External Memory Interfaces Agilex™ 7 F-Series and I-Series FPGA IP User Guide

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ID 683216
Date 11/28/2024
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Document Table of Contents
Document Table of Contents x
1. About the External Memory Interfaces Agilex™ 7 F-Series and I-Series FPGA IP 2. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Introduction 3. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Product Architecture 4. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – End-User Signals 5. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Simulating Memory IP 6. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – DDR4 Support 7. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – QDR-IV Support 8. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Timing Closure 9. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – I/O Timing Closure 10. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Controller Optimization 11. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Debugging 12. External Memory Interfaces Agilex™ 7 F-Series and I-Series FPGA IP User Guide Archives 13. Document Revision History for External Memory Interfaces Agilex™ 7 F-Series and I-Series FPGA IP User Guide
1. About the External Memory Interfaces Agilex™ 7 F-Series and I-Series FPGA IP x
1.1. Release Information
2. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Introduction x
2.1. Intel® Agilex™ 7 F-Series and I-Series EMIF IP Protocol and Feature Support 2.2. Intel® Agilex™ 7 F-Series and I-Series EMIF IP Design Flow 2.3. Intel® Agilex™ 7 F-Series and I-Series EMIF IP Design Checklist
3. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Product Architecture x
3.1. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: Introduction 3.2. Intel® Agilex™ 7 F-Series and I-Series EMIF Sequencer 3.3. Intel® Agilex™ 7 F-Series and I-Series EMIF Calibration 3.4. Intel® Agilex™ 7 F-Series and I-Series EMIF Controller 3.5. User-requested Reset in Intel® Agilex™ 7 F-Series and I-Series EMIF IP 3.6. Intel® Agilex™ 7 F-Series and I-Series EMIF for Hard Processor Subsystem 3.7. Using a Custom Controller with the Hard PHY
3.1. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: Introduction x
3.1.1. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: I/O Subsystem 3.1.2. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: I/O SSM 3.1.3. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: I/O Bank 3.1.4. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: I/O Lane 3.1.5. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: Input DQS Clock Tree 3.1.6. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: PHY Clock Tree 3.1.7. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: PLL Reference Clock Networks 3.1.8. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: Clock Phase Alignment
3.1.4. Intel® Agilex™ 7 F-Series and I-Series EMIF Architecture: I/O Lane x
3.1.4.1. Considerations for Designing DDR4 x72 Interface Together with an AVST x8/x16/x32 Configuration Scheme
3.3. Intel® Agilex™ 7 F-Series and I-Series EMIF Calibration x
3.3.1. Intel® Agilex™ 7 F-Series and I-Series Calibration Stages 3.3.2. Intel® Agilex™ 7 F-Series and I-Series Calibration Stages Descriptions 3.3.3. Intel® Agilex™ 7 F-Series and I-Series Calibration Flowchart 3.3.4. Intel® Agilex™ 7 F-Series and I-Series Calibration Algorithms
3.3.4. Intel® Agilex™ 7 F-Series and I-Series Calibration Algorithms x
3.3.4.1. Calibration Algorithms for DDR4 3.3.4.2. Calibration Algorithms for QDR-IV 3.3.4.3. Guidelines for Debugging Calibration Issues
3.3.4.1. Calibration Algorithms for DDR4 x
3.3.4.1.1. DDR4 Read Calibration 3.3.4.1.2. DDR4 Write Calibration
3.3.4.2. Calibration Algorithms for QDR-IV x
3.3.4.2.1. QDR-IV Read Calibration 3.3.4.2.2. QDR-IV Write Calibration
3.3.4.3. Guidelines for Debugging Calibration Issues x
3.3.4.3.1. Debugging Calibration Failure Using Information from the Calibration report 3.3.4.3.2. Debugging Address and Command Leveling Calibration Failure 3.3.4.3.3. Debugging Address and Command Deskew Failure 3.3.4.3.4. Debugging DQS Enable Failure 3.3.4.3.5. Debugging Read Deskew Calibration Failure 3.3.4.3.6. Debugging VREFIN Calibration Failure 3.3.4.3.7. Debugging LFIFO Calibration Failure 3.3.4.3.8. Debugging Write Leveling Failure 3.3.4.3.9. Debugging Write Deskew Calibration Failure 3.3.4.3.10. Debugging VREFOUT Calibration Failure
3.4. Intel® Agilex™ 7 F-Series and I-Series EMIF Controller x
3.4.1. Hard Memory Controller 3.4.2. Intel® Agilex™ 7 F-Series and I-Series Hard Memory Controller Rate Conversion Feature
3.4.1. Hard Memory Controller x
3.4.1.1. Hard Memory Controller Features 3.4.1.2. Hard Memory Controller Main Control Path 3.4.1.3. Data Buffer Controller
3.6. Intel® Agilex™ 7 F-Series and I-Series EMIF for Hard Processor Subsystem x
3.6.1. Restrictions on I/O Bank Usage for Intel® Agilex™ 7 F-Series and I-Series EMIF IP with HPS
4. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – End-User Signals x
4.1. Intel® Agilex™ 7 F-Series and I-Series EMIF IP Interface and Signal Descriptions 4.2. Intel® Agilex™ 7 F-Series and I-Series EMIF IP AFI Signals 4.3. Intel® Agilex™ 7 F-Series and I-Series EMIF IP AFI 4.0 Timing Diagrams 4.4. Intel® Agilex™ 7 F-Series and I-Series EMIF IP Memory Mapped Register (MMR) Tables
4.1. Intel® Agilex™ 7 F-Series and I-Series EMIF IP Interface and Signal Descriptions x
4.1.1. Intel® Agilex™ 7 EMIF IP Interfaces for DDR4 4.1.2. Intel® Agilex™ 7 EMIF IP Interfaces for QDR-IV
4.1.1. Intel® Agilex™ 7 EMIF IP Interfaces for DDR4 x
4.1.1.1. local_reset_req for DDR4 4.1.1.2. local_reset_status for DDR4 4.1.1.3. pll_ref_clk for DDR4 4.1.1.4. pll_locked for DDR4 4.1.1.5. ac_parity_err for DDR4 4.1.1.6. oct for DDR4 4.1.1.7. mem for DDR4 4.1.1.8. status for DDR4 4.1.1.9. afi_reset_n for DDR4 4.1.1.10. afi_clk for DDR4 4.1.1.11. afi_half_clk for DDR4 4.1.1.12. afi for DDR4 4.1.1.13. emif_usr_reset_n for DDR4 4.1.1.14. emif_usr_clk for DDR4 4.1.1.15. ctrl_amm for DDR4 4.1.1.16. ctrl_amm_aux for DDR4 4.1.1.17. ctrl_auto_precharge for DDR4 4.1.1.18. ctrl_user_priority for DDR4 4.1.1.19. ctrl_ecc_user_interrupt for DDR4 4.1.1.20. ctrl_ecc_readdataerror for DDR4 4.1.1.21. ctrl_ecc_status for DDR4 4.1.1.22. ctrl_mmr_slave for DDR4 4.1.1.23. hps_emif for DDR4 4.1.1.24. emif_calbus for DDR4 4.1.1.25. emif_calbus_clk for DDR4
4.1.2. Intel® Agilex™ 7 EMIF IP Interfaces for QDR-IV x
4.1.2.1. local_reset_req for QDR-IV 4.1.2.2. local_reset_status for QDR-IV 4.1.2.3. pll_ref_clk for QDR-IV 4.1.2.4. pll_locked for QDR-IV 4.1.2.5. oct for QDR-IV 4.1.2.6. mem for QDR-IV 4.1.2.7. status for QDR-IV 4.1.2.8. afi_reset_n for QDR-IV 4.1.2.9. afi_clk for QDR-IV 4.1.2.10. afi_half_clk for QDR-IV 4.1.2.11. afi for QDR-IV 4.1.2.12. emif_usr_reset_n for QDR-IV 4.1.2.13. emif_usr_clk for QDR-IV 4.1.2.14. ctrl_amm for QDR-IV 4.1.2.15. emif_calbus for QDR-IV 4.1.2.16. emif_calbus_clk for QDR-IV
4.2. Intel® Agilex™ 7 F-Series and I-Series EMIF IP AFI Signals x
4.2.1. AFI Clock and Reset Signals 4.2.2. AFI Address and Command Signals 4.2.3. AFI Write Data Signals 4.2.4. AFI Read Data Signals 4.2.5. AFI Calibration Status Signals 4.2.6. AFI Tracking Management Signals 4.2.7. AFI Shadow Register Management Signals
4.3. Intel® Agilex™ 7 F-Series and I-Series EMIF IP AFI 4.0 Timing Diagrams x
4.3.1. AFI Address and Command Timing Diagrams 4.3.2. AFI Write Sequence Timing Diagrams 4.3.3. AFI Read Sequence Timing Diagrams 4.3.4. AFI Calibration Status Timing Diagram
4.4. Intel® Agilex™ 7 F-Series and I-Series EMIF IP Memory Mapped Register (MMR) Tables x
4.4.1. ctrlcfg0 4.4.2. ctrlcfg1 4.4.3. dramtiming0 4.4.4. sbcfg1 4.4.5. caltiming0 4.4.6. caltiming1 4.4.7. caltiming2 4.4.8. caltiming3 4.4.9. caltiming4 4.4.10. caltiming9 4.4.11. dramaddrw 4.4.12. sideband0 4.4.13. sideband1 4.4.14. sideband4 4.4.15. sideband6 4.4.16. sideband7 4.4.17. sideband9 4.4.18. sideband11 4.4.19. sideband12 4.4.20. sideband13 4.4.21. sideband14 4.4.22. dramsts 4.4.23. niosreserve0 4.4.24. niosreserve1 4.4.25. sideband16 4.4.26. ecc3: ECC Error and Interrupt Configuration 4.4.27. ecc4: Status and Error Information 4.4.28. ecc5: Address of Most Recent SBE/DBE 4.4.29. ecc6: Address of Most Recent Correction Command Dropped 4.4.30. ecc7: Extension for Address of Most Recent SBE/DBE 4.4.31. ecc8: Extension for Address of Most Recent Correction Command Dropped
5. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Simulating Memory IP x
5.1. Simulation Options 5.2. Simulation Walkthrough 5.3. Simulating the Design Example with Mentor Graphics* AXI4 Master BFM ( Intel® FPGA Edition)
5.2. Simulation Walkthrough x
5.2.1. Calibration Modes 5.2.2. Simulation Scripts 5.2.3. Functional Simulation with Verilog HDL 5.2.4. Functional Simulation with VHDL 5.2.5. Simulating the Design Example
5.3. Simulating the Design Example with Mentor Graphics* AXI4 Master BFM ( Intel® FPGA Edition) x
5.3.1. Overview of Steps 5.3.2. Generating the EMIF Design Example 5.3.3. Editing the Simulation Design Example with the Platform Designer 5.3.4. Editing the ed_sim.v File 5.3.5. Obtaining the master_test_program.sv File 5.3.6. Running the Simulation
6. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – DDR4 Support x
6.1. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Parameter Descriptions 6.2. Intel® Agilex™ 7 F-Series and I-Series External Memory Interfaces Intel® Calibration IP Parameters 6.3. Register Map IP-XACT Support for Intel® Agilex™ 7 F-Series and I-Series EMIF DDR4 IP 6.4. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Pin and Resource Planning 6.5. DDR4 Board Design Guidelines
6.1. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Parameter Descriptions x
6.1.1. Intel® Agilex™ 7 F-Series and I-Series EMIF IP DDR4 Parameters: General 6.1.2. Intel® Agilex™ 7 F-Series and I-Series EMIF IP DDR4 Parameters: Memory 6.1.3. Intel® Agilex™ 7 F-Series and I-Series EMIF IP DDR4 Parameters: Mem I/O 6.1.4. Intel® Agilex™ 7 F-Series and I-Series EMIF IP DDR4 Parameters: FPGA I/O 6.1.5. Intel® Agilex™ 7 F-Series and I-Series EMIF IP DDR4 Parameters: Mem Timing 6.1.6. Intel® Agilex™ 7 F-Series and I-Series EMIF IP DDR4 Parameters: Controller 6.1.7. Intel® Agilex™ 7 F-Series and I-Series EMIF IP DDR4 Parameters: Diagnostics 6.1.8. Intel® Agilex™ 7 F-Series and I-Series EMIF IP DDR4 Parameters: Example Designs
6.4. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Pin and Resource Planning x
6.4.1. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Interface Pins 6.4.2. Intel® Agilex™ 7 FPGA EMIF IP Resources 6.4.3. Pin Guidelines for Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP
6.4.1. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Interface Pins x
6.4.1.1. Estimating Pin Requirements 6.4.1.2. DIMM Options 6.4.1.3. Maximum Number of Interfaces
6.4.2. Intel® Agilex™ 7 FPGA EMIF IP Resources x
6.4.2.1. OCT 6.4.2.2. PLL
6.4.3. Pin Guidelines for Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP x
6.4.3.1. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Banks 6.4.3.2. General Guidelines 6.4.3.3. x4 DIMM Implementation 6.4.3.4. Specific Pin Connection Requirements 6.4.3.5. Command and Address Signals 6.4.3.6. Clock Signals 6.4.3.7. Data, Data Strobes, DM/DBI, and Optional ECC Signals
6.5. DDR4 Board Design Guidelines x
6.5.1. Terminations for DDR4 with Intel® Agilex™ 7 F-Series and I-Series Devices 6.5.2. Clamshell Topology 6.5.3. General Layout Routing Guidelines 6.5.4. Reference Stackup 6.5.5. Intel® Agilex™ 7 F-Series and I-Series EMIF-Specific Routing Guidelines for Various DDR4 Topologies 6.5.6. DDR4 Routing Guidelines: Discrete (Component) Topologies 6.5.7. Intel® Agilex™ 7 F-Series and I-Series EMIF Pin Swapping Guidelines DDR4 interface x 8 data lane DDR4 interface x 4 data lane DDR4 interface x 4 or x8 A/C and CLK lane
6.5.1. Terminations for DDR4 with Intel® Agilex™ 7 F-Series and I-Series Devices x
6.5.1.1. Dynamic On-Chip Termination (OCT) 6.5.1.2. Dynamic On-Die Termination (ODT) in DDR4 6.5.1.3. Choosing Terminations on Intel® Agilex™ 7 F-Series and I-Series FPGA Devices 6.5.1.4. On-Chip Termination Recommendations for Intel® Agilex™ 7 F-Series and I-Series FPGA Devices
6.5.5. Intel® Agilex™ 7 F-Series and I-Series EMIF-Specific Routing Guidelines for Various DDR4 Topologies x
6.5.5.1. One DIMM per Channel (1DPC) for UDIMM, RDIMM, LRDIMM, and SODIMM DDR4 Topologies 6.5.5.2. Two DIMMs per Channel (2DPC) for UDIMM, RDIMM, and LRDIMM DDR4 Topologies 6.5.5.3. Two DIMMs per Channel (2DPC) for SODIMM Topology 6.5.5.4. Skew Matching Guidelines for DIMM Configurations 6.5.5.5. Power Delivery Recommendations for the Memory / DIMM Side
6.5.6. DDR4 Routing Guidelines: Discrete (Component) Topologies x
6.5.6.1. Single Rank x 8 Discrete (Component) Topology 6.5.6.2. Single Rank x 16 Discrete (Component) Topology 6.5.6.3. ADDR/CMD Reference Voltage/RESET Signal Routing Guidelines for Single Rank x 8 and R Rank x 16 Discrete (Component) Topologies 6.5.6.4. Skew Matching Guidelines for DDR4 Discrete Configurations 6.5.6.5. Power Delivery Recommendations for DDR4 Discrete Configurations
7. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – QDR-IV Support x
7.1. Intel® Agilex™ 7 FPGA EMIF IP Parameter Descriptions 7.2. Intel® Agilex™ 7 F-Series and I-Series External Memory Interfaces Intel® Calibration IP Parameters 7.3. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Pin and Resource Planning 7.4. QDR-IV Board Design Guidelines
7.1. Intel® Agilex™ 7 FPGA EMIF IP Parameter Descriptions x
7.1.1. Intel® Agilex™ 7 F-Series and I-Series EMIF IP QDR-IV Parameters: General 7.1.2. Intel® Agilex™ 7 F-Series and I-Series EMIF IP QDR-IV Parameters: Memory 7.1.3. Intel® Agilex™ 7 F-Series and I-Series EMIF IP QDR-IV Parameters: FPGA I/O 7.1.4. Intel® Agilex™ 7 F-Series and I-Series EMIF IP QDR-IV Parameters: Mem Timing 7.1.5. Intel® Agilex™ 7 F-Series and I-Series EMIF IP QDR-IV Parameters: Controller 7.1.6. Intel® Agilex™ 7 F-Series and I-Series EMIF IP QDR-IV Parameters: Diagnostics 7.1.7. Intel® Agilex™ 7 F-Series and I-Series EMIF IP QDR-IV Parameters: Example Designs
7.3. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Pin and Resource Planning x
7.3.1. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Interface Pins 7.3.2. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Resources 7.3.3. Pin Guidelines for Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP
7.3.1. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Interface Pins x
7.3.1.1. Estimating Pin Requirements 7.3.1.2. Maximum Number of Interfaces
7.3.2. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Resources x
7.3.2.1. OCT 7.3.2.2. PLL
7.3.3. Pin Guidelines for Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP x
7.3.3.1. Intel® Agilex™ 7 F-Series and I-Series FPGA EMIF IP Banks 7.3.3.2. General Guidelines 7.3.3.3. QDR IV SRAM Commands and Addresses, AP, and AINV Signals 7.3.3.4. QDR IV SRAM Clock Signals 7.3.3.5. QDR IV SRAM Data, DINV, and QVLD Signals 7.3.3.6. Specific Pin Connection Requirements 7.3.3.7. Resource Sharing Guidelines (Multiple Interfaces)
7.4. QDR-IV Board Design Guidelines x
7.4.1. General Layout Routing Guidelines 7.4.2. Reference Stackup 7.4.3. Routing Guidelines for QDR-IV Topology 7.4.4. Intel® Agilex™ 7 EMIF Design Guideline Summary
7.4.3. Routing Guidelines for QDR-IV Topology x
7.4.3.1. QDR-IV Single Device Memory Topology 7.4.3.2. Skew Matching Guidelines for QDR-IV Configurations 7.4.3.3. Power Delivery Recommendation for QDR-IV Configurations
8. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Timing Closure x
8.1. Timing Closure 8.2. Optimizing Timing
8.1. Timing Closure x
8.1.1. Timing Analysis
8.1.1. Timing Analysis x
8.1.1.1. PHY or Core
9. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – I/O Timing Closure x
9.1. I/O Timing Closure Overview 9.2. Collateral Generated with Your EMIF IP 9.3. SPICE Decks 9.4. File Organization 9.5. Top-level Parameterization File 9.6. IP-Supplied Parameters that You Might Need to Override 9.7. Understanding the *_ip_parameters.dat File and Making a Mask Polygon 9.8. Multi-Rank Topology 9.9. Pin Parasitics 9.10. Mask Evaluation
9.3. SPICE Decks x
9.3.1. Address/Command Simulation Deck 9.3.2. FPGA Write Operation Simulation Deck 9.3.3. FPGA Read Operation Simulation Deck
10. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Controller Optimization x
10.1. Interface Standard 10.2. Bank Management Efficiency 10.3. Data Transfer 10.4. Improving Controller Efficiency
10.4. Improving Controller Efficiency x
10.4.1. Auto-Precharge Commands 10.4.2. Additive Latency 10.4.3. Bank Interleaving 10.4.4. Additive Latency and Bank Interleaving 10.4.5. User-Controlled Refresh 10.4.6. Frequency of Operation 10.4.7. Series of Reads or Writes 10.4.8. Data Reordering 10.4.9. Starvation Control 10.4.10. Command Reordering 10.4.11. Bandwidth 10.4.12. Enable Command Priority Control 10.4.13. Controller Pre-pay and Post-pay Refresh (DDR4 Only)
10.4.1. Auto-Precharge Commands x
10.4.1.1. Using Auto-precharge to Achieve Highest Memory Bandwidth for DDR4 Interfaces
11. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Debugging x
11.1. Interface Configuration Performance Issues 11.2. Functional Issue Evaluation 11.3. Timing Issue Characteristics 11.4. Verifying Memory IP Using the Signal Tap Logic Analyzer 11.5. Hardware Debugging Guidelines 11.6. Categorizing Hardware Issues 11.7. Debugging with the External Memory Interface Debug Toolkit 11.8. Using the Default Traffic Generator 11.9. Using the Configurable Traffic Generator (TG2) 11.10. EMIF On-Chip Debug Port 11.11. Efficiency Monitor
11.1. Interface Configuration Performance Issues x
11.1.1. Interface Configuration Bottleneck and Efficiency Issues
11.2. Functional Issue Evaluation x
11.2.1. Intel® IP Memory Model 11.2.2. Vendor Memory Model 11.2.3. Transcript Window Messages 11.2.4. Modifying the Example Driver to Replicate the Failure
11.3. Timing Issue Characteristics x
11.3.1. Evaluating FPGA Timing Issues 11.3.2. Evaluating External Memory Interface Timing Issues
11.4. Verifying Memory IP Using the Signal Tap Logic Analyzer x
11.4.1. Signals to Monitor with the Signal Tap Logic Analyzer
11.5. Hardware Debugging Guidelines x
11.5.1. Create a Simplified Design that Demonstrates the Same Issue 11.5.2. Measure Power Distribution Network 11.5.3. Measure Signal Integrity and Setup and Hold Margin 11.5.4. Vary Voltage 11.5.5. Operate at a Lower Speed 11.5.6. Determine Whether the Issue Exists in Previous Versions of Software 11.5.7. Determine Whether the Issue Exists in the Current Version of Software 11.5.8. Try A Different PCB 11.5.9. Try Other Configurations 11.5.10. Debugging Checklist
11.6. Categorizing Hardware Issues x
11.6.1. Signal Integrity Issues 11.6.2. Hardware and Calibration Issues
11.6.1. Signal Integrity Issues x
11.6.1.1. Characteristics of Signal Integrity Issues 11.6.1.2. Evaluating Signal Integrity Issues
11.6.1.2. Evaluating Signal Integrity Issues x
11.6.1.2.1. Skew 11.6.1.2.2. Crosstalk 11.6.1.2.3. Power System 11.6.1.2.4. Clock Signals 11.6.1.2.5. Address and Command Signals 11.6.1.2.6. Read Data Valid Window and Eye Diagram 11.6.1.2.7. Write Data Valid Window and Eye Diagram 11.6.1.2.8. OCT and ODT Usage
11.6.2. Hardware and Calibration Issues x
11.6.2.1. Postamble Timing Issues and Margin 11.6.2.2. Intermittent Issue Evaluation 11.6.2.3. Memory Timing Parameter Evaluation 11.6.2.4. Verify that the Board Has the Correct Memory Component or DIMM Installed
11.7. Debugging with the External Memory Interface Debug Toolkit x
11.7.1. Prerequisites for Using the EMIF Debug Toolkit 11.7.2. Configuring a Design to Use the Toolkit 11.7.3. Launching the EMIF Debug Toolkit 11.7.4. Using the EMIF Debug Toolkit 11.7.5. Exporting Tables 11.7.6. Viewing Reports Graphically in the Eye Viewer
11.7.2. Configuring a Design to Use the Toolkit x
11.7.2.1. Generating a Design Example with the Debug Toolkit 11.7.2.2. Creating a Design Example with Multiple External Memory Interfaces 11.7.2.3. Enabling the EMIF Toolkit in an Existing Design
11.7.4. Using the EMIF Debug Toolkit x
11.7.4.1. Memory Configuration Tab 11.7.4.2. Calibration Tab 11.7.4.3. Guidelines for Debugging Calibration Issues 11.7.4.4. Calibration Report Tab 11.7.4.5. Calibrate Termination Tab 11.7.4.6. Vref Margining Tab 11.7.4.7. Driver Margining Tab 11.7.4.8. ISSPs Tab 11.7.4.9. Pin Delay Settings Tab
11.7.4.2. Calibration Tab x
11.7.4.2.1. Rerunning Calibration 11.7.4.2.2. Rerunning the Traffic Generator
11.7.4.3. Guidelines for Debugging Calibration Issues x
11.7.4.3.1. Debugging Calibration Failure Using Information from the Calibration report 11.7.4.3.2. Debugging Address and Command Leveling Calibration Failure 11.7.4.3.3. Debugging Address and Command Deskew Failure 11.7.4.3.4. Debugging DQS Enable Failure 11.7.4.3.5. Debugging Read Deskew Calibration Failure 11.7.4.3.6. Debugging VREFIN Calibration Failure 11.7.4.3.7. Debugging LFIFO Calibration Failure 11.7.4.3.8. Debugging Write Leveling Failure 11.7.4.3.9. Debugging Write Deskew Calibration Failure 11.7.4.3.10. Debugging VREFOUT Calibration Failure
11.8. Using the Default Traffic Generator x
11.8.1. Reading the Default Traffic Generator Status 11.8.2. Running Infinite Traffic using the Default Traffic Generator 11.8.3. Changing the Reset Trigger of the Default Traffic Generator 11.8.4. Observing Generated Traffic with Signal Tap
11.9. Using the Configurable Traffic Generator (TG2) x
11.9.1. Enabling the Traffic Generator in a Design Example 11.9.2. Traffic Generator Block Description 11.9.3. Default Traffic Pattern 11.9.4. Configuration and Status Registers 11.9.5. User Pattern 11.9.6. Traffic Generator Status 11.9.7. Starting Traffic with the Traffic Generator 11.9.8. Traffic Generator Configuration User Interface
11.9.5. User Pattern x
11.9.5.1. Test Duration / Instruction pattern 11.9.5.2. Address Pattern 11.9.5.3. Data Pattern and Byte Enable
11.9.5.2. Address Pattern x
11.9.5.2.1. Address Generator Modes 11.9.5.2.2. Address Generator MSB Indices 11.9.5.2.3. Address Generator Effective Width 11.9.5.2.4. Address Generator Relative Frequencies 11.9.5.2.5. Address Pattern Examples - Basic Mode 11.9.5.2.6. Address Pattern Examples - Advanced Mode
11.9.8. Traffic Generator Configuration User Interface x
11.9.8.1. Connecting the Traffic Generator 11.9.8.2. Claiming/Releasing the TG Config Interface 11.9.8.3. Configuring the Traffic Generator 11.9.8.4. Traffic Generator Preset Selection 11.9.8.5. Traffic Generator Status Report 11.9.8.6. Examples of Configuring the TG2 Traffic Generator
11.10. EMIF On-Chip Debug Port x
11.10.1. Enabling the On-Chip Debug Port 11.10.2. I/O SSM calbus Bridge Data Structures and Usage 11.10.3. I/O SSM User-RAM Data Structures and Usage 11.10.4. Debug Interface Structure 11.10.5. Example: Reading Calibration Results and Margins with the On-Chip Debug Port
11.10.3. I/O SSM User-RAM Data Structures and Usage x
11.10.3.1. Parameter Tables 11.10.3.2. Parameter Table Enums
11.10.3.1. Parameter Tables x
11.10.3.1.1. Global Parameter Table 11.10.3.1.2. Per-interface Parameter Table Structure 11.10.3.1.3. Parameter Table Arrays
11.10.4. Debug Interface Structure x
11.10.4.1. Debug Data Structures 11.10.4.2. Debug Enums
11.11. Efficiency Monitor x
11.11.1. Enabling the Efficiency Monitor in a Design Example 11.11.2. Efficiency Monitor Block Descriptions 11.11.3. Control and Status Registers 11.11.4. Opening the Efficiency Monitor Toolkit
1. About the External Memory Interfaces Agilex™ 7 F-Series and I-Series FPGA IP
2. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Introduction
3. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Product Architecture
4. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – End-User Signals
5. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Simulating Memory IP
6. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – DDR4 Support
7. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – QDR-IV Support
8. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Timing Closure
9. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – I/O Timing Closure
10. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Controller Optimization
11. Agilex™ 7 F-Series and I-Series FPGA EMIF IP – Debugging
12. External Memory Interfaces Agilex™ 7 F-Series and I-Series FPGA IP User Guide Archives
13. Document Revision History for External Memory Interfaces Agilex™ 7 F-Series and I-Series FPGA IP User Guide

6.5.7. Intel® Agilex™ 7 F-Series and I-Series EMIF Pin Swapping Guidelines

In Intel® Agilex™ 7 F-Series and I-Series devices, EMIF pin swapping is allowed under certain conditions.

An IO12 lane in an EMIF data byte includes 12 signal pins (pins 0,1,2,3,4,5,6,7,8,9,10,11) at the package level. These 12 x I/O pins are arranged into 6 groups of 2 pins each, called pairs (pair 0 for pins 0/1, pair 1 for pins 2/3, pair 2 for pins 4/5, pair 3 for pins 6/7, pair 4 for pins 8/9, and pair 5 for pins 10/11).

DDR4 interface x 8 data lane

The following are EMIF I/O pin swapping restrictions applicable to a DDR4 interface ×8 data lane:

  • One-byte data lane must be assigned for each IO12 lane, where the byte lane covers DQ [0:7], DQSp/DQSn and DBIn.
  • DQSp must go to pin 4 in IO12 pins.
  • DQSn must go to pin 5 in IO12 pins.
  • DBIn must go to pin 6 in IO12 pins. If the interface does not use the DBIn pin, this pin 6 in IO12 lane must remain unconnected.
  • Pin 7 in IO12 lane remains unconnected. Intel® recommends that you connect this pin 7 to the TDQS dummy load of the memory component and route it as a differential trace along with DBIn (pin 6). This facilitates ×4 or ×8 data interoperability in DIMMs configuration.
  • You can connect data byte (DQ [0:7]) to any pins [0,1,2,3,8,9,10,11] in IO12 lane. Any permutation within selected pins is permitted.

DDR4 interface x 4 data lane

Intel® Agilex™ 7 F-Series and I-Series devices allow you to swap data pins within memory interfaces under certain conditions to simplify PCB routing. This table lists the swapping rules for DDR4 x4 and x8 interfaces. (Note that the rules for pin swapping for Intel® Agilex™ 7 F-Series and I-Series devices are stricter than the rules for previous 10-series device families.)

An IO12 lane in an external memory interface consists of 12 signal pins, denoted 0-11. For DDR4 x8 interfaces, two pins are reserved for DQS-P and DQS-N signals, one pin is reserved for the optional DM/DBI signal, one pin must be reserved, and the remaining eight pins are for DQ signals. The following table lists the supported pin functionality and the groups of pins that may be swapped amongst each other. Pins belonging to the same swap group may be freely interchanged with each other.

Table 118.  
Pin Index within IO12 DDR4 x8 Data Lane Function Swap Considerations
0 DQ Pin Swap Group “A”
1 DQ Pin Swap Group “A”
2 DQ Pin Swap Group “A”
3 DQ Pin Swap Group “A”
4 DQS-P Pin Fixed Location (not swappable)
5 DQS-N Pin Fixed Location (not swappable)
6 DM/DBI Pin Fixed Location (not swappable)
7 Unused Fixed Location (not swappable)
8 DQ Pin Swap Group “A”
9 DQ Pin Swap Group “A”
10 DQ Pin Swap Group “A”
11 DQ Pin Swap Group “A”

For DDR4 x4 interfaces, two nibbles must be packed into the same IO12 lane. Four pins are reserved for DQS-P and DQS-N signals and the remaining eight pins are used to implement the DQ signals. The IO12 lane is divided into upper and lower halves to accommodate each nibble. Signals belonging to one nibble cannot be swapped with signals belonging to the other nibble. DQ signals within a nibble swap group may be swapped with each other. Entire nibbles—that is, nibble 0 and nibble 1—may also be swapped with each other provided the DQS pin functionality transfers to the correct pin locations. However, this process is not recommended for JEDEC-compliant DIMM interfaces, as it prohibits the interoperability between DIMMs constructed with x4 components and DIMMs constructed with x8 components as described in x4 DIMM Implementation .

The following table lists the supported pin functionality in x4 mode and the pins that may be swapped with each other.

Table 119.  
Pin Index within IO12 DDR4 x4 Data Lane Function Swap Considerations
0 DQ Pin (lower nibble) Swap Group “A” Nibble 0
1 DQ Pin (lower nibble) Swap Group “A”
2 DQ Pin (lower nibble) Swap Group “A”
3 DQ Pin (lower nibble) Swap Group “A”
4 DQS-P Pin (lower nibble) Fixed Location (not swappable)
5 DQS-N Pin (lower nibble) Fixed Location (not swappable)
6 DQS-P Pin (upper nibble) Fixed Location (not swappable) Nibble 1
7 DQS-N Pin (upper nibble) Fixed Location (not swappable)
8 DQ Pin (upper nibble) Swap Group “B”
9 DQ Pin (upper nibble) Swap Group “B”
10 DQ Pin (upper nibble) Swap Group “B”
11 DQ Pin (upper nibble) Swap Group “B”
  • Nibble 1 must correspond to DQS[17:9] on a physical JEDEC-compliant DIMM for x4/x8 interoperability.
  • Nibbles 0 and 1 must follow the same skew matching rules among all 12 signals in the IO12 lane as are specified for a x8-based DQS group.
Note:
  • Although the current version of the Quartus® Prime software may not enforce all of the rules listed in the above table, be aware that all of these rules may be enforced in later versions of the software.
  • At present, the Quartus® Prime software checks the following:
    • Address and command pin placement, per the Intel® Agilex™ 7 F-Series and I-Series External Memory Interface Pin Information file, which is available here: Pin-Out Files for Intel FPGA Devices.
    • For x8, the Quartus® Prime software checks the following:
      • DQS p/n are on pin index 4 and pin index 5 in an I/O lane.
      • DM/DBI is on pin index 6.
      • DQ[x] are on pin indices [11:8] and [3:0].
    • For x4, the Quartus® Prime software checks the following:
      • DQS p/n on pin index 4 and pin index 5 and associated DQs are within the corresponding IO12 lane.
      • DQS p/n on pin index 6 and pin index 7 and associated DQs are within the corresponding IO12 lane.
      You are responsible for ensuring that these conditions are met.
  • The Quartus® Prime software does not currently check whether DQ pins associated with the lower nibble DQS are actually placed in pin[3:0] or whether DQ pins associated with the upper nibble DQS are actually placed in pin[11:8].

DDR4 interface x 4 or x8 A/C and CLK lane

Address and command and control signals in a bank cannot be swapped.

CLKp/n bits (the p and n lanes) and DQS bits cannot be swapped with each other.

Level Two Title