes Yes Yes
2 Yes Yes Yes Yes Yes
4 1 Yes Yes Yes Yes Yes
2 Yes Yes Yes Yes Yes
Table 11.  Temperature Sensor Locations Availability—Transceivers and HBM2E TilesThis table lists the availability of the temperature sensor locations and TSDs in the transceiver and HBM2E tiles for different Agilex™ 7 package codes. For more information about the package codes, refer to the Agilex™ 7 device overview.

L = Temperature sensor location
L TSD F-Series I-Series M-Series
R16A R24B R24C R24D R25A R31C R18A R29A R29D R31A R31B R39A R31E R47A R47B R31B
5 1 Yes Yes Yes 7 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
2 Yes — Yes7 Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
3 Yes — Yes7 Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
4 Yes — Yes7 Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
5 Yes — Yes7 Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
6 — — — — — — — — — Yes — — Yes — — —
6 1 — — — — — — — — — — — Yes — — — —
2 — — — — — — — — — — — Yes — — — —
3 — — — — — — — — — — — Yes — — — —
4 — — — — — — — — — — — Yes — — — —
5 — — — — — — — — — — — Yes — — — —
7 1 — — Yes 8 — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
2 — — Yes8 — — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
3 — — Yes8 — — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
4 — — Yes8 — — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
5 — — Yes8 — — Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
6 — — — — — — Yes Yes Yes — — — Yes Yes — —
8 1 Yes Yes Yes — Yes Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes
2 Yes Yes Yes — Yes Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes
3 Yes Yes Yes — Yes Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes
4 Yes Yes Yes — Yes Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes
5 Yes — Yes — — Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes
6 — — — — — — — Yes Yes — — — — — — —
9 1 — — — — — — — — — — — Yes — — — —
2 — — — — — — — — — — — Yes — — — —
3 — — — — — — — — — — — Yes — — — —
4 — — — — — — — — — — — Yes — — — —
5 — — — — — — — — — — — Yes — — — —
10 1 — — — — — Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes
2 — — — — — Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes
3 — — — — — Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes
4 — — — — — Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes
5 — — — — — Yes — Yes Yes Yes Yes Yes Yes Yes Yes Yes
6 — — — — — — — Yes Yes — — — — — — —
11 1 — — — — — — — — — — — — — Yes Yes —
12 1 — — — — — — — — — — — — — Yes Yes —
Table 12.  Local Temperature Sensor Locations and Corresponding Bank NamesThe temperature sensor locations are as shown in the preceding figure. The bank name of each location varies between different types of transceiver tiles. For example, if location 7 is an E-Tile, the bank name is 8C. If the same location is a P-Tile, the bank name is 10C.
Location Bank Name
Transceivers HBM2E

F-Series

 F-Series

F-Series

I-Series

M-Series

I-Series

M-Series

M-Series
E-Tile P-Tile F-Tile R-Tile Top Bottom
5 8A 10A 12A 14A — —
6 — — 12B — — —
7 8C 10C 12C 14C — —
8 9A 11A 13A 15A — —
9 — — 13B — — —
10 9C 11C 13C 15C — —
11 — — — — — U50
12 — — — — U51 —
Table 13.  Local Temperature Sensor Locations and Equivalent Remote TSD Pin NamesThe temperature sensor locations are as shown in the preceding figure. Not all locations have a remote TSD. In locations with a remote TSD, the remote TSD is physically located next to the local TSDs that are marked as local TSD 1. Availability of the sensor locations depends on the device and package combination.
Loc. Availability in Devices

Sensor Location

[31..16]

(Hex. code)

Supported Channel 9

(Specify sensor bitmask[15..0] as hex. value)

Equivalent Remote TSD Pin Name

(Next to local TSD 1 in sensor location)

AGF 006

AGF 008

AGF 012

AGF 014

AGF 019

AGF 022

AGF 023

AGF 027

AGI 019

AGI 022

AGI 023

AGI 027

AGI 041

AGI 035

AGI 040

AGM 032

AGM 039
0 Yes Yes Yes Yes 0000 0 10

TEMPDIODE0Ap

TEMPDIODE0An

1 Yes Yes Yes Yes 0001 2, 1, 0 11 —
2 Yes Yes Yes Yes 0002 2, 1, 0 11

TEMPDIODE0Cp

TEMPDIODE0Cn

3 Yes Yes Yes Yes 0003 2, 1, 0 11 —
4 Yes Yes Yes Yes 0004 2, 1, 0 11 —
5 Yes Yes Yes Yes 0005 6, 5, 4, 3, 2, 1, 0 12

TEMPDIODE1p

TEMPDIODE1n

6 — — Yes — 0006 5, 4, 3, 2, 1, 0

TEMPDIODE2p

TEMPDIODE2n

7 — Yes Yes Yes 0007 6, 5, 4, 3, 2, 1, 0 12

TEMPDIODE3p

TEMPDIODE3n

8 Yes Yes Yes Yes 0008 6, 5, 4, 3, 2, 1, 0 12

TEMPDIODE4p

TEMPDIODE4n

9 — — Yes — 0009 5, 4, 3, 2, 1, 0

TEMPDIODE5p

TEMPDIODE5n

10 — Yes Yes Yes 000A 6, 5, 4, 3, 2, 1, 0 12

TEMPDIODE6p

TEMPDIODE6n

11 — — — Yes 000B 1, 0 —
12 — — — Yes 000C 1, 0 —

Section Content
Getting Approximate Locations of the Transceiver Banks

Related Information
7 Applicable to package code AGF006, AGF008, AGF012, and AGF014 only.
8 Applicable to package code AGF019, AGF022, AGF023, and AGF027 only.
9 For sensor locations with several local TSDs, channel 0 (mask [0]) returns the highest temperature among the local TSDs in the particular location. For sensor locations with one local TSD, channel 0 returns the same value as channel 1.
10 For location 0, only channel 0 (mask [0]) is supported, returning the temperature reading for the TSD in that location.
11 Channel 2 (mask [2]) is available only in selected production devices.
12 Channels 2 to 6 (masks [6..2]) are applicable only to R-Tile ([6..2]), F-Tile ([5..2]), and E-Tile ([4..2]) transceiver tiles. Availability of the transceiver tiles varies among different Agilex™ 7 series, densities, and packages.
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