External Memory Interfaces Cyclone® 10 GX FPGA IP User Guide

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ID 683663
Date 11/28/2024
Public
Document Table of Contents
Document Table of Contents x
1. Release Information 2. External Memory Interfaces Cyclone® 10 GX FPGA IP Introduction 3. Cyclone® 10 GX EMIF IP Product Architecture 4. Cyclone® 10 GX EMIF IP End-User Signals 5. Cyclone® 10 GX EMIF – Simulating Memory IP 6. Cyclone® 10 GX EMIF IP for DDR3 7. Cyclone® 10 GX EMIF IP for LPDDR3 8. Cyclone® 10 GX EMIF IP Timing Closure 9. Optimizing Controller Performance 10. Cyclone® 10 GX EMIF IP Debugging 11. External Memory Interfaces Cyclone® 10 GX FPGA IP User Guide Archives 12. Document Revision History for Cyclone® 10 GX External Memory Interfaces FPGA IP User Guide
2. External Memory Interfaces Cyclone® 10 GX FPGA IP Introduction x
2.1. Cyclone® 10 GX EMIF IP Design Flow 2.2. Cyclone® 10 GX EMIF IP Design Checklist
3. Cyclone® 10 GX EMIF IP Product Architecture x
3.1. EMIF Architecture: Introduction 3.2. Cyclone® 10 GX EMIF Sequencer 3.3. Cyclone® 10 GX EMIF Calibration 3.4. Cyclone® 10 GX EMIF Controller 3.5. Hardware Resource Sharing Among Multiple EMIFs 3.6. Cyclone® 10 GX EMIF Ping Pong PHY
3.1. EMIF Architecture: Introduction x
3.1.1. I/O Subsystem 3.1.2. I/O Column 3.1.3. I/O AUX 3.1.4. I/O Bank 3.1.5. I/O Lane 3.1.6. Input DQS Clock Tree 3.1.7. PHY Clock Tree 3.1.8. PLL Reference Clock Networks 3.1.9. Clock Phase Alignment
3.1.4. I/O Bank x
3.1.4.1. Implementing a x8 Interface with Hard Memory Controller 3.1.4.2. Implementing a x72 Interface with Hard Memory Controller
3.2. Cyclone® 10 GX EMIF Sequencer x
3.2.1. DQS Tracking
3.3. Cyclone® 10 GX EMIF Calibration x
3.3.1. Calibration Stages 3.3.2. Calibration Stages Descriptions 3.3.3. Calibration Algorithms 3.3.4. Calibration Flowchart
3.4. Cyclone® 10 GX EMIF Controller x
3.4.1. Hard Memory Controller 3.4.2. Hard Memory Controller Rate Conversion Feature
3.4.1. Hard Memory Controller x
3.4.1.1. Hard Memory Controller Features 3.4.1.2. Hard Memory Controller Main Control Path 3.4.1.3. Data Buffer Controller
3.5. Hardware Resource Sharing Among Multiple EMIFs x
3.5.1. I/O Aux Sharing 3.5.2. I/O Bank Sharing 3.5.3. PLL Reference Clock Sharing 3.5.4. Core Clock Network Sharing
3.6. Cyclone® 10 GX EMIF Ping Pong PHY x
3.6.1. Ping Pong PHY Feature Description 3.6.2. Ping Pong PHY Architecture 3.6.3. Ping Pong PHY Limitations 3.6.4. Ping Pong PHY Calibration 3.6.5. Using the Ping Pong PHY 3.6.6. Ping Pong PHY Simulation Example Design
4. Cyclone® 10 GX EMIF IP End-User Signals x
4.1. Interface and Signal Descriptions 4.2. AFI Signals 4.3. AFI 4.0 Timing Diagrams 4.4. Cyclone® 10 GX Memory Mapped Register (MMR) Tables
4.1. Interface and Signal Descriptions x
4.1.1. Intel Cyclone 10 GX EMIF IP Interfaces for DDR3 4.1.2. Intel Cyclone 10 GX EMIF IP Interfaces for LPDDR3
4.1.1. Intel Cyclone 10 GX EMIF IP Interfaces for DDR3 x
4.1.1.1. pll_ref_clk for DDR3 4.1.1.2. pll_locked for DDR3 4.1.1.3. pll_extra_clk_0 for DDR3 4.1.1.4. pll_extra_clk_1 for DDR3 4.1.1.5. pll_extra_clk_2 for DDR3 4.1.1.6. pll_extra_clk_3 for DDR3 4.1.1.7. oct for DDR3 4.1.1.8. mem for DDR3 4.1.1.9. status for DDR3 4.1.1.10. afi_reset_n for DDR3 4.1.1.11. afi_clk for DDR3 4.1.1.12. afi_half_clk for DDR3 4.1.1.13. afi for DDR3 4.1.1.14. emif_usr_reset_n for DDR3 4.1.1.15. emif_usr_clk for DDR3 4.1.1.16. emif_usr_reset_n_sec for DDR3 4.1.1.17. emif_usr_clk_sec for DDR3 4.1.1.18. cal_debug_reset_n for DDR3 4.1.1.19. cal_debug_clk for DDR3 4.1.1.20. cal_debug_out_reset_n for DDR3 4.1.1.21. cal_debug_out_clk for DDR3 4.1.1.22. clks_sharing_master_out for DDR3 4.1.1.23. clks_sharing_slave_in for DDR3 4.1.1.24. clks_sharing_slave_out for DDR3 4.1.1.25. ctrl_amm for DDR3 4.1.1.26. ctrl_auto_precharge for DDR3 4.1.1.27. ctrl_user_priority for DDR3 4.1.1.28. ctrl_ecc_user_interrupt for DDR3 4.1.1.29. ctrl_ecc_readdataerror for DDR3 4.1.1.30. ctrl_mmr_slave for DDR3 4.1.1.31. cal_debug for DDR3 4.1.1.32. cal_debug_out for DDR3
4.1.2. Intel Cyclone 10 GX EMIF IP Interfaces for LPDDR3 x
4.1.2.1. pll_ref_clk for LPDDR3 4.1.2.2. pll_locked for LPDDR3 4.1.2.3. pll_extra_clk_0 for LPDDR3 4.1.2.4. pll_extra_clk_1 for LPDDR3 4.1.2.5. pll_extra_clk_2 for LPDDR3 4.1.2.6. pll_extra_clk_3 for LPDDR3 4.1.2.7. oct for LPDDR3 4.1.2.8. mem for LPDDR3 4.1.2.9. status for LPDDR3 4.1.2.10. afi_reset_n for LPDDR3 4.1.2.11. afi_clk for LPDDR3 4.1.2.12. afi_half_clk for LPDDR3 4.1.2.13. afi for LPDDR3 4.1.2.14. emif_usr_reset_n for LPDDR3 4.1.2.15. emif_usr_clk for LPDDR3 4.1.2.16. cal_debug_reset_n for LPDDR3 4.1.2.17. cal_debug_clk for LPDDR3 4.1.2.18. cal_debug_out_reset_n for LPDDR3 4.1.2.19. cal_debug_out_clk for LPDDR3 4.1.2.20. clks_sharing_master_out for LPDDR3 4.1.2.21. clks_sharing_slave_in for LPDDR3 4.1.2.22. clks_sharing_slave_out for LPDDR3 4.1.2.23. ctrl_user_priority for LPDDR3 4.1.2.24. ctrl_mmr_slave for LPDDR3 4.1.2.25. cal_debug for LPDDR3 4.1.2.26. cal_debug_out for LPDDR3
4.2. AFI Signals x
4.2.1. AFI Clock and Reset Signals 4.2.2. AFI Address and Command Signals 4.2.3. AFI Write Data Signals 4.2.4. AFI Read Data Signals 4.2.5. AFI Calibration Status Signals 4.2.6. AFI Shadow Register Management Signals
4.3. AFI 4.0 Timing Diagrams x
4.3.1. AFI Address and Command Timing Diagrams 4.3.2. AFI Write Sequence Timing Diagrams 4.3.3. AFI Read Sequence Timing Diagrams 4.3.4. AFI Calibration Status Timing Diagram
4.4. Cyclone® 10 GX Memory Mapped Register (MMR) Tables x
4.4.1. ctrlcfg0 4.4.2. ctrlcfg1 4.4.3. dramtiming0 4.4.4. sbcfg1 4.4.5. caltiming0 4.4.6. caltiming1 4.4.7. caltiming2 4.4.8. caltiming3 4.4.9. caltiming4 4.4.10. caltiming9 4.4.11. dramaddrw 4.4.12. sideband0 4.4.13. sideband1 4.4.14. sideband2 4.4.15. sideband3 4.4.16. sideband4 4.4.17. sideband5 4.4.18. sideband6 4.4.19. sideband7 4.4.20. sideband8 4.4.21. sideband9 4.4.22. sideband10 4.4.23. sideband11 4.4.24. sideband12 4.4.25. sideband13 4.4.26. dramsts 4.4.27. niosreserve0 4.4.28. niosreserve1 4.4.29. ecc3: ECC Error and Interrupt Configuration 4.4.30. ecc4: Status and Error Information 4.4.31. ecc5: Address of Most Recent SBE/DBE 4.4.32. ecc6: Address of Most Recent Correction Command Dropped
5. Cyclone® 10 GX EMIF – Simulating Memory IP x
5.1. Simulation Options 5.2. Simulation Walkthrough
5.2. Simulation Walkthrough x
5.2.1. Calibration Modes 5.2.2. Abstract PHY Simulation 5.2.3. Simulation Scripts 5.2.4. Functional Simulation with Verilog HDL 5.2.5. Functional Simulation with VHDL 5.2.6. Simulating the Design Example
6. Cyclone® 10 GX EMIF IP for DDR3 x
6.1. Parameter Descriptions 6.2. Board Skew Equations 6.3. Pin and Resource Planning 6.4. DDR3 Board Design Guidelines
6.1. Parameter Descriptions x
6.1.1. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: General 6.1.2. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Memory 6.1.3. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Mem I/O 6.1.4. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: FPGA I/O 6.1.5. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Mem Timing 6.1.6. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Board 6.1.7. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Controller 6.1.8. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Diagnostics 6.1.9. Intel Cyclone 10 GX EMIF IP DDR3 Parameters: Example Designs
6.2. Board Skew Equations x
6.2.1. Equations for DDR3 Board Skew Parameters
6.3. Pin and Resource Planning x
6.3.1. Interface Pins 6.3.2. FPGA Resources 6.3.3. Pin Guidelines for Cyclone® 10 GX EMIF IP
6.3.1. Interface Pins x
6.3.1.1. Estimating Pin Requirements 6.3.1.2. DIMM Options 6.3.1.3. Maximum Number of Interfaces
6.3.2. FPGA Resources x
6.3.2.1. OCT 6.3.2.2. PLL
6.3.3. Pin Guidelines for Cyclone® 10 GX EMIF IP x
6.3.3.1. General Guidelines 6.3.3.2. x4 DIMM Implementation Data Bus Connection Mapping Flow Necessary checks to perform if the DQS groups are remapped in the RTL code Necessary checks to perform if the DQS groups are remapped on the schematic 6.3.3.3. Command and Address Signals 6.3.3.4. Clock Signals 6.3.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 6.3.3.6. Resource Sharing Guidelines (Multiple Interfaces) 6.3.3.7. Ping-Pong PHY Implementation
6.4. DDR3 Board Design Guidelines x
6.4.1. Terminations and Slew Rates with Cyclone® 10 GX Devices 6.4.2. Channel Signal Integrity Measurement 6.4.3. Layout Approach 6.4.4. Design Layout Guidelines 6.4.5. Package Deskew
6.4.1. Terminations and Slew Rates with Cyclone® 10 GX Devices x
6.4.1.1. Dynamic On-Chip Termination (OCT) in Cyclone® 10 Devices 6.4.1.2. Choosing Terminations on Cyclone® 10 Devices 6.4.1.3. On-Chip Termination Recommendations for Cyclone® 10 Devices 6.4.1.4. Slew Rates
6.4.2. Channel Signal Integrity Measurement x
6.4.2.1. Importance of Accurate Channel Signal Integrity Information 6.4.2.2. Understanding Channel Signal Integrity Measurement 6.4.2.3. How to Enter Calculated Channel Signal Integrity Values 6.4.2.4. Guidelines for Calculating DDR3 Channel Signal Integrity
6.4.4. Design Layout Guidelines x
6.4.4.1. General Layout Guidelines 6.4.4.2. Layout Guidelines 6.4.4.3. Length Matching Rules 6.4.4.4. Spacing Guidelines 6.4.4.5. Layout Guidelines for DDR3 SDRAM Wide Interface (>72 bits) 6.4.4.6. Fly-By Network Design for Clock, Command, and Address Signals
6.4.5. Package Deskew x
6.4.5.1. DQ/DQS/DM Deskew 6.4.5.2. Address and Command Deskew 6.4.5.3. Package Deskew Recommendations for Cyclone® 10 Devices 6.4.5.4. Deskew Example 6.4.5.5. Package Migration
7. Cyclone® 10 GX EMIF IP for LPDDR3 x
7.1. Parameter Descriptions 7.2. Board Skew Equations 7.3. Pin and Resource Planning 7.4. LPDDR3 Board Design Guidelines
7.1. Parameter Descriptions x
7.1.1. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: General 7.1.2. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Memory 7.1.3. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Mem I/O 7.1.4. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: FPGA I/O 7.1.5. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Mem Timing 7.1.6. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Board 7.1.7. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Controller 7.1.8. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Diagnostics 7.1.9. Intel Cyclone 10 GX EMIF IP LPDDR3 Parameters: Example Designs
7.2. Board Skew Equations x
7.2.1. Equations for LPDDR3 Board Skew Parameters
7.3. Pin and Resource Planning x
7.3.1. Interface Pins
7.3.1. Interface Pins x
7.3.1.1. Estimating Pin Requirements 7.3.1.2. Maximum Number of Interfaces 7.3.1.3. FPGA Resources 7.3.1.4. OCT 7.3.1.5. PLL 7.3.1.6. Pin Guidelines for Cyclone® 10 GX EMIF IP
7.3.1.6. Pin Guidelines for Cyclone® 10 GX EMIF IP x
7.3.1.6.1. General Guidelines 7.3.1.6.2. LPDDR3 Clock Signal 7.3.1.6.3. LPDDR3 Command and Address Signal 7.3.1.6.4. LPDDR3 Data, Data Strobe, and DM Signals 7.3.1.6.5. Resource Sharing Guidelines (Multiple Interfaces)
7.4. LPDDR3 Board Design Guidelines x
7.4.1. Terminations and Slew Rates with Cyclone® 10 GX Devices 7.4.2. Channel Signal Integrity Measurement 7.4.3. Layout Approach 7.4.4. Design Layout Guidelines 7.4.5. Package Deskew
7.4.1. Terminations and Slew Rates with Cyclone® 10 GX Devices x
7.4.1.1. Dynamic On-Chip Termination (OCT) in Cyclone® 10 Devices 7.4.1.2. Choosing Terminations on Cyclone® 10 Devices 7.4.1.3. On-Chip Termination Recommendations for Cyclone® 10 Devices
7.4.2. Channel Signal Integrity Measurement x
7.4.2.1. Importance of Accurate Channel Signal Integrity Information 7.4.2.2. Understanding Channel Signal Integrity Measurement 7.4.2.3. How to Enter Calculated Channel Signal Integrity Values 7.4.2.4. Guidelines for Calculating DDR3 Channel Signal Integrity
7.4.4. Design Layout Guidelines x
7.4.4.1. General Layout Guidelines 7.4.4.2. Layout Guidelines 7.4.4.3. Length Matching Rules 7.4.4.4. Spacing Guidelines 7.4.4.5. Layout Guidelines for DDR3 SDRAM Wide Interface (>72 bits) 7.4.4.6. Fly-By Network Design for Clock, Command, and Address Signals
7.4.5. Package Deskew x
7.4.5.1. DQ/DQS/DM Deskew 7.4.5.2. Address and Command Deskew 7.4.5.3. Package Deskew Recommendations for Cyclone® 10 Devices 7.4.5.4. Deskew Example 7.4.5.5. Package Migration
8. Cyclone® 10 GX EMIF IP Timing Closure x
8.1. Timing Closure 8.2. Timing Report DDR 8.3. Optimizing Timing 8.4. Early I/O Timing Estimation
8.1. Timing Closure x
8.1.1. Timing Analysis
8.1.1. Timing Analysis x
8.1.1.1. PHY or Core 8.1.1.2. I/O Timing
8.1.1.2. I/O Timing x
8.1.1.2.1. Read Capture 8.1.1.2.2. Write 8.1.1.2.3. Address and Command 8.1.1.2.4. DQS Gating / Postamble 8.1.1.2.5. Write Leveling
8.4. Early I/O Timing Estimation x
8.4.1. Performing Early I/O Timing Analysis
9. Optimizing Controller Performance x
9.1. Interface Standard 9.2. Bank Management Efficiency 9.3. Data Transfer 9.4. Improving Controller Efficiency
9.4. Improving Controller Efficiency x
9.4.1. Auto-Precharge Commands 9.4.2. Latency 9.4.3. Calibration 9.4.4. Bank Interleaving 9.4.5. Additive Latency and Bank Interleaving 9.4.6. User-Controlled Refresh 9.4.7. Frequency of Operation 9.4.8. Series of Reads or Writes 9.4.9. Data Reordering 9.4.10. Starvation Control 9.4.11. Command Reordering 9.4.12. Bandwidth 9.4.13. Enable Command Priority Control
9.4.2. Latency x
9.4.2.1. Additive Latency
9.4.6. User-Controlled Refresh x
9.4.6.1. Back-to-Back User-Controlled Refresh Usage
10. Cyclone® 10 GX EMIF IP Debugging x
10.1. Interface Configuration Performance Issues 10.2. Functional Issue Evaluation 10.3. Timing Issue Characteristics 10.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer 10.5. Hardware Debugging Guidelines 10.6. Categorizing Hardware Issues 10.7. Debugging Cyclone® 10 GX EMIF IP 10.8. Using the Traffic Generator with the Generated Design Example
10.1. Interface Configuration Performance Issues x
10.1.1. Interface Configuration Bottleneck and Efficiency Issues
10.2. Functional Issue Evaluation x
10.2.1. Intel® IP Memory Model 10.2.2. Vendor Memory Model 10.2.3. Transcript Window Messages 10.2.4. Modifying the Example Driver to Replicate the Failure
10.3. Timing Issue Characteristics x
10.3.1. Evaluating FPGA Timing Issues 10.3.2. Evaluating External Memory Interface Timing Issues
10.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer x
10.4.1. Signals to Monitor with the Signal Tap II Logic Analyzer
10.5. Hardware Debugging Guidelines x
10.5.1. Create a Simplified Design that Demonstrates the Same Issue 10.5.2. Measure Power Distribution Network 10.5.3. Measure Signal Integrity and Setup and Hold Margin 10.5.4. Vary Voltage 10.5.5. Operate at a Lower Speed 10.5.6. Determine Whether the Issue Exists in Previous Versions of Software 10.5.7. Determine Whether the Issue Exists in the Current Version of Software 10.5.8. Try A Different PCB 10.5.9. Try Other Configurations 10.5.10. Debugging Checklist
10.6. Categorizing Hardware Issues x
10.6.1. Signal Integrity Issues 10.6.2. Hardware and Calibration Issues
10.6.1. Signal Integrity Issues x
10.6.1.1. Characteristics of Signal Integrity Issues 10.6.1.2. Evaluating SignaI Integrity Issues
10.6.1.2. Evaluating SignaI Integrity Issues x
10.6.1.2.1. Skew 10.6.1.2.2. Crosstalk 10.6.1.2.3. Power System 10.6.1.2.4. Clock Signals 10.6.1.2.5. Read Data Valid Window and Eye Diagram 10.6.1.2.6. Write Data Valid Window and Eye Diagram 10.6.1.2.7. OCT and ODT Usage
10.6.2. Hardware and Calibration Issues x
10.6.2.1. Postamble Timing Issues and Margin 10.6.2.2. Intermittent Issue Evaluation
10.7. Debugging Cyclone® 10 GX EMIF IP x
10.7.1. Debugging With the External Memory Interface Debug Toolkit 10.7.2. On-Chip Debug Port for Cyclone® 10 GX EMIF IP 10.7.3. Efficiency Monitor and Protocol Checker
10.7.1. Debugging With the External Memory Interface Debug Toolkit x
10.7.1.1. User Interface 10.7.1.2. Communication 10.7.1.3. Setup and Use 10.7.1.4. Configuring Your EMIF IP for Use with the Debug Toolkit 10.7.1.5. Reports 10.7.1.6. Driver Margining for Cyclone® 10 GX EMIF IP 10.7.1.7. Example Tcl Script for Running the EMIF Debug Toolkit
10.7.1.4. Configuring Your EMIF IP for Use with the Debug Toolkit x
10.7.1.4.1. Daisy-Chaining Additional EMIF IP Cores for Debugging 10.7.1.4.2. General Workflow 10.7.1.4.3. Linking the Project to a Device 10.7.1.4.4. Establishing Communication to Connections 10.7.1.4.5. Selecting an Active Interface
10.7.2. On-Chip Debug Port for Cyclone® 10 GX EMIF IP x
10.7.2.1. EMIF On-Chip Debug Port 10.7.2.2. Access Protocol
10.7.3. Efficiency Monitor and Protocol Checker x
10.7.3.1. Including the Efficiency Monitor and Protocol Checker in Your Generated IP 10.7.3.2. Running the Efficiency Monitor with the External Memory Debug Toolkit 10.7.3.3. Communicating Directly to the Efficiency Monitor and Protocol Checker
1. Release Information
2. External Memory Interfaces Cyclone® 10 GX FPGA IP Introduction
3. Cyclone® 10 GX EMIF IP Product Architecture
4. Cyclone® 10 GX EMIF IP End-User Signals
5. Cyclone® 10 GX EMIF – Simulating Memory IP
6. Cyclone® 10 GX EMIF IP for DDR3
7. Cyclone® 10 GX EMIF IP for LPDDR3
8. Cyclone® 10 GX EMIF IP Timing Closure
9. Optimizing Controller Performance
10. Cyclone® 10 GX EMIF IP Debugging
11. External Memory Interfaces Cyclone® 10 GX FPGA IP User Guide Archives
12. Document Revision History for Cyclone® 10 GX External Memory Interfaces FPGA IP User Guide

6.3.3.2. x4 DIMM Implementation

DIMMS using a x4 DQS configuration require remapping of the DQS signals to achieve compatibility between the EMIF IP and the JEDEC standard DIMM socket connections.

The necessary remapping is shown in the table below. You can implement this DQS remapping in either RTL logic or in your schematic wiring connections.

Table 115.  Mapping of DQS Signals Between DIMM and the EMIF IP
DIMM   Quartus® Prime EMIF IP
DQS0 DQ[3:0]   DQS0 DQ[3:0]
DQS9 DQ[7:4]   DQS1 DQ[7:4]
DQS1 DQ[11:8]   DQS2 DQ[11:8]
DQS10 DQ[15:12]   DQS3 DQ[15:12]
DQS2 DQ[19:16]   DQS4 DQ[19:16]
DQS11 DQ[23:20]   DQS5 DQ[23:20]
DQS3 DQ[27:24]   DQS6 DQ[27:24]
DQS12 DQ[31:28]   DQS7 DQ[31:28]
DQS4 DQ[35:32]   DQS8 DQ[35:32]
DQS13 DQ[39:36]   DQS9 DQ[39:36]
DQS5 DQ[43:40]   DQS10 DQ[43:40]
DQS14 DQ[47:44]   DQS11 DQ[47:44]
DQS6 DQ[51:48]   DQS12 DQ[51:48]
DQS15 DQ[55:52]   DQS13 DQ[55:52]
DQS7 DQ[59:56]   DQS14 DQ[59:56]
DQS16 DQ[63:60]   DQS15 DQ[63:60]
DQS8 DQ[67:64]   DQS16 DQ[67:64]
DQS17 DQ[71:68]   DQS17 DQ[71:68]

Data Bus Connection Mapping Flow

  1. Connect all FPGA DQ pins accordingly to DIMM DQ pins. No remapping is required.
  2. DQS/DQSn remapping is required either on the board schematics or in the RTL code.
  3. An example mapping is shown below, with reference to the above table values:
    FPGA (DQS0) to DIMM (DQS0)
FPGA (DQS1) to DIMM (DQS9)
FPGA (DQS2) to DIMM (DQS1)
...
FPGA (DQS16) to DIMM (DQS8)
FPGA (DQS17) to DIMM (DQS17)

When designing a board to support x4 DQS groups, Intel® recommends that you make it compatible for x8 mode, for the following reasons:

  • Provides the flexibility of x4 and x8 DIMM support.
  • Allows use of x8 DQS group connectivity rules.
  • Allows use of x8 timing rules for matching. Intel® strongly recommends adhering to x4/x8 interoperability rules when designing a DIMM interface, even if the primary use case is to support x4 DIMMs only, because doing so facilitates debug and future migration capabilities. Regardless, the rules for length matching for two nibbles in a x4 interface must match those of the signals for a corresponding x8 interface, as the data terminations are turned on and off at the same time for both x4 DQS groups in an I/O lane. If the two x4 DQS groups were to have significantly different trace delays, it could adversely affect signal integrity.

Necessary checks to perform if the DQS groups are remapped in the RTL code

  1. In the Pin Planner, view x8 DQS groups and check the following:
    1. Check that DQ[7:0] is in x8 group, DQ[15:8] is in another DQS group, and so forth.
    2. Check that DSQ0 and DQS9 are in the DQS group with DQ[7:0], DQS1 and DQS10 are in the DQS group with DQ[15:8], and so forth. This is the DIMM numbering convention column shown in the table at the beginning of this topic.
  2. In the Pin Planner, view x4 DQS groups and check the following:
    1. Check that all the DQS signals are on pins marked S and Sbar.
  3. On the schematic, check the following DIMM connections:
    1. Check that DQSx on the DIMM maps to the DQSx on the FPGA pinout (for values of x from 0 to 17).
    2. Check that DQy on the DIMM maps to the DQy on the FPGA pinout. Note that there is scope for swapping pins within the x4 /x8 DQS group to optimize the PCB layout.

Necessary checks to perform if the DQS groups are remapped on the schematic

  1. In the Pin Planner, view x8 DQS groups and check the following:
    1. Check that DQ[7:0] is in x8 group, DQ[15:8] is in another DQS group, and so forth.
    2. Check that DSQ0 and DQS1 are in the DQS group with DQ[7:0], DQS2 and DQS3 are in the DQS group with DQ[15:8], and so forth. This is the Quartus® Prime EMIF IP mapping shown in the table at the beginning of this topic.
  2. In the Pin Planner, view x4 DQS groups and check the following:
    1. Check that all the DQS signals are on pins marked S and Sbar.
  3. On the schematic, check the following DIMM connections:
    1. Referring to the table above, check that DQS has the remapping between the FPGA ( Quartus® Prime EMIF IP) and DIMM pinout (DIMM).
    2. Check that DQy on the DIMM maps to the DQy on the FPGA pinout. Note that there is scope for swapping pins within the x4 /x8 DQS group to optimize the PCB layout.
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