PCB Design Guidelines: Agilex™ 3 FPGAs and SoCs

ID 853726
Date 8/20/2025
Public
Document Table of Contents

1. Overview

This document provides guidelines for creating superior PCB designs for Agilex™ 3 FPGAs and SoCs. The document covers printed circuit board (PCB) layouts, High Speed Serial Interface (HSSI), External Memory Interface (EMIF), Mobile Industry Processor Interface (MIPI), True Differential I/O Interfaces, and Power Distribution Network (PDN).

The guidelines include recommended footprint and land patterns, and HSSI, EMIF, MIPI, and True Differential I/O routing guidelines for the following Agilex™ 3 FPGAs and SoCs packages:

  • B18A—474-pins VPBGA package
  • M16A—896-pins MBGA package
Note: Information for the following packages are under development and not yet available: B18B, B23C, and M12A.
Note: References to Agilex™ 5 PCB boards in this document are intentional. You can use the Agilex™ 5 PCB guidelines as a reference when designing PCBs for Agilex™ 3 devices unless otherwise stated.