AN 958: Board Design Guidelines

ID 683073
Date 1/28/2022
Public
Document Table of Contents

1.5.4. Spreading Inductance

Spreading Inductance is the inductance formed by the loop area between the power-ground plane pair and the distance from the decoupling cap to the power-ground balls of the target BGA device. As a result, this inductance is directly related to the inductance of the inter-plane capacitance formed by the power-ground sandwich. This inductance is explained in detail in the inter-plane capacitance section below.

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