Intel Agilex® 7 FPGA F-Series Transceiver-SoC Development Kit User Guide

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ID 683752
Date 4/21/2023
Public
Document Table of Contents
Document Table of Contents x
1. Overview 2. Getting Started 3. Powering Up the Development Kit 4. Board Test System 5. Development Kit Hardware and Configuration 6. Custom Projects for the Development Kit 7. Revision History A. Development Kit Components B. Additional Information
1. Overview x
1.1. Block Diagram 1.2. Feature Summary 1.3. Box Contents 1.4. Recommended Operating Conditions
2. Getting Started x
2.1. Intel® Quartus® Prime Software and Driver Installation 2.2. Quick Start Guide 2.3. Design Examples
3. Powering Up the Development Kit x
3.1. Default Settings 3.2. Power Up 3.3. Perform board restore
3.3. Perform board restore x
3.3.1. Restore board System Intel® MAX® 10 with default factory image 3.3.2. Restore board QSPI flash with the default factory image
4. Board Test System x
4.1. Setting Up the BTS GUI Running Environment 4.2. Test the functionality of the Development Kits 4.3. Control on-board clock through Clock Controller GUI 4.4. Control on-board power regulator through Power Monitor GUI
4.1. Setting Up the BTS GUI Running Environment x
4.1.1. Downloading OpenJDK 4.1.2. Downloading OpenJFX 4.1.3. Installing OpenJDK and OpenJFX 4.1.4. Installing the Quartus Prime Software 4.1.5. Running the BTS GUI
4.2. Test the functionality of the Development Kits x
4.2.1. The Configure Menu 4.2.2. The Sys Info Tab 4.2.3. The GPIO Tab 4.2.4. The XCVR Tab 4.2.5. The DDR4 Tab 4.2.6. The SSS Tab 4.2.7. The EEPROM Tab
5. Development Kit Hardware and Configuration x
5.1. Configure FPGA and access HPS Debug Access Port by JTAG 5.2. Configure the FPGA device by AS modes (Default Mode) 5.3. Configure the FPGA device by AvST modes 5.4. Daughter Cards
5.4. Daughter Cards x
5.4.1. HPS Out of Box Experience (OOBE) Daughter Card 5.4.2. HPS NAND Daughter Card
6. Custom Projects for the Development Kit x
6.1. Add SmartVID settings in Intel® Quartus® Prime QSF file 6.2. Golden Top
A. Development Kit Components x
A.1. System Management A.2. Power A.3. Clocks A.4. General Input/Output A.5. Memory Interfaces A.6. Communication Interfaces A.7. Daughter Cards
B. Additional Information x
B.1. Safety and Regulatory Information B.2. Compliance Information
B.1. Safety and Regulatory Information x
B.1.1. Safety Warnings B.1.2. Safety Cautions
1. Overview
2. Getting Started
3. Powering Up the Development Kit
4. Board Test System
5. Development Kit Hardware and Configuration
6. Custom Projects for the Development Kit
7. Revision History
A. Development Kit Components
B. Additional Information

1.4. Recommended Operating Conditions

Table 2.  Recommended Operating Conditions
Operating Condition Range of Values
Ambient operating temperature range 0 °C to 45 °C
ICC load current 100 A
ICC load transient percentage 200 A/µs
FPGA maximum power supported by active heatsink/fan 120 W

When handling the board, it is important to observe static discharge precautions.

CAUTION:
Without proper anti-static handling, the board can be damaged. Therefore, use anti-static handling precautions when touching the development kit.
CAUTION:
This development kit should not be operated in a vibration environment.
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