Visible to Intel only — GUID: ggj1628537167470
Ixiasoft
Visible to Intel only — GUID: ggj1628537167470
Ixiasoft
1.5.4. Spreading Inductance
Spreading Inductance is the inductance formed by the loop area between the power-ground plane pair and the distance from the decoupling cap to the power-ground balls of the target BGA device. As a result, this inductance is directly related to the inductance of the inter-plane capacitance formed by the power-ground sandwich. This inductance is explained in detail in the inter-plane capacitance section below.