1. Power Distribution Network
2. Gigahertz Channel Design Considerations
3. PCB and Stack-Up Design Considerations
4. Device Pin-Map, Checklists, and Connection Guidelines
5. General Board Design Considerations/Guidelines
6. Memory Interfacing Guidelines
7. Power Dissipation and Thermal Management
8. Tools, Models, and Libraries
9. Reference Designs and Development Kits
10. Document Revision History for AN 958: Board Design Guidelines
4.1. High Speed Board Design Advisor
4.2. Complete Pin Connection Table by Device
4.3. Pin Connection Guidelines By Device
4.4. Design for Debug with JTAG Pins
4.5. Hot Socketing, POR and Power Sequencing Support
4.6. Implementing OCT
4.7. Unused I/O Pins Guidelines
4.8. Device Breakout Guidelines
4.9. Additional Resources
5.1.1. Material Selection and Loss
5.1.2. Cross Talk Minimization
5.1.3. Power Filtering/Distribution
5.1.4. Unused I/O Pins
5.1.5. Signal Trace Routing
5.1.6. Ground Bounce
5.1.7. Understanding Transmission Lines
5.1.8. Impedance Calculation
5.1.9. Coplanar Wave Guides
5.1.10. Simultaneous Switching Noise Guidelines
5.4.1. Resistors and Capacitors
Choose the smallest footprint available when selecting discrete components such as resistors and capacitors. The small footprint means that the pad on the board can be small and that the parasitic capacitance and inductance will also be small. Intel typically uses 40 mil × 20 mil (0402) package components for high-speed signals.
Inductors typically require bigger footprints because they are often used for power supply filtering and must be bigger to support high currents without saturating.
The three parameters of interest when choosing ferrite beads are:
- DC resistance
- AC impedance
- Current handling capability