External Memory Interfaces (EMIF) IP User Guide: Agilex™ 5 FPGAs and SoCs

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ID 817467
Date 4/01/2024
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Document Table of Contents
Document Table of Contents x
1. About the External Memory Interfaces Agilex™ 5 FPGA IP 2. Agilex™ 5 FPGA EMIF IP – Introduction 3. Agilex™ 5 FPGA EMIF IP – Product Architecture 4. Agilex™ 5 FPGA EMIF IP – End-User Signals 5. Agilex™ 5 FPGA EMIF IP – Simulating Memory IP 6. Intel® Agilex™ 5 FPGA EMIF IP - DDR4 Support 7. Intel® Agilex™ 5 FPGA EMIF IP - LPDDR4 Support 8. Intel® Agilex™ 5 FPGA EMIF IP - LPDDR5 Support 9. Agilex™ 5 FPGA EMIF IP – Timing Closure 10. Agilex™ 5 FPGA EMIF IP – Controller Optimization 11. Agilex™ 5 FPGA EMIF IP – Debugging 12. Document Revision History for External Memory Interfaces (EMIF) IP User Guide
1. About the External Memory Interfaces Agilex™ 5 FPGA IP x
1.1. Release Information
2. Agilex™ 5 FPGA EMIF IP – Introduction x
2.1. Agilex™ 5 EMIF IP Protocol and Feature Support 2.2. Agilex™ 5 EMIF IP Design Flow
2.2. Agilex™ 5 EMIF IP Design Flow x
2.2.1. Agilex™ 5 EMIF IP Design Checklist
3. Agilex™ 5 FPGA EMIF IP – Product Architecture x
3.1. Agilex™ 5 EMIF Architecture: Protocol and Maximum Interface Width Support 3.2. Agilex™ 5 EMIF Architecture: Introduction 3.3. Agilex™ 5 EMIF Sequencer 3.4. Agilex™ 5 EMIF Controller 3.5. Agilex™ 5 EMIF IP for Hard Processor Subsystem (HPS)
3.2. Agilex™ 5 EMIF Architecture: Introduction x
3.2.1. Agilex™ 5 EMIF Architecture: I/O Subsystem 3.2.2. Agilex™ 5 EMIF Architecture: I/O SSM 3.2.3. Agilex™ 5 EMIF Architecture: HSIO Bank 3.2.4. Agilex™ 5 EMIF Architecture: I/O Lane 3.2.5. Agilex™ 5 EMIF Architecture: Input DQS Clock Tree 3.2.6. Agilex™ 5 EMIF Architecture: PHY Clock Tree 3.2.7. Agilex™ 5 EMIF Architecture: PLL Reference Clock Networks 3.2.8. Agilex™ 5 EMIF Architecture: Clock Phase Alignment 3.2.9. User Clock in Different Core Access Modes
3.2.3. Agilex™ 5 EMIF Architecture: HSIO Bank x
3.2.3.1. Pin Placement 3.2.3.2. HSIO Sub-Bank Usage
3.3. Agilex™ 5 EMIF Sequencer x
3.3.1. Agilex™ 5 Mailbox Structure and Register Definitions
3.3.1. Agilex™ 5 Mailbox Structure and Register Definitions x
3.3.1.1. Mailbox Supported Commands 3.3.1.2. Mailbox Command Definitions
3.4. Agilex™ 5 EMIF Controller x
3.4.1. Hard Memory Controller
3.4.1. Hard Memory Controller x
3.4.1.1. Hard Memory Controller Features
4. Agilex™ 5 FPGA EMIF IP – End-User Signals x
4.1. Agilex™ 5 FPGA EMIF IP Interfaces for DDR4 4.2. Agilex™ 5 FPGA EMIF IP Interfaces for LPDDR4 4.3. Agilex™ 5 FPGA EMIF IP Interfaces for LPDDR5 4.4. Agilex™ 5 FPGA EMIF IP Interfaces for EMIF Calibration Component
4.1. Agilex™ 5 FPGA EMIF IP Interfaces for DDR4 x
4.1.1. ref_clk for EMIF 4.1.2. core_init_n for EMIF 4.1.3. usr_async_clk for EMIF 4.1.4. usr_clk for EMIF 4.1.5. usr_rst_n for EMIF 4.1.6. s0_axi4 for EMIF 4.1.7. mem for EMIF 4.1.8. oct for EMIF
4.2. Agilex™ 5 FPGA EMIF IP Interfaces for LPDDR4 x
4.2.1. ref_clk for EMIF 4.2.2. core_init_n for EMIF 4.2.3. usr_async_clk for EMIF 4.2.4. usr_clk for EMIF 4.2.5. usr_rst_n for EMIF 4.2.6. s0_axi4 for EMIF 4.2.7. mem for EMIF 4.2.8. oct for EMIF
4.3. Agilex™ 5 FPGA EMIF IP Interfaces for LPDDR5 x
4.3.1. ref_clk for EMIF 4.3.2. core_init_n for EMIF 4.3.3. usr_async_clk for EMIF 4.3.4. usr_clk for EMIF 4.3.5. usr_rst_n for EMIF 4.3.6. s0_axi4 for EMIF 4.3.7. oct for EMIF
4.4. Agilex™ 5 FPGA EMIF IP Interfaces for EMIF Calibration Component x
4.4.1. s0_axi4lite_clk for EMIF 4.4.2. s0_axi4lite_rst_n for EMIF 4.4.3. s0_axil for EMIF
5. Agilex™ 5 FPGA EMIF IP – Simulating Memory IP x
5.1. Simulation Walkthrough
5.1. Simulation Walkthrough x
5.1.1. Calibration 5.1.2. Simulation Scripts 5.1.3. Functional Simulation with Verilog HDL 5.1.4. Simulating the Design Example
6. Intel® Agilex™ 5 FPGA EMIF IP - DDR4 Support x
6.1. Intel® Agilex™ 5 FPGA EMIF IP Parameters for DDR4 6.2. Agilex™ 5 FPGA EMIF IP Pin and Resource Planning 6.3. Agilex™ 5 EMIF Pin Swapping Guidelines 6.4. DDR4 Layout Design Guidelines
6.1. Intel® Agilex™ 5 FPGA EMIF IP Parameters for DDR4 x
6.1.1. Agilex™ 5 FPGA EMIF IP Parameter for DDR4 6.1.2. Intel Agilex 5 FPGA EMIF Memory Device Description IP (DDR4) Parameter Descriptions
6.2. Agilex™ 5 FPGA EMIF IP Pin and Resource Planning x
6.2.1. Intel® Agilex™ 5 FPGA EMIF IP Resources 6.2.2. Pin Guidelines for Intel® Agilex™ 5 FPGA EMIF IP 6.2.3. Pin Placements for Intel® Agilex™ 5 FPGA DDR4 EMIF IP
6.2.1. Intel® Agilex™ 5 FPGA EMIF IP Resources x
6.2.1.1. OCT 6.2.1.2. PLL
6.2.2. Pin Guidelines for Intel® Agilex™ 5 FPGA EMIF IP x
6.2.2.1. Intel® Agilex™ 5 FPGA EMIF IP Pin and Resource Planning
6.2.2.1. Intel® Agilex™ 5 FPGA EMIF IP Pin and Resource Planning x
6.2.2.1.1. Intel® Agilex™ 5 FPGA EMIF IP Interface Pins 6.2.2.1.2. Estimating Pin Requirements 6.2.2.1.3. Maximum Number of Interfaces
6.2.3. Pin Placements for Intel® Agilex™ 5 FPGA DDR4 EMIF IP x
6.2.3.1. Address and Command Pin Placement for DDR4 6.2.3.2. DDR4 Data Width Mapping 6.2.3.3. General Guidelines 6.2.3.4. Specific Pin Connection Requirements 6.2.3.5. Command and Address Signals 6.2.3.6. Clock Signals 6.2.3.7. Data, Data Strobes, DM/DBI, and Optional ECC Signals
6.3. Agilex™ 5 EMIF Pin Swapping Guidelines x
6.3.1. DDR4 Byte Lane Swapping 6.3.2. DDR4 Address and Command and CLK Lane 6.3.3. DDR4 Interface x8 Data Lane 6.3.4. DDR4 Interface x4 Data Lane
6.4. DDR4 Layout Design Guidelines x
6.4.1. DDR4 PCB Stackup and Design Considerations 6.4.2. DDR4 General Design Considerations 6.4.3. DDR4 Routing Guidelines - Memory-Down (Discrete) Topologies
6.4.3. DDR4 Routing Guidelines - Memory-Down (Discrete) Topologies x
6.4.3.1. 1 Rank x 8 Discrete (Memory Down) Topology 6.4.3.2. 1 Rank x 16 Discrete (Memory Down) Topology 6.4.3.3. VREF_CA/RESET Signal Routing Guidelines for 1 Rank x 8 and 1 Rank x 16 Discrete (Memory Down) Topology 6.4.3.4. Skew Matching Guidelines for DDR4 (Memory Down) Discrete Configurations 6.4.3.5. Power Delivery Recommendation for DDR4 Discrete Configurations 6.4.3.6. DDR4 Simulation Strategy
7. Intel® Agilex™ 5 FPGA EMIF IP - LPDDR4 Support x
7.1. Intel® Agilex™ 5 FPGA EMIF IP Parameters for LPDDR4 7.2. Intel® Agilex™ 5 FPGA EMIF IP Pin and Resource Planning 7.3. LPDDR4 Layout Design Guidelines
7.1. Intel® Agilex™ 5 FPGA EMIF IP Parameters for LPDDR4 x
7.1.1. Agilex™ 5 FPGA EMIF IP Parameter for LPDDR4 7.1.2. Intel Agilex 5 FPGA EMIF Memory Device Description IP (LPDDR4) Parameter Descriptions
7.2. Intel® Agilex™ 5 FPGA EMIF IP Pin and Resource Planning x
7.2.1. Intel® Agilex™ 5 FPGA EMIF IP Interface Pins 7.2.2. Intel® Agilex™ 5 FPGA EMIF IP Resources 7.2.3. Pin Guidelines for Intel® Agilex™ 5 FPGA EMIF IP
7.2.1. Intel® Agilex™ 5 FPGA EMIF IP Interface Pins x
7.2.1.1. Estimating Pin Requirements 7.2.1.2. LPDDR4 Component Options 7.2.1.3. Maximum Number of Interfaces
7.2.2. Intel® Agilex™ 5 FPGA EMIF IP Resources x
7.2.2.1. OCT 7.2.2.2. PLL
7.2.3. Pin Guidelines for Intel® Agilex™ 5 FPGA EMIF IP x
7.2.3.1. General Guidelines 7.2.3.2. Specific Pin Connection Requirements 7.2.3.3. Command and Address Signals 7.2.3.4. Clock Signals 7.2.3.5. Address and Command Pin Placement for LPDDR4 7.2.3.6. Pin Placements for Agilex™ 5 FPGA EMIF IP for LPDDR4 7.2.3.7. Pin Swapping Guidelines
7.3. LPDDR4 Layout Design Guidelines x
7.3.1. LPDDR4 PCB Stackup and Design Considerations 7.3.2. LPDDR4 General Design Considerations 7.3.3. LPDDR4 Interface Design Guidelines
7.3.3. LPDDR4 Interface Design Guidelines x
7.3.3.1. LPDDR4 Discrete Component/Memory Down Topology (up to 32 bits interface) 7.3.3.2. LPDDR4 Simulation Strategy
8. Intel® Agilex™ 5 FPGA EMIF IP - LPDDR5 Support x
8.1. Intel Agilex 5 FPGA EMIF IP Parameters for LPDDR5 8.2. Agilex™ 5 FPGA EMIF IP Pin and Resource Planning 8.3. LPDDR5 Layout Design Guidelines
8.1. Intel Agilex 5 FPGA EMIF IP Parameters for LPDDR5 x
8.1.1. Agilex™ 5 FPGA EMIF IP Parameter for LPDDR5 8.1.2. Intel Agilex 5 FPGA EMIF Memory Device Description IP (LPDDR5) Parameter Descriptions
8.2. Agilex™ 5 FPGA EMIF IP Pin and Resource Planning x
8.2.1. Agilex™ 5 FPGA EMIF IP Interface Pins 8.2.2. Agilex™ 5 FPGA EMIF IP Resources 8.2.3. Pin Guidelines for Agilex™ 5 FPGA EMIF IP 8.2.4. Pin Placements for Intel Agilex 5 FPGA LPDDR5 EMIF IP
8.2.1. Agilex™ 5 FPGA EMIF IP Interface Pins x
8.2.1.1. Estimating Pin Requirements 8.2.1.2. LPDDR5 Component Options 8.2.1.3. Maximum Number of Interfaces
8.2.2. Agilex™ 5 FPGA EMIF IP Resources x
8.2.2.1. OCT 8.2.2.2. PLL
8.2.3. Pin Guidelines for Agilex™ 5 FPGA EMIF IP x
8.2.3.1. General Guidelines - LPDDR5 8.2.3.2. Specific Pin Connection Requirements 8.2.3.3. Command and Address Signals 8.2.3.4. Clock Signals
8.2.4. Pin Placements for Intel Agilex 5 FPGA LPDDR5 EMIF IP x
8.2.4.1. Address and Command Pin Placement for LPDDR5 8.2.4.2. LPDDR5 Data Width Mapping 8.2.4.3. LPDDR5 Byte Lane Swapping
8.3. LPDDR5 Layout Design Guidelines x
8.3.1. LPDDR5 PCB Stackup and Design Considerations 8.3.2. LPDDR5 General Design Considerations 8.3.3. LPDDR5 Interface Design Guidelines
8.3.3. LPDDR5 Interface Design Guidelines x
8.3.3.1. LPDDR5 Discrete Component/Memory Down Topology (Single Rank or Dual-Rank) 8.3.3.2. Example of an LPDDR5 Layout on an Intel FPGA Platform Board 8.3.3.3. LPDDR5 Simulation Strategy
9. Agilex™ 5 FPGA EMIF IP – Timing Closure x
9.1. Timing Closure 9.2. Optimizing Timing
9.1. Timing Closure x
9.1.1. Timing Analysis
9.1.1. Timing Analysis x
9.1.1.1. PHY or Core
10. Agilex™ 5 FPGA EMIF IP – Controller Optimization x
10.1. Interface Standard 10.2. Bank Management Efficiency 10.3. Data Transfer 10.4. Improving Controller Efficiency
10.4. Improving Controller Efficiency x
10.4.1. Frequency of Operation 10.4.2. Series of Reads or Writes
11. Agilex™ 5 FPGA EMIF IP – Debugging x
11.1. Interface Configuration Performance Issues 11.2. Functional Issue Evaluation 11.3. Timing Issue Characteristics 11.4. Verifying Memory IP Using the Signal Tap Logic Analyzer 11.5. Generating Traffic with the Test Engine IP 11.6. Guidelines for Developing HDL for Traffic Generator 11.7. Hardware Debugging Guidelines 11.8. Create a Simplified Design that Demonstrates the Same Issue 11.9. Measure Power Distribution Network 11.10. Measure Signal Integrity and Setup and Hold Margin 11.11. Vary Voltage 11.12. Operate at a Lower Speed 11.13. Determine Whether the Issue Exists in Previous Versions of Software 11.14. Determine Whether the Issue Exists in the Current Version of Software 11.15. Try A Different PCB 11.16. Try Other Configurations 11.17. Debugging Checklist 11.18. Categorizing Hardware Issues 11.19. Signal Integrity Issues 11.20. Characteristics of Signal Integrity Issues 11.21. Evaluating Signal Integrity Issues 11.22. Skew 11.23. Crosstalk 11.24. Power System 11.25. Clock Signals 11.26. Address and Command Signals 11.27. Read Data Valid Window and Eye Diagram 11.28. Write Data Valid Window and Eye Diagram 11.29. Hardware and Calibration Issues 11.30. Memory Timing Parameter Evaluation 11.31. Verify that the Board Has the Correct Memory Component or DIMM Installed
11.1. Interface Configuration Performance Issues x
11.1.1. Interface Configuration Bottleneck and Efficiency Issues
11.2. Functional Issue Evaluation x
11.2.1. Intel® IP Memory Model 11.2.2. Vendor Memory Model 11.2.3. Transcript Window Messages
11.3. Timing Issue Characteristics x
11.3.1. Evaluating FPGA Timing Issues 11.3.2. Evaluating External Memory Interface Timing Issues
1. About the External Memory Interfaces Agilex™ 5 FPGA IP
2. Agilex™ 5 FPGA EMIF IP – Introduction
3. Agilex™ 5 FPGA EMIF IP – Product Architecture
4. Agilex™ 5 FPGA EMIF IP – End-User Signals
5. Agilex™ 5 FPGA EMIF IP – Simulating Memory IP
6. Intel® Agilex™ 5 FPGA EMIF IP - DDR4 Support
7. Intel® Agilex™ 5 FPGA EMIF IP - LPDDR4 Support
8. Intel® Agilex™ 5 FPGA EMIF IP - LPDDR5 Support
9. Agilex™ 5 FPGA EMIF IP – Timing Closure
10. Agilex™ 5 FPGA EMIF IP – Controller Optimization
11. Agilex™ 5 FPGA EMIF IP – Debugging
12. Document Revision History for External Memory Interfaces (EMIF) IP User Guide

7.2.3.1. General Guidelines

Observe the following general guidelines when placing pins for your Intel® Agilex™ 5 external memory interface.

  1. Ensure that the pins of a single external memory interface reside on the same edge I/O.
  2. The LPDDR4 x32 or 2x16 implementation should be confined within the same I/O bank.
  3. Two different external memory interfaces cannot share a sub-bank.
  4. The address and command pins and their associated clock pins in the address and command bank must follow a fixed pin-out scheme, as defined in the table in the Address and Command Pin Placement for LPDDR4 topic.
  5. Not every byte lane can function as an address and command lane or a data lane. The pin assignment must adhere to the LPDDR4 data width mapping defined in the Pin Placement for Agilex™ 5 FPGA EMIF IP for LPDDR4 topic.
  6. Any pin in the same bank that is not used by an external memory interface may not be available for use as a general purpose I/O pin:
    • For fabric EMIF, unused pins in an I/O lane assigned to an EMIF interface cannot be used as general-purpose I/O pins. In the same sub-bank, pins in an I/O lane that is not assigned to an EMIF interface, can be used as general-purpose I/O pins.
    • For HPS EMIF, unused pins in an I/O lane assigned to an EMIF interface cannot be used as general-purpose I/O pins. Pins in any lane in the same IO96 bank that are not assigned to an EMIF interface cannot be used as general-purpose I/O pins either.
  7. All address and command pins and their associated clock pins (CK_T and CK_C) must reside within a single sub-bank. The sub-bank containing the address and command pins is identified as the address and command sub-bank.
  8. The address and command pins and their associated clock pins in the address and command bank must follow a fixed pin-out scheme, as defined in the LPDDR4 Pin Placement table in the Pin Placement topic in the Product Architecture chapter.
  9. The address and command for LPDDR4 would utilize 2 IO lanes in the sub-bank. The 2 unused I/O lane in the address and command sub-bank would serve to implement data groups. The data groups must be from the same controller as the address and command signals.
  10. An I/O lane must not be used by both address and command pins and data pins.
  11. Place read data groups according to the DQS grouping in the pin table and Pin Planner. Read data strobes (such as DQS_t and DQS_c) must reside at physical pins capable of functioning as DQS_t and DQS_c for a specific read data group size. You must place the associated read data pins (DQ), within the same group.
  12. One of the sub-banks in the device (typically the sub-bank within corner bank 3A) may not be available if you use certain device configuration schemes. For some schemes, there may be an I/O lane available for EMIF data group.
    • AVST-8 – This is contained entirely within the SDM, therefore all lanes of sub-bank 3A can be used by the external memory interface.
    • AVST-16/AVST-32– Lanes 4, 5, 6, and 7 are all effectively occupied and are not usable by the external memory interface
Note: EMIF IP pin-out requirements for the Intel® Agilex™ 5 hard processor subsystem (HPS) are more restrictive than for a non-HPS memory interface. The HPS EMIF IP defines a fixed pin-out in the Quartus® Prime Pro Edition IP file (.qip), based on the IP configuration.
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