Intel® Cyclone® 10 GX Device Design Guidelines

ID 683703
Date 11/06/2017
Document Table of Contents

Temperature Sensing for Thermal Management

Calculating or measuring the junction temperature is crucial for thermal management. Historically, junction temperature is calculated using ambient or case temperature, junction-to-ambient (ΘJA) or junction to case (ΘJC) thermal resistance, and the device power consumption. Cyclone® 10 GX devices include a temperature sensing diode (TSD) with embedded analog-to-digital converter (ADC) circuitry, so you do not require an external temperature sensing chip on the board.
Table 9.  Temperature Sensing Checklist
Number Done? Checklist Item
1   Set up the temperature sensing diode in your design to measure the device junction temperature for thermal management.

The Cyclone® 10 GX TSD can self-monitor the device junction temperature and be used with external circuitry for activities such as controlling air flow to the FPGA. You can bypass the ADC if you want to use an external temperature sensor, similar to the solution used for a Stratix II device or other devices.

You must include the TSD circuitry in your design if you want to use it. Ensure you make the correct external pin connections, whether you use both the ADC and TSD, or bypass the ADC and connect the sensing diode to an external temperature sensor.

For more information about these features, refer to the "Power Management in Cyclone® 10 GX Devices" chapter in volume 1 of the Cyclone® 10 GX Core Fabric and General Purpose I/O Handbook.