External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP User Guide

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ID 772538
Date 10/02/2023
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Document Table of Contents
Document Table of Contents x
1. About the External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP 2. Intel Agilex® 7 M-Series FPGA EMIF IP – Introduction 3. Intel Agilex® 7 M-Series FPGA EMIF IP – Product Architecture 4. Intel Agilex® 7 M-Series FPGA EMIF IP – End-User Signals 5. Intel Agilex® 7 M-Series FPGA EMIF IP – Simulating Memory IP 6. Intel Agilex 7 M-Series FPGA EMIF IP – DDR4 Support 7. Intel Agilex® 7 M-Series FPGA EMIF IP – DDR5 Support 8. Intel Agilex 7 M-Series FPGA EMIF IP – LPDDR5 Support 9. Intel Agilex® 7 M-Series FPGA EMIF IP – Timing Closure 10. Intel Agilex® 7 M-Series FPGA EMIF IP – Controller Optimization 11. Intel Agilex® 7 M-Series FPGA EMIF IP – Debugging 12. Document Revision History for External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP User Guide
1. About the External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP x
1.1. Release Information
2. Intel Agilex® 7 M-Series FPGA EMIF IP – Introduction x
2.1. Intel Agilex® 7 M-Series EMIF IP Protocol and Feature Support 2.2. Intel Agilex® 7 M-Series EMIF IP Design Flow 2.3. Intel Agilex® 7 M-Series EMIF IP Design Checklist
3. Intel Agilex® 7 M-Series FPGA EMIF IP – Product Architecture x
3.1. Intel Agilex® 7 M-Series EMIF Architecture: Introduction 3.2. Intel Agilex® 7 M-Series EMIF Sequencer 3.3. Intel Agilex® 7 M-Series EMIF Controller 3.4. Intel Agilex® 7 M-Series EMIF IP for Hard Processor Subsystem (HPS)
3.1. Intel Agilex® 7 M-Series EMIF Architecture: Introduction x
3.1.1. Intel Agilex® 7 M-Series EMIF Architecture: I/O Subsystem 3.1.2. Intel Agilex® 7 M-Series EMIF Architecture: I/O SSM 3.1.3. Intel Agilex® 7 M-Series EMIF Architecture: I/O Bank 3.1.4. Intel Agilex® 7 M-Series EMIF Architecture: I/O Lane 3.1.5. Intel Agilex® 7 M-Series EMIF Architecture: Input DQS Clock Tree 3.1.6. Intel Agilex® 7 M-Series EMIF Architecture: PHY Clock Tree 3.1.7. Intel Agilex® 7 M-Series EMIF Architecture: PLL Reference Clock Networks 3.1.8. Intel Agilex® 7 M-Series EMIF Architecture: Clock Phase Alignment 3.1.9. User Clock in Different Core Access Modes
3.1.3. Intel Agilex® 7 M-Series EMIF Architecture: I/O Bank x
3.1.3.1. Lockstep Configuration 3.1.3.2. DDR4 Pin Placement 3.1.3.3. DDR5 Pin Placement 3.1.3.4. LPDDR5 Pin Placement 3.1.3.5. I/O Sub-Bank Usage
3.2. Intel Agilex® 7 M-Series EMIF Sequencer x
3.2.1. Intel Agilex® 7 M-Series Mailbox Structure and Register Definitions
3.2.1. Intel Agilex® 7 M-Series Mailbox Structure and Register Definitions x
3.2.1.1. Mailbox Supported Commands 3.2.1.2. Mailbox Command Definitions
3.3. Intel Agilex® 7 M-Series EMIF Controller x
3.3.1. Hard Memory Controller
3.3.1. Hard Memory Controller x
3.3.1.1. Hard Memory Controller Features
4. Intel Agilex® 7 M-Series FPGA EMIF IP – End-User Signals x
4.1. Intel Agilex® 7 M-Series FPGA EMIF IP for DDR4 Interfaces 4.2. Intel Agilex® 7 M-Series FPGA EMIF IP for DDR5 Interfaces 4.3. Intel Agilex® 7 M-Series EMIF IP for LPDDR5 Interfaces
4.1. Intel Agilex® 7 M-Series FPGA EMIF IP for DDR4 Interfaces x
4.1.1. ref_clk for EMIF 4.1.2. core_init_n for EMIF 4.1.3. usr_async_clk for EMIF 4.1.4. usr_clk for EMIF 4.1.5. usr_rst_n for EMIF 4.1.6. s0_axi4 for EMIF 4.1.7. mem for EMIF 4.1.8. oct for EMIF 4.1.9. s0_axi4lite_clk for EMIF 4.1.10. s0_axi4lite_rst_n for EMIF 4.1.11. s0_axi4lite for EMIF
4.2. Intel Agilex® 7 M-Series FPGA EMIF IP for DDR5 Interfaces x
4.2.1. ref_clk for EMIF 4.2.2. core_init_n for EMIF 4.2.3. usr_async_clk for EMIF 4.2.4. usr_clk for EMIF 4.2.5. usr_rst_n for EMIF 4.2.6. s0_axi4 for EMIF 4.2.7. mem for EMIF 4.2.8. i3c for EMIF 4.2.9. mem_lbd for EMIF 4.2.10. mem_lbs for EMIF 4.2.11. oct for EMIF 4.2.12. s0_axi4lite_clk for EMIF 4.2.13. s0_axi4lite_rst_n for EMIF 4.2.14. s0_axi4lite for EMIF
4.3. Intel Agilex® 7 M-Series EMIF IP for LPDDR5 Interfaces x
4.3.1. ref_clk for EMIF 4.3.2. core_init_n for EMIF 4.3.3. usr_async_clk for EMIF 4.3.4. usr_clk for EMIF 4.3.5. usr_rst_n for EMIF 4.3.6. s0_axi4 for EMIF 4.3.7. mem for EMIF 4.3.8. oct for EMIF 4.3.9. s0_axi4lite_clk for EMIF 4.3.10. s0_axi4lite_rst_n for EMIF 4.3.11. s0_axi4lite for EMIF
5. Intel Agilex® 7 M-Series FPGA EMIF IP – Simulating Memory IP x
5.1. Simulation Walkthrough
5.1. Simulation Walkthrough x
5.1.1. Calibration 5.1.2. Simulation Scripts 5.1.3. Functional Simulation with Verilog HDL 5.1.4. Simulating the Design Example
6. Intel Agilex 7 M-Series FPGA EMIF IP – DDR4 Support x
6.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for DDR4 6.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning 6.3. DDR4 Board Design Guidelines
6.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for DDR4 x
6.1.1. Intel Agilex® 7 M-Series FPGA EMIF IP Parameter Descriptions for DDR4 Interfaces 6.1.2. Intel Agilex® 7 FPGA EMIF Calibration IP Parameter Descriptions
6.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning x
6.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins 6.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources 6.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP 6.2.4. Pin Placements for Intel Agilex® 7 M-Series FPGA DDR4 EMIF IP
6.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins x
6.2.1.17.2.1.18.2.1.1. Estimating Pin Requirements6.2.1.17.2.1.18.2.1.1. Estimating Pin Requirements6.2.1.17.2.1.18.2.1.1. Estimating Pin Requirements 6.2.1.2. DIMM Options 6.2.1.3. Maximum Number of Interfaces
6.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources x
6.2.2.1. OCT 6.2.2.2. PLL
6.2.4. Pin Placements for Intel Agilex® 7 M-Series FPGA DDR4 EMIF IP x
6.2.4.1. Address and Command Pin Placement for DDR4 6.2.4.2. DDR4 Data Width Mapping 6.2.4.3. General Guidelines - DDR4 6.2.4.4. x4 DIMM Implementation 6.2.4.5. Specific Pin Connection Requirements 6.2.4.6. Command and Address Signals 6.2.4.7. Clock Signals 6.2.4.8. Data, Data Strobes, DM/DBI, and Optional ECC Signals
6.3. DDR4 Board Design Guidelines x
6.3.1. Terminations for DDR4 with Intel Agilex® 7 M-Series Devices 6.3.2. General Layout Routing Guidelines 6.3.3. Reference Stackup 6.3.4. Intel Agilex® 7 M-Series EMIF-Specific Routing Guidelines for Various DDR4 Topologies 6.3.5. DDR4 Routing Guidelines: Discrete (Component) Topologies
6.3.1. Terminations for DDR4 with Intel Agilex® 7 M-Series Devices x
6.3.1.1. Dynamic On-Chip Termination (OCT) 6.3.1.2. Dynamic On-Die Termination (ODT) in DDR4 6.3.1.3. Choosing Terminations on Intel Agilex® 7 M-Series FPGA Devices 6.3.1.4. On-Chip Termination Recommendations for Intel Agilex® 7 M-Series FPGA Devices
6.3.4. Intel Agilex® 7 M-Series EMIF-Specific Routing Guidelines for Various DDR4 Topologies x
6.3.4.1. One DIMM per Channel (1DPC) for UDIMM, RDIMM, and SODIMM DDR4 Topologies 6.3.4.2. Skew Matching Guidelines for DIMM Configurations 6.3.4.3. Power Delivery Recommendations for the Memory / DIMM Side
6.3.5. DDR4 Routing Guidelines: Discrete (Component) Topologies x
6.3.5.1. Single Rank x 8 Discrete (Component) Topology 6.3.5.2. Single Rank x 16 Discrete (Component) Topology 6.3.5.3. ADDR/CMD Reference Voltage/RESET Signal Routing Guidelines for Single Rank x 8 and Single Rank x 16 Discrete (Component) Topologies 6.3.5.4. Skew Matching Guidelines for DDR4 Discrete Configurations 6.3.5.5. Power Delivery Recommendations for DDR4 Discrete Configurations 6.3.5.6. Intel Agilex® 7 M-Series EMIF Pin Swapping Guidelines
6.3.5.6. Intel Agilex® 7 M-Series EMIF Pin Swapping Guidelines x
6.3.5.6.1. DDR4 Byte Lane Swapping 6.3.5.6.2. DDR4 Address and Command and CLK Lane 6.3.5.6.3. DDR4 Interface x8 Data Lane 6.3.5.6.4. DDR4 Interface x4 Data Lane 6.3.5.6.5. Pin Swizzling
7. Intel Agilex® 7 M-Series FPGA EMIF IP – DDR5 Support x
7.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for DDR5 7.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning 7.3. DDR5 Board Design Guidelines
7.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for DDR5 x
7.1.1. Intel Agilex® 7 M-Series FPGA EMIF IP Parameter Descriptions for DDR5 Interfaces 7.1.2. Intel Agilex® 7 FPGA EMIF Calibration IP Parameter Descriptions
7.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning x
7.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins 7.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources 7.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP 7.2.4. Pin Placements for Intel Agilex 7 M-Series FPGA DDR5 EMIF IP 7.2.5. Intel Agilex® 7 M-Series EMIF Pin Swapping Guidelines
7.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins x
6.2.1.17.2.1.18.2.1.1. Estimating Pin Requirements6.2.1.17.2.1.18.2.1.1. Estimating Pin Requirements6.2.1.17.2.1.18.2.1.1. Estimating Pin Requirements 7.2.1.2. DIMM Options 7.2.1.3. Maximum Number of Interfaces
7.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources x
7.2.2.1. OCT 7.2.2.2. PLL
7.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP x
7.2.3.1. General Guidelines - DDR5 7.2.3.2. x4 DIMM Implementation 7.2.3.3. Specific Pin Connection Requirements 7.2.3.4. Command and Address Signals 7.2.3.5. Clock Signals 7.2.3.6. Data, Data Strobes, DM, and Optional ECC Signals
7.2.4. Pin Placements for Intel Agilex 7 M-Series FPGA DDR5 EMIF IP x
7.2.4.1. Address and Command Pin Placement for DDR5 7.2.4.2. DDR5 Data Width Mapping
7.2.5. Intel Agilex® 7 M-Series EMIF Pin Swapping Guidelines x
7.2.5.1. DDR5 Byte Lane Swapping 7.2.5.2. DDR5 Address and Command and CLK Lane 7.2.5.3. DDR5 Interface x8 Data Lane 7.2.5.4. DDR5 Interface x4 Data Lane 7.2.5.5. Pin Swizzling
7.3. DDR5 Board Design Guidelines x
7.3.1. PCB Stack-up and Design Considerations 7.3.2. General Design Considerations 7.3.3. DDR Differential Signals Routing 7.3.4. Ground Plane and Return Path 7.3.5. RDIMM, UDIMM, and SODIMM Break-in Layout Guidelines 7.3.6. DRAM Break-in Layout Guidelines 7.3.7. DDR5 PCB Layout Guidelines 7.3.8. DDR5 Simulation Strategy
7.3.7. DDR5 PCB Layout Guidelines x
7.3.7.1. DDR5 Discrete Component/Memory Down Topology: up to 40-Bit Interface (1 Rank x8 or x16, 2 Rank x8 or x16) 7.3.7.2. Routing Guidelines for DDR5 Memory Down: 1 Rank or 2 Rank (x8 bit or x16 bit) Configurations 7.3.7.3. Routing Guidelines for DDR5 RDIMM, UDIMM, SODIMM and LRDIMM Configurations 7.3.7.4. Example of a DDR5 layout on Intel FPGA Platform Board
8. Intel Agilex 7 M-Series FPGA EMIF IP – LPDDR5 Support x
8.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for LPDDR5 8.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning 8.3. LPDDR5 Board Design Guidelines
8.1. Intel Agilex 7 M-Series FPGA EMIF IP Parameters for LPDDR5 x
8.1.1. Intel Agilex® 7 M-Series FPGA EMIF IP Parameter Descriptions for LPDDR5 Interfaces 8.1.2. Intel Agilex® 7 FPGA EMIF Calibration IP Parameter Descriptions
8.2. Intel Agilex® 7 M-Series FPGA EMIF IP Pin and Resource Planning x
8.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins 8.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources 8.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP 8.2.4. Pin Placements for Intel Agilex 7 M-Series FPGA LPDDR5 EMIF IP
8.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins x
6.2.1.17.2.1.18.2.1.1. Estimating Pin Requirements6.2.1.17.2.1.18.2.1.1. Estimating Pin Requirements6.2.1.17.2.1.18.2.1.1. Estimating Pin Requirements 8.2.1.2. DIMM Options 8.2.1.3. Maximum Number of Interfaces
8.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources x
8.2.2.1. OCT 8.2.2.2. PLL
8.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP x
8.2.3.1. General Guidelines - LPDDR5 8.2.3.2. Specific Pin Connection Requirements 8.2.3.3. Command and Address Signals 8.2.3.4. Clock Signals
8.2.4. Pin Placements for Intel Agilex 7 M-Series FPGA LPDDR5 EMIF IP x
8.2.4.1. Address and Command Pin Placement for LPDDR5 8.2.4.2. LPDDR5 Data Width Mapping
8.3. LPDDR5 Board Design Guidelines x
8.3.1. PCB Stack-up and Design Considerations 8.3.2. General Design Considerations 8.3.3. DDR Differential Signals Routing 8.3.4. Ground Plane and Return Path 8.3.5. DRAM Break-in Layout Guidelines 8.3.6. LPDDR5 PCB Layout Guidelines 8.3.7. LPDDR5 Simulation Strategy
8.3.6. LPDDR5 PCB Layout Guidelines x
8.3.6.1. LPDDR5 Discrete Component/Memory Down Topology (1 Rank or 2 Rank, up to 64 Bit Interface) 8.3.6.2. Supported LPDDR5 Topologies 8.3.6.3. Example of an LPDDR5 Layout on an Intel® FPGA Platform Board
9. Intel Agilex® 7 M-Series FPGA EMIF IP – Timing Closure x
9.1. Timing Closure 9.2. Optimizing Timing
9.1. Timing Closure x
9.1.1. Timing Analysis
9.1.1. Timing Analysis x
9.1.1.1. PHY or Core
10. Intel Agilex® 7 M-Series FPGA EMIF IP – Controller Optimization x
10.1. Interface Standard 10.2. Bank Management Efficiency 10.3. Data Transfer 10.4. Improving Controller Efficiency
10.4. Improving Controller Efficiency x
10.4.1. Frequency of Operation 10.4.2. Series of Reads or Writes
11. Intel Agilex® 7 M-Series FPGA EMIF IP – Debugging x
11.1. Interface Configuration Performance Issues 11.2. Functional Issue Evaluation 11.3. Timing Issue Characteristics 11.4. Verifying Memory IP Using the Signal Tap Logic Analyzer 11.5. Generating Traffic with the Test Engine IP 11.6. Guidelines for Developing HDL for Traffic Generator 11.7. Debugging with the External Memory Interface Debug Toolkit
11.1. Interface Configuration Performance Issues x
11.1.1. Interface Configuration Bottleneck and Efficiency Issues
11.2. Functional Issue Evaluation x
11.2.1. Intel® IP Memory Model 11.2.2. Vendor Memory Model 11.2.3. Transcript Window Messages
11.3. Timing Issue Characteristics x
11.3.1. Evaluating FPGA Timing Issues 11.3.2. Evaluating External Memory Interface Timing Issues
11.7. Debugging with the External Memory Interface Debug Toolkit x
11.7.1. Prerequisites for Using the EMIF Debug Toolkit 11.7.2. Configuring Your Design to Use the EMIF Debug Toolkit 11.7.3. Launching the EMIF Debug Toolkit 11.7.4. Using the EMIF Debug Toolkit
11.7.4. Using the EMIF Debug Toolkit x
11.7.4.1. Rerunning Calibration 11.7.4.2. Rerunning the Traffic Generator 11.7.4.3. Saving Debug Print
1. About the External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP
2. Intel Agilex® 7 M-Series FPGA EMIF IP – Introduction
3. Intel Agilex® 7 M-Series FPGA EMIF IP – Product Architecture
4. Intel Agilex® 7 M-Series FPGA EMIF IP – End-User Signals
5. Intel Agilex® 7 M-Series FPGA EMIF IP – Simulating Memory IP
6. Intel Agilex 7 M-Series FPGA EMIF IP – DDR4 Support
7. Intel Agilex® 7 M-Series FPGA EMIF IP – DDR5 Support
8. Intel Agilex 7 M-Series FPGA EMIF IP – LPDDR5 Support
9. Intel Agilex® 7 M-Series FPGA EMIF IP – Timing Closure
10. Intel Agilex® 7 M-Series FPGA EMIF IP – Controller Optimization
11. Intel Agilex® 7 M-Series FPGA EMIF IP – Debugging
12. Document Revision History for External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP User Guide

6.1.1. Intel Agilex® 7 M-Series FPGA EMIF IP Parameter Descriptions for DDR4 Interfaces

The following topics describe the parameters available on each tab of the IP parameter editor, which you can use to configure your IP. Each parameter with an adjacent checkbox can be auto-computed. The checkbox to the left of the parameter controls whether its value is auto-computed (true) or set manually (false). If there is no checkbox to the left of a parameter, then it must be set manually.
Table 64.  Group: Example Design / Example Design
Display Name Description
HDL Selection

This option lets you choose the format of HDL in which generated simulation and synthesis files are created. You can select either Verilog or VHDL.

(Identifier: EX_DESIGN_HDL_FORMAT)
Synthesis

Generate Synthesis Example Design

(Identifier: EX_DESIGN_GEN_SYNTH)
Simulation

Generate Simulation Example Design

(Identifier: EX_DESIGN_GEN_SIM)
NOC Refclk Freq

NOC Refclk Freq for the NOC control IP

Note: This parameter can be auto-computed.

(Identifier: EX_DESIGN_NOC_REFCLK_FREQ_MHZ)
Hydra Remote Access

Specifies whether the Hydra control and status registers are accessible via JTAG, exported to the fabric, or just disabled

(Identifier: EX_DESIGN_HYDRA_REMOTE)
Table 65.  Group: General IP Parameters / High-Level Parameters
Display Name Description
Technology Generation

Denotes the specific memory technology generation to be used

Note: This parameter can be auto-computed.

(Identifier: MEM_TECHNOLOGY)
Memory Format

Specifies the packaging format of the memory device

(Identifier: MEM_FORMAT)
Memory Device Topology

Topology used by memory device

(Identifier: MEM_TOPOLOGY)
Memory Ranks

Total number of physical ranks in the interface

(Identifier: MEM_NUM_RANKS)
Device DQ Width

If the device is a DIMM: Specifies the full DQ width of the DIMM. In the case of DDR5 DIMM: If the DQ width is set to 32 bits, only 1 channel of the DIMM is used; If the DQ width is set to 64 bits, both channels of the DIMM are used.

If the interface is composed of discrete components: Specifies the DQ width of each discrete component.

(Identifier: MEM_DEVICE_DQ_WIDTH)
Number of Components Per Rank

Number of components per rank. If each component contains more than one rank, then set this parameter to 1.

(Identifier: MEM_COMPS_PER_RANK)
Force Ranks to Share One Memory Interface Clock

Specifies whether all the ranks in the same channel should share one pair of memory interface differential clock. Applicable to DDR4 only.

(Identifier: MEM_RANKS_SHARE_CLOCKS)
ECC Mode

Specifies the type of ECC (if any) and the required number of side-band bits that will be used by this EMIF instance. While not all required side-band bits necessarily carry ECC bits, all need to be connected to the memory device. If enabling ECC requires more side-band bits than necessary ECC bits, then ECC bits are transmitted on the least significant side-band bits.

Note: This parameter can be auto-computed.

(Identifier: CTRL_ECC_MODE)
Enable Extra DQ Byte Lane

Augment a given memory interface with 8 extra DQ bits. These extra bits are accessed via the WUSER and RUSER ports on the PHY's AXI4 interface. The AXI4 WUSER and RUSER ports are 64-bit wide. In this release, this option can only augment a given 32/64-bit DDR4 in interface configured in fabric-synchronous mode without controller generated ECC bits.

Note: This parameter can be auto-computed.

(Identifier: AXI4_USER_DATA_ENABLE)
Total DQ Width

(Derived Parameter) This will be the width (in bits) of the mem_dq port on the memory interface.

For a component interface, it is calculated based on: (MEM_COMPS_PER_RANK * MEM_DEVICE_DQ_WIDTH + (8 bits if Side-band ECC is enabled, or 8 bits if AXI4 User Data is enabled in fabric modes, or 4 bits if AXI4 User Data is enabled in NoC mode)) * MEM_NUM_CHANNELS

For a DIMM-based interface, it is just MEM_DEVICE_DQ_WIDTH + (8 bits if side-band ECC is enabled, or 8 bits if AXI4 User Data is enabled in fabric modes, or 4 bits if AXI4 User Data is enabled in NoC mode) * MEM_NUM_CHANNELS.

(Identifier: MEM_TOTAL_DQ_WIDTH)
Alert_N Pin Placement

(DDR4 only) Specifies the AC lane index in which to place the ALERT_N pin.

(Identifier: PHY_ALERT_N_PLACEMENT)
Minimum Number of AC Lanes for DDR4

Specifies the minimum number of AC lanes required for the memory interface. Only applicable for DDR4.

(Identifier: USER_MIN_NUM_AC_LANES)
Memory Clock Frequency

Specifies the operating frequency of the memory interface in MHz. If you change the memory frequency, you must select a matching Preset from the dropdown (or create a custom one), to update all the timing parameters.

Note: This parameter can be auto-computed.

(Identifier: PHY_MEMCLK_FREQ_MHZ)
Instance ID

Instance ID of the EMIF IP. EMIF in the same bank, or connected to related user logic (e.g. to the same INIU), should have unique IDs in order to distinguish them when using the side-band interface. Valid values are 0-6.

(Identifier: INSTANCE_ID)
Table 66.  Group: General IP Parameters / Memory Device Preset Selection
Display Name Description
Use Memory Device Preset from file

Specifies whether MEM_PRESET_ID will be a value from Quartus (if false), or a value from a custom preset file path (if true)

(Identifier: MEM_PRESET_FILE_EN)
Memory Preset custom file path

Path to a .qprs file on the users disk

(Identifier: MEM_PRESET_FILE_QPRS)
Memory Preset

The name of a preset that the user would like to load, describing the memory device that this emif will be targeting.

Note: This parameter can be auto-computed.

(Identifier: MEM_PRESET_ID)
Table 67.  Group: General IP Parameters / Advanced Parameters / PHY / Topology
Display Name Description
Use NOC

Specifies whether we are using the NOC or bypassing it

Note: This parameter can be auto-computed.

(Identifier: PHY_NOC_EN)
Asynchronous Enable

Specifies whether the user logic is clocked based on the clock provided by the IP (Sync), or by a separate user clock (Async). If true - async mode is used, if false - sync mode is used.

(Identifier: PHY_ASYNC_EN)
AC Placement

Indicates location on the device where the interface will reside (specifically, the location of the AC lanes in terms IO BANK and TOP vs BOT part of the IO BANK). Legal ranges are derived from device floorplan. By default (value=AUTO), the most optimal location is selected (to maximize available frequency and data width).

Note: This parameter can be auto-computed.

(Identifier: PHY_AC_PLACEMENT)
PLL Reference Clock Frequency

Specifies what PLL reference clock frequency the user will supply. It is recommended to use the fastest possible PLL reference clock frequency because it leads to better jitter performance.

Note: This parameter can be auto-computed.

(Identifier: PHY_REFCLK_FREQ_MHZ)
Table 68.  Group: General IP Parameters / Advanced Parameters / FPGA I/O / FPGA I/O Settings
Display Name Description
Voltage

The voltage level for the I/O pins driving the signals between the memory device and the FPGA memory interface.

(Identifier: PHY_IO_VOLTAGE)
Table 69.  Group: General IP Parameters / Advanced Parameters / FPGA I/O / FPGA I/O Settings / Address/Command
Display Name Description
Drive Strength

This parameter allows you to change the output on chip termination settings for the selected I/O standard on the Address/Command Pins. Perform board simulation with IBIS models to determine the best settings for your design.

(Identifier: R_S_PHY_AC_OUTPUT_OHM)
Table 70.  Group: General IP Parameters / Advanced Parameters / FPGA I/O / FPGA I/O Settings / Memory Clock
Display Name Description
Drive Strength

This parameter allows you to change the output on chip termination settings for the selected I/O standard on the CK Pins. Perform board simulation with IBIS models to determine the best settings for your design.

(Identifier: R_S_PHY_CK_OUTPUT_OHM)
Table 71.  Group: General IP Parameters / Advanced Parameters / FPGA I/O / FPGA I/O Settings / Data Bus
Display Name Description
I/O Standard

Specifies the I/O electrical standard for the data bus pins. The selected I/O standard configures the circuit within the I/O buffer to match the industry standard.

(Identifier: PHY_DQ_IO_STD_TYPE)
Drive Strength

This parameter allows you to change the output on chip termination settings for the selected I/O standard on the DQ Pins. Perform board simulation with IBIS models to determine the best settings for your design.

(Identifier: R_S_PHY_DQ_OUTPUT_OHM)
Slew Rate

Specifies the slew rate of the data bus pins. The slew rate (or edge rate) describes how quickly the signal can transition, measured in voltage per unit time. Perform board simulations to determine the slew rate that provides the best eye opening for the data bus signals.

(Identifier: PHY_DQ_SLEW_RATE)
Input Termination

This parameter allows you to change the input on chip termination settings for the selected I/O standard on the DQ Pins. Perform board simulation with IBIS models to determine the best settings for your design.

(Identifier: R_T_PHY_DQ_INPUT_OHM)
Initial Vrefin

Specifies the initial value for the reference voltage on the data pins(Vrefin). The specified value serves as a starting point and may be overridden by calibration to provide better timing margins.

(Identifier: PHY_DQ_VREF)
Table 72.  Group: General IP Parameters / Advanced Parameters / FPGA I/O / FPGA I/O Settings / PHY Inputs
Display Name Description
PLL Reference Clock Input Termination

This parameter allows you to change the input on chip termination settings for the selected I/O standard on the CK Pins. Perform board simulation with IBIS models to determine the best settings for your design.

(Identifier: R_T_PHY_REFCLK_INPUT_OHM)
Table 73.  Group: General IP Parameters / Advanced Parameters / Mem I/O / Memory I/O Settings / Data Bus On-Die Termination (ODT)
Display Name Description
Target Write Termination

Specifies the target termination to be used during a write

(Identifier: MEM_ODT_TGT_WR)
Non-Target Write Termination

Specifies the termination to be used for the non-target rank in a multi-rank configuration during a write

(Identifier: MEM_ODT_NON_TGT_WR)
Non-Target Read Termination

Specifies the termination to be used for the non-target rank in a multi-rank configuration during a read

(Identifier: MEM_ODT_NON_TGT_RD)
Drive Strength

Specifies the termination to be used when driving read data from memory

(Identifier: MEM_RON)
Table 74.  Group: General IP Parameters / Advanced Parameters / Mem I/O / Memory I/O Settings / Data Bus Reference Voltage (Vref)
Display Name Description
VrefDQ Range

Specifies which of the memory protocol defined ranges will be used

(Identifier: MEM_DQ_VREF_RANGE)
VrefDQ Value

Specifies the initial VrefDQ value to be used

(Identifier: MEM_DQ_VREF_VALUE)
Table 75.  Group: General IP Parameters / Advanced Parameters / AXI Settings / AXI Interface Settings
Display Name Description
Enable Debug Tools

If enabled, the AXI-L port will be connected to SLD nodes, allowing for a system-console avalon manager interface to interact with this AXI-L subordinate interface.

(Identifier: DEBUG_TOOLS_EN)
AXI-Lite Port Access Mode

Specifies whether the AXI-Lite port is connected to the fabric, the NOC, or disabled

Note: This parameter can be auto-computed.

(Identifier: AXI_SIDEBAND_ACCESS_MODE)
Table 76.  Group: General IP Parameters / Advanced Parameters / Additional Parameters / Additional String Parameters
Display Name Description
User Extra Parameters

Semi-colon separated list of key/value pairs of extra parameters

(Identifier: USER_EXTRA_PARAMETERS)
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