Agilex™ 7 FPGAs and SoCs Device Overview

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ID 683458
Date 3/18/2025
Public
Document Table of Contents
Document Table of Contents x
1. Overview of the Agilex™ 7 FPGAs and SoCs 2. Agilex™ 7 FPGAs and SoCs Family Plan 3. Second Generation Hyperflex® Core Architecture 4. Adaptive Logic Module in Agilex™ 7 FPGAs and SoCs 5. Internal Embedded Memory in Agilex™ 7 FPGAs and SoCs 6. Variable-Precision DSP in Agilex™ 7 FPGAs and SoCs 7. Core Clock Network in Agilex™ 7 FPGAs and SoCs 8. General Purpose I/Os in Agilex™ 7 FPGAs and SoCs 9. I/O PLLs in Agilex™ 7 FPGAs and SoCs 10. External Memory Interface in Agilex™ 7 FPGAs and SoCs 11. Hard Processor System in Agilex™ 7 SoCs 12. Heterogeneous 3D SiP Transceivers in Agilex™ 7 FPGAs and SoCs 13. Heterogeneous 3D Stacked HBM2E DRAM Memory in Agilex™ 7 FPGAs and SoCs M-Series 14. High-Performance Crypto Blocks in Agilex™ 7 FPGAs and SoCs F-Series and I-Series 15. Configuration via Protocol Using PCIe* for Agilex™ 7 FPGAs and SoCs 16. Device Configuration and the SDM in Agilex™ 7 FPGAs and SoCs 17. Partial and Dynamic Configuration of Agilex™ 7 FPGAs and SoCs 18. Device Security for Agilex™ 7 FPGAs and SoCs 19. SEU Error Detection and Correction in Agilex™ 7 FPGAs and SoCs 20. Power Management for Agilex™ 7 FPGAs and SoCs 21. Software and Tools for Agilex™ 7 FPGAs and SoCs 22. Revision History for the Agilex™ 7 FPGAs and SoCs Device Overview
1. Overview of the Agilex™ 7 FPGAs and SoCs x
1.1. Key Features and Innovations in Agilex™ 7 FPGAs and SoCs 1.2. Agilex™ 7 FPGAs and SoCs Block Diagram 1.3. Agilex™ 7 FPGAs and SoCs Summary of Features 1.4. Additional Features for Agilex™ 7 SoCs
2. Agilex™ 7 FPGAs and SoCs Family Plan x
2.1. Agilex™ 7 FPGAs and SoCs F-Series 2.2. Agilex™ 7 FPGAs and SoCs I-Series 2.3. Agilex™ 7 FPGAs and SoCs M-Series 2.4. Part Number Decoder
10. External Memory Interface in Agilex™ 7 FPGAs and SoCs x
10.1. External Memory Interface Performance 10.2. Features of the Hard Memory Controller
12. Heterogeneous 3D SiP Transceivers in Agilex™ 7 FPGAs and SoCs x
12.1. E-Tile Transceivers 12.2. P-Tile Transceivers 12.3. F-Tile Transceivers 12.4. R-Tile Transceivers
12.1. E-Tile Transceivers x
12.1.1. PMA Features in E-Tile Transceivers 12.1.2. PCS Features in E-Tile Transceivers
1. Overview of the Agilex™ 7 FPGAs and SoCs
2. Agilex™ 7 FPGAs and SoCs Family Plan
3. Second Generation Hyperflex® Core Architecture
4. Adaptive Logic Module in Agilex™ 7 FPGAs and SoCs
5. Internal Embedded Memory in Agilex™ 7 FPGAs and SoCs
6. Variable-Precision DSP in Agilex™ 7 FPGAs and SoCs
7. Core Clock Network in Agilex™ 7 FPGAs and SoCs
8. General Purpose I/Os in Agilex™ 7 FPGAs and SoCs
9. I/O PLLs in Agilex™ 7 FPGAs and SoCs
10. External Memory Interface in Agilex™ 7 FPGAs and SoCs
11. Hard Processor System in Agilex™ 7 SoCs
12. Heterogeneous 3D SiP Transceivers in Agilex™ 7 FPGAs and SoCs
13. Heterogeneous 3D Stacked HBM2E DRAM Memory in Agilex™ 7 FPGAs and SoCs M-Series
14. High-Performance Crypto Blocks in Agilex™ 7 FPGAs and SoCs F-Series and I-Series
15. Configuration via Protocol Using PCIe* for Agilex™ 7 FPGAs and SoCs
16. Device Configuration and the SDM in Agilex™ 7 FPGAs and SoCs
17. Partial and Dynamic Configuration of Agilex™ 7 FPGAs and SoCs
18. Device Security for Agilex™ 7 FPGAs and SoCs
19. SEU Error Detection and Correction in Agilex™ 7 FPGAs and SoCs
20. Power Management for Agilex™ 7 FPGAs and SoCs
21. Software and Tools for Agilex™ 7 FPGAs and SoCs
22. Revision History for the Agilex™ 7 FPGAs and SoCs Device Overview

1.19. Device Configuration and Secure Device Manager (SDM)

All Intel® Agilex™ devices contain a Secure Device Manager (SDM), which is a dedicated triple-redundant processor that serves as the point of entry into the device for all JTAG and configuration commands. The latest SDM also supports clients wanting to certify their systems to meet the layer 2 standard compliance.33.

The SDM bootstraps the HPS in SoC devices ensuring that the HPS can boot using the same security features that the FPGA devices have.

Figure 15. SDM Block Diagram

During configuration, Intel® Agilex™ devices are divided into logical sectors, each of which is managed by a local sector manager (LSM). The SDM passes configuration data to each of the LSMs across the on-chip configuration network. This allows the sectors to be configured independently, one at a time, or in parallel. This approach achieves simplified sector configuration and reconfiguration, as well as reduced overall configuration time due to the inherent parallelism. The same sector-based approach is used to respond to single-event upsets and security attacks.

While the sectors provide a logical separation for device configuration and reconfiguration, they overlay the normal rows and columns of FPGA logic and routing. This means there is no impact to the Intel® Quartus® Prime software place and route, and no impact to the timing of logic signals that cross the sector boundaries.

The SDM enables robust, secure, fully-authenticated device configuration. It also allows for customization of the configuration scheme, which can enhance device security. For configuration and reconfiguration, this approach offers a variety of advantages:

  • Dedicated secure configuration manager
  • Reduced device configuration time, because sectors are configured in parallel
  • Update-able configuration process
  • Partial Reconfiguration
  • Remote System Update
  • Zeroization of individual sectors or the complete device

The SDM also provides additional capabilities such as register state readback and writeback to support ASIC prototyping and other applications.

33 The following Intel® Agilex™ devices enable system certification to FIPS140-3 compliance: AGF 019, AGF 023, AGF 040, AGI 019, AGI 023, AGI 035, AGI 040, AGM 032, and AGM 039.
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