Stratix® 10 Configuration User Guide

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ID 683762
Date 11/04/2024
Public
Document Table of Contents
Document Table of Contents x
1. Stratix® 10 Configuration User Guide 2. Stratix® 10 Configuration Details 3. Stratix® 10 Configuration Schemes 4. Including the Reset Release Intel® FPGA IP in Your Design 5. Remote System Update (RSU) 6. Stratix® 10 Configuration Features 7. Stratix® 10 Debugging Guide 8. Stratix® 10 Configuration User Guide Archives 9. Document Revision History for the Stratix® 10 Configuration User Guide
1. Stratix® 10 Configuration User Guide x
1.1. Stratix® 10 Configuration Overview 1.2. Stratix® 10 Configuration Architecture
1.1. Stratix® 10 Configuration Overview x
1.1.1. Configuration and Related Signals 1.1.2. Intel Download Cables Supporting Configuration in Stratix® 10 Devices
1.2. Stratix® 10 Configuration Architecture x
1.2.1. Secure Device Manager
1.2.1. Secure Device Manager x
1.2.1.1. Restricting Security Features 1.2.1.2. Updating the SDM Firmware 1.2.1.3. Specifying Boot Order for Stratix® 10 SoC Devices
2. Stratix® 10 Configuration Details x
2.1. Stratix® 10 Configuration Timing Diagram 2.2. Configuration Flow Diagram 2.3. Device Response to Configuration and Reset Events 2.4. Additional Clock Requirements for HPS, PCIe* , eSRAM, and HBM2 2.5. Stratix® 10 Configuration Pins 2.6. Configuration Clocks 2.7. Maximum Configuration Time Estimation 2.8. Generating Compressed .sof File 2.9. Dual-die Configuration on Stratix® 10 GX 10M
2.5. Stratix® 10 Configuration Pins x
2.5.1. SDM Pin Mapping 2.5.2. MSEL Settings 2.5.3. Device Configuration Pins for Optional Configuration Signals
2.5.3. Device Configuration Pins for Optional Configuration Signals x
2.5.3.1. Specifying Optional Configuration Pins 2.5.3.2. Enabling Dual-Purpose Pins 2.5.3.3. Configuration Pins I/O Standard, Drive Strength, and IBIS Model 2.5.3.4. SDM I/O Pins for Power Management and SmartVID 2.5.3.5. Specifying Pins for Partial Reconfiguration (PR)
2.5.3.1. Specifying Optional Configuration Pins x
2.5.3.1.1. nCONFIG 2.5.3.1.2. nSTATUS 2.5.3.1.3. CONF_DONE and INIT_DONE 2.5.3.1.4. SDM_IO Pins
2.6. Configuration Clocks x
2.6.1. Setting Configuration Clock Source 2.6.2. OSC_CLK_1 Clock Input
3. Stratix® 10 Configuration Schemes x
3.1. Avalon-ST Configuration 3.2. AS Configuration 3.3. JTAG Configuration
3.1. Avalon-ST Configuration x
3.1.1. Avalon® -ST Configuration Scheme Hardware Components and File Types 3.1.2. Enabling Avalon-ST Device Configuration 3.1.3. The AVST_READY Signal 3.1.4. RBF Configuration File Format 3.1.5. Avalon-ST Single-Device Configuration 3.1.6. Debugging Guidelines for the Avalon® -ST Configuration Scheme 3.1.7. IP for Use with the Avalon® -ST Configuration Scheme: Parallel Flash Loader II Intel® FPGA IP (PFL II)
3.1.7. IP for Use with the Avalon® -ST Configuration Scheme: Parallel Flash Loader II Intel® FPGA IP (PFL II) x
3.1.7.1. Functional Description 3.1.7.2. Designing with the Parallel Flash Loader II Intel® FPGA IP for Avalon-ST Single Device Configuration 3.1.7.3. Generating the Parallel Flash Loader II Intel® FPGA IP 3.1.7.4. Constraining the Parallel Flash Loader II Intel® FPGA IP 3.1.7.5. Using the Parallel Flash Loader II Intel® FPGA IP 3.1.7.6. Supported Flash Memory Devices
3.1.7.1. Functional Description x
3.1.7.1.1. Generating and Programming a .pof into CFI Flash 3.1.7.1.2. Implementing Multiple Pages in the Flash .pof 3.1.7.1.3. Storing Option Bits 3.1.7.1.4. Verifying the Option Bit Start and End Addresses 3.1.7.1.5. Implementing Page Mode and Option Bits in the CFI Flash Memory Device
3.1.7.2. Designing with the Parallel Flash Loader II Intel® FPGA IP for Avalon-ST Single Device Configuration x
3.1.7.2.1. Parallel Flash Loader II Intel® FPGA IP Parameters 3.1.7.2.2. Parallel Flash Loader II Intel® FPGA IP Signals
3.1.7.3. Generating the Parallel Flash Loader II Intel® FPGA IP x
3.1.7.3.1. Controlling Avalon-ST Configuration with Parallel Flash Loader II Intel® FPGA IP 3.1.7.3.2. Mapping Parallel Flash Loader II Intel® FPGA IP and Flash Address 3.1.7.3.3. Creating a Single Parallel Flash Loader II Intel® FPGA IP for Programming and Configuration 3.1.7.3.4. Creating Separate Parallel Flash Loader II Intel® FPGA IP Functions
3.1.7.4. Constraining the Parallel Flash Loader II Intel® FPGA IP x
3.1.7.4.1. Parallel Flash Loader II Intel® FPGA IP Recommended Design Constraints to FPGA Avalon-ST Pins 3.1.7.4.2. Parallel Flash Loader II Intel® FPGA IP Recommended Design Constraints for Using QSPI Flash 3.1.7.4.3. Parallel Flash Loader II Intel® FPGA IP Recommended Design Constraints for using CFI Flash 3.1.7.4.4. Parallel Flash Loader II Intel® FPGA IP Recommended Constraints for Other Input Pins 3.1.7.4.5. Parallel Flash Loader II Intel® FPGA IP Recommended Constraints for Other Output Pins
3.1.7.5. Using the Parallel Flash Loader II Intel® FPGA IP x
3.1.7.5.1. Converting .sof to .pof File 3.1.7.5.2. Programming CPLDs and Flash Memory Devices Sequentially 3.1.7.5.3. Programming CPLDs and Flash Memory Devices Separately 3.1.7.5.4. Defining New CFI Flash Memory Device
3.2. AS Configuration x
3.2.1. AS Configuration Scheme Hardware Components and File Types 3.2.2. AS Single-Device Configuration 3.2.3. AS Using Multiple Serial Flash Devices 3.2.4. AS Configuration Timing Parameters 3.2.5. Skew Tolerance Guidelines 3.2.6. Programming Serial Flash Devices 3.2.7. Serial Flash Memory Layout 3.2.8. AS_CLK 3.2.9. Active Serial Configuration Software Settings 3.2.10. Quartus® Prime Programming Steps 3.2.11. Debugging Guidelines for the AS Configuration Scheme
3.2.5. Skew Tolerance Guidelines x
3.2.5.1. Maximum Allowable External AS_DATA Pin Skew Delay Guidelines 3.2.5.2. Maximum Allowable External nCSO Pin Skew Delay Guidelines
3.2.6. Programming Serial Flash Devices x
3.2.6.1. Programming Serial Flash Devices using the AS Interface 3.2.6.2. Programming Serial Flash Devices using the JTAG Interface
3.2.7. Serial Flash Memory Layout x
3.2.7.1. Understanding Quad SPI Flash Byte-Addressing
3.2.10. Quartus® Prime Programming Steps x
3.2.10.1. Generating Programming Files using the Programming File Generator 3.2.10.2. Programming .pof files into Serial Flash Device 3.2.10.3. Programming .jic files into Serial Flash Device
3.3. JTAG Configuration x
3.3.1. JTAG Configuration Scheme Hardware Components and File Types 3.3.2. JTAG Device Configuration 3.3.3. JTAG Multi-Device Configuration 3.3.4. Debugging Guidelines for the JTAG Configuration Scheme
3.3.2. JTAG Device Configuration x
3.3.2.1. JTAG Single-Device Configuration using Download Cable Connections 3.3.2.2. JTAG Single-Device Configuration using a Microprocessor
3.3.3. JTAG Multi-Device Configuration x
3.3.3.1. JTAG Multi-Device Configuration using Download Cable
4. Including the Reset Release Intel® FPGA IP in Your Design x
4.1. Understanding the Reset Release IP Requirement 4.2. Instantiating the Reset Release IP In Your Design 4.3. Gating the PLL Reset Signal 4.4. Guidance When Using Partial Reconfiguration (PR) 4.5. Detailed Description of Device Configuration
4.5. Detailed Description of Device Configuration x
4.5.1. Device Initialization 4.5.2. Disabling the Register Power-up Initialization 4.5.3. Embedded Memory Block Initial Conditions 4.5.4. Protecting State Machine Logic
5. Remote System Update (RSU) x
5.1. Remote System Update Functional Description 5.2. Guidelines for Performing Remote System Update Functions for Non-HPS 5.3. Commands and Responses 5.4. Quad SPI Flash Layout 5.5. Generating Remote System Update Image Files Using the Programming File Generator 5.6. Remote System Update from FPGA Core Example 5.7. Debugging Guidelines for RSU Configuration
5.1. Remote System Update Functional Description x
5.1.1. RSU Glossary 5.1.2. Remote System Update Using AS Configuration 5.1.3. Remote System Update Configuration Images 5.1.4. Remote System Update Configuration Sequence 5.1.5. RSU Recovery from Corrupted Images 5.1.6. Updates with the Factory Update Image
5.3. Commands and Responses x
5.3.1. Operation Commands 5.3.2. Error Code Responses 5.3.3. Error Code Recovery
5.4. Quad SPI Flash Layout x
5.4.1. High Level Flash Layout 5.4.2. Detailed Quad SPI Flash Layout
5.4.1. High Level Flash Layout x
5.4.1.1. Standard (non-RSU) Image Layout in Flash 5.4.1.2. RSU Image Layout in Flash – SDM Perspective 5.4.1.3. RSU Image Layout – Your Perspective
5.4.1.2. RSU Image Layout in Flash – SDM Perspective x
5.4.1.2.1. Firmware Version Information
5.4.2. Detailed Quad SPI Flash Layout x
5.4.2.1. RSU Image Sub-Partitions Layout 5.4.2.2. Sub-Partition Table Layout 5.4.2.3. Configuration Pointer Block Layout 5.4.2.4. Modifying the List of Application Images
5.5. Generating Remote System Update Image Files Using the Programming File Generator x
5.5.1. Generating the Initial RSU Image 5.5.2. Generating an Application Image 5.5.3. Generating a Factory Update Image 5.5.4. Command Sequence To Perform Quad SPI Operations
5.5.1. Generating the Initial RSU Image x
5.5.1.1. Generating the Initial RSU Image Using SOF Files 5.5.1.2. Generating the Initial RSU Image Using RBF Files 5.5.1.3. Updating Decision Firmware
5.6. Remote System Update from FPGA Core Example x
5.6.1. Prerequisites 5.6.2. Creating Initial Flash Image Containing Bitstreams for Factory Image and One Application Image 5.6.3. Programming Flash Memory with the Initial Remote System Update Image 5.6.4. Reconfiguring the Device with an Application or Factory Image 5.6.5. Adding an Application Image 5.6.6. Removing an Application Image
6. Stratix® 10 Configuration Features x
6.1. Device Security 6.2. Configuration via Protocol 6.3. Partial Reconfiguration
7. Stratix® 10 Debugging Guide x
7.1. Configuration Debugging Checklist 7.2. Stratix® 10 Configuration Architecture Overview 7.3. Understanding Configuration Status Using quartus_pgm command 7.4. SDM Debug Toolkit Overview 7.5. Configuration Pin Differences from Previous Device Families 7.6. Configuration File Format Differences 7.7. Understanding SEUs 7.8. Reading the Unique 64-Bit CHIP ID 7.9. E-Tile Transceivers May Fail To Configure 7.10. Understanding and Troubleshooting Configuration Pin Behavior 7.11. Configuration Debugger Tool
7.4. SDM Debug Toolkit Overview x
7.4.1. Using the SDM Debug Toolkit
1. Stratix® 10 Configuration User Guide
2. Stratix® 10 Configuration Details
3. Stratix® 10 Configuration Schemes
4. Including the Reset Release Intel® FPGA IP in Your Design
5. Remote System Update (RSU)
6. Stratix® 10 Configuration Features
7. Stratix® 10 Debugging Guide
8. Stratix® 10 Configuration User Guide Archives
9. Document Revision History for the Stratix® 10 Configuration User Guide

2.9. Dual-die Configuration on Stratix® 10 GX 10M

The Stratix® 10 GX 10M (1SG10M) contains two fabric dies. Each die has its own unique JTAG ID and own set of configuration pins:
  • nSTATUS
  • nCONFIG
  • CONF_DONE
  • INIT_DONE
Each die is configured separately with their respective configuration bitstream or .sof file. The device cannot be configured using a single .sof file.

With the JTAG configuration scheme, each die is treated as an individual die. The configuration pins for both dies have no dependency or impact on one another. For example, the CONF_DONE and INIT_DONE pins for the first die are asserted after a successful configuration without dependency on the other die. Should the latter die fail configuration, the CONF_DONE and INIT_DONE pins for the first die are unaffected and remain high. There is no configuration sequence requirement as either die can be configured first.

Although the CONF_DONE and INIT_DONE signals are optional, Intel® recommends you assign these signals to any unused SDM pin and use these signals as an indicator to ensure that configuration is successful. These signals are important for debugging configuration.

In the Stratix® 10 GX 10M, CONF_DONE goes high before the full configuration bitstream is successfully received. During this time the device is in configuration state and waiting for data, you need to ensure the remaining 20 kB bitstream is sent before proceeding. In the event the remaining bitstream is corrupted, CONF_DONE remains high but INIT_DONE shows low, indicating you need to trigger reconfiguration.

Note: Refer to the Stratix® 10 Configuration Timing Diagram for the configuration event description marked by the numbers in the Initial Configuration and the numbers in the Reconfiguration of the following timing diagram.
Figure 16. Power-On, Configuration, and Reconfiguration Timing Diagram for Stratix® 10 GX 10M

If the Direct Interface Bus (DIB) IP is included in the design for direct communication between both dies of the Stratix® 10 GX 10M, you must ensure the setting for the DIB connection in both designs are correct and able to pass configuration.

During JTAG configuration for designs including DIB, the CONF_DONE and INIT_DONE pins of the first die are asserted once configuration is successful and the device enters user mode. If the DIB connection is incorrect, once the SDM has successfully received the entire bitstream for the second die, the SDM first asserts CONF_DONE high and soon deasserts CONF_DONE low to indicate configuration failure. Both CONF_DONE and INIT_DONE of the second die stay low until the next successful configuration. CONF_DONE and INIT_DONE for the first die continue to stay high.

The DATA UNLOCK OUTPUT is high after DIB on both dies in the same package are in user mode and ready for data transfer. When either die is reconfigured, DATA UNLOCK OUTPUT is deasserted during the operation and is asserted again once both dies are again in user mode and ready for data transfer. For more information about DIB, refer to the Direct Interface Bus (DIB) Stratix® 10 FPGA IP User Guide.

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