1. Overview
2. BGA Footprint and Land Pattern
3. General PCB Design Considerations
4. VPBGA PCB Routing Guidelines
5. MBGA PCB Routing Guidelines
6. EMIF PCB Routing Guidelines (VPBGA and MBGA)
7. MIPI Interface Layout Design Guidelines (VPBGA and MBGA)
8. True Differential I/O Interface PCB Routing Guidelines
9. Power Distribution Network Design Guidelines
10. Document Revision History for the PCB Design Guidelines: Agilex™ 3 FPGAs and SoCs
9.1. Agilex™ 3 Power Distribution Network Design Guidelines Overview
9.2. Power Delivery Overview
9.3. Board Power Delivery Network Recommendations
9.4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails
9.5. PCB PDN Design Guideline for Unused GTS Transceiver
9.6. PCB Voltage Regulator Recommendation for PCB Power Rails
9.7. Board PDN Simulations
9.8. Agilex™ 3 Device Family PDN Design Summary
5.7. HDMI Connectors
Agilex™ 3 devices support HDMI 2.1 up to 12 Gbps.
- Altera recommends that you maintain an inter-lane skew of ±200 mils.
The following figures show examples of the cut-out size on the Agilex™ 5 carrier board for reference.
- You can optimize the sizes through 3D simulation; or refer to the connector vendor for recommendations.
- The design adds ground vias and places a cut-out size identical to the signal pad on Layer 2.
- Additionally, the manufacturing process removes the solder mask on top of the connector pad.
Figure 26. Cut-Out Size on Layer 2 of the Agilex™ 5 Carrier Board
Figure 27. Ground Vias on the Agilex™ 5 Carrier Board