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1. About the PHY Lite for Parallel Interfaces IP
2. PHY Lite for Parallel Interfaces Intel® FPGA IP (phylite_ph2) for Intel Agilex® 7 M-Series Devices
3. PHY Lite for Parallel Interfaces Intel® FPGA IP (altera_phylite_s20) for Intel Agilex® 7 F-Series and I-Series Devices
4. PHY Lite for Parallel Interfaces Intel® FPGA IP for Intel® Stratix® 10 Devices
5. PHY Lite for Parallel Interfaces Intel® FPGA IP for Intel® Arria® 10 and Intel® Cyclone® 10 GX Devices
6. PHY Lite for Parallel Interfaces Intel® FPGA IP User Guide Document Archives
7. Document Revision History for the PHY Lite for Parallel Interfaces Intel® FPGA IP User Guide
3.2.1. Intel Agilex® 7 F-Series and I-Series I/O Sub-bank Interconnects
3.2.2. Intel Agilex® 7 F-Series and I-Series Input DQS/Strobe Tree
3.2.3. PHY Lite for Parallel Interfaces Intel® FPGA IP for Intel Agilex® 7 F-Series and I-Series Devices Top Level Interfaces
3.2.4. Dynamic Reconfiguration
3.2.5. I/O Timing
4.5.6.4.1. Timing Closure: Dynamic Reconfiguration
4.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
4.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
4.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
4.5.6.4.5. I/O Timing Violation
4.5.6.4.6. Internal FPGA Path Timing Violation
5.5.6.4.1. Timing Closure: Dynamic Reconfiguration
5.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
5.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
5.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
5.5.6.4.5. I/O Timing Violation
5.5.6.4.6. Internal FPGA Path Timing Violation
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2.2. Functional Description
The PHY Lite for Parallel Interfaces Intel® FPGA IP utilizes the I/O banks in Intel Agilex® 7 M-Series devices. Each I/O bank has eight I/O lanes with 12 pins in each lane, providing a total of 96 pins per bank. Each bank contains pins that you can use for data and pins that are reserved for strobe, reference clock, and RZQ.
Figure 1. M-Series I/O Bank Structure (Die Top View)This figure shows the I/O bank structure of the M-Series device. The figure shows the view of the die as shown in the Intel® Quartus® Prime Chip Planner. In the Pin Planner, this corresponds to the "Bottom View". Different device packages have different number of I/O banks. Refer to the device pin-out files for available I/O banks and the locations of the SDM and HPS shared I/O banks for each device package.
Section Content
PHY Lite for Parallel Interfaces Intel FPGA IP for M-Series Devices Top Level Interfaces
Dynamic Reconfiguration
I/O Timing
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