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1. Overview of the Multi-Rail Power Sequencer and Monitor Reference Design
2. Architecture and Operation of the Multi-Rail Power Sequencer and Monitor Reference Design
3. Implementation and Simulation of the Multi-Rail Power Sequencer and Monitor Reference Design
4. Functionality Level and Resource Utilization Estimates
5. PCB Implementation for the Multi-Rail Power Sequencer and Monitor Reference Design
6. Document Revision History for AN 896: Multi-Rail Power Sequencer and Monitor Reference Design
2.3.1. Reset Sequencer (Reset_Sequencer)
2.3.2. Modular ADC Core Intel® FPGA IP (ADC_Core)
2.3.3. Sequencer Monitor (Sequencer_Monitor)
2.3.4. PMBus* Slave to Avalon®-MM Master Bridge (PMBus_Slave)
2.3.5. Power Sequencer (Sequencer_Core)
2.3.6. MAX10 OCFlash Controller (NVRAM_Controller)
2.3.7. On-Chip Flash Intel® FPGA IP (NVRAM_OC_Flash)
2.3.8. Other Design Components
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5. PCB Implementation for the Multi-Rail Power Sequencer and Monitor Reference Design
These block diagrams show how to connect MAX® 10 devices programmed with the reference design on the PCB.
Figure 27. PCB Connection for MAX® 10 Power Sequencer with Power Good (POK or PG)
Figure 28. PCB Connection for MAX® 10 Power Sequencer with Voltage Monitoring
Figure 29. PCB Connection for MAX® 10 Power Sequencer with Fast Discharge FET Circuit
Figure 30. PCB Connection for MAX® 10 Power Sequencer with Sequence Groups
- One EN signal per group fans out to multiple regulators.
- A separate POK signal or voltage monitor feedback is used per rail.
- You can tie multiple POK signals together for a single input (not shown in this figure).
Figure 31. PCB Connection for MAX® 10 Power Sequencer with VIN Monitoring and Enable
- Option to monitor VIN_FAULT or VIN_MON.
- The sequencer uses only one input or the other.
- Whichever input the sequencer uses determines if the input rail is within specification.