Stratix® 10 Embedded Memory User Guide

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ID 683423
Date 3/29/2024
Public
Document Table of Contents
Document Table of Contents x
1. Stratix® 10 Embedded Memory Overview 2. Stratix® 10 Embedded Memory Architecture and Features 3. Stratix® 10 Embedded Memory Design Considerations 4. Stratix® 10 Embedded Memory IP References 5. Intel Stratix 10 Embedded Memory Design Example 6. Stratix® 10 Embedded Memory User Guide Archives 7. Document Revision History for the Stratix® 10 Embedded Memory User Guide
1. Stratix® 10 Embedded Memory Overview x
1.1. Stratix® 10 Embedded Memory Features
2. Stratix® 10 Embedded Memory Architecture and Features x
2.1. Byte Enable in Stratix® 10 Embedded Memory Blocks 2.2. Address Clock Enable Support 2.3. Asynchronous Clear and Synchronous Clear 2.4. Memory Blocks Error Correction Code (ECC) Support 2.5. Force-to-Zero 2.6. Coherent Read Memory 2.7. Freeze Logic 2.8. True Dual Port Dual Clock Emulator 2.9. 'X' Propagation Support in Simulation 2.10. Stratix® 10 Supported Embedded Memory IPs 2.11. Stratix® 10 Embedded Memory Clocking Modes 2.12. Stratix® 10 Embedded Memory Configurations 2.13. Initial Value of Read and Write Address Registers
2.1. Byte Enable in Stratix® 10 Embedded Memory Blocks x
2.1.1. Byte Enable Controls 2.1.2. Data Byte Output 2.1.3. Byte Enable Behavior
2.4. Memory Blocks Error Correction Code (ECC) Support x
2.4.1. Parity Bit 2.4.2. ECC Parity Flip 2.4.3. ECC Read-During-Write Behavior 2.4.4. Error Correction Code Truth Table
2.6. Coherent Read Memory x
2.6.1. Forwarding Logic
2.8. True Dual Port Dual Clock Emulator x
2.8.1. Reducing the DCFIFO Depth
2.11. Stratix® 10 Embedded Memory Clocking Modes x
2.11.1. Single Clock Mode 2.11.2. Read/Write Clock Mode 2.11.3. Input/Output Clock Mode 2.11.4. Asynchronous/Synchronous Clears in Clocking Modes 2.11.5. Output Read Data in Simultaneous Read/Write 2.11.6. Independent Clock Enables in Clocking Modes
2.12. Stratix® 10 Embedded Memory Configurations x
2.12.1. Mixed-Width Port Configurations
3. Stratix® 10 Embedded Memory Design Considerations x
3.1. Consider the Memory Block Selection 3.2. Consider the Concurrent Read Behavior 3.3. Customize Read-During-Write Behavior 3.4. Consider Power-Up State and Memory Initialization 3.5. Reduce Power Consumption 3.6. Avoid Providing Non-Deterministic Input 3.7. Avoid Changing Clock Signals and Other Control Signals Simultaneously 3.8. Including the Reset Release Intel® FPGA IP in Your Design 3.9. Resource and Timing Optimization Feature in MLAB Blocks 3.10. Consider the Memory Depth Setting 3.11. Consider Registering the Memory Output
3.3. Customize Read-During-Write Behavior x
3.3.1. Same-Port Read-During-Write Mode 3.3.2. Mixed-Port Read-During-Write Mode
4. Stratix® 10 Embedded Memory IP References x
4.1. On Chip Memory RAM and ROM Intel® FPGA IPs 4.2. eSRAM Intel® FPGA IP 4.3. FIFO Intel® FPGA IP 4.4. FIFO2 Intel® FPGA IP 4.5. Shift Register (RAM-based) Intel® FPGA IP
4.1. On Chip Memory RAM and ROM Intel® FPGA IPs x
4.1.1. Release Information for RAM and ROM Intel® FPGA IPs 4.1.2. RAM: 1-PORT Intel® FPGA IP Parameters 4.1.3. RAM: 2-PORT Intel® FPGA IP Parameters 4.1.4. RAM: 4-PORT Intel® FPGA IP Parameters 4.1.5. ROM: 1-PORT Intel® FPGA IP Parameters 4.1.6. ROM: 2-PORT Intel® FPGA IP Parameters 4.1.7. RAM and ROM Interface Signals 4.1.8. Changing Parameter Settings Manually
4.1.8. Changing Parameter Settings Manually x
4.1.8.1. RAM and ROM Parameter Settings
4.2. eSRAM Intel® FPGA IP x
4.2.1. Release Information for eSRAM Intel® FPGA IP 4.2.2. eSRAM System Features 4.2.3. eSRAM Intel® FPGA IP Parameters 4.2.4. eSRAM Intel® FPGA IP Interface Signals 4.2.5. eSRAM Intel® FPGA IP Simulation Walk-Through 4.2.6. eSRAM Timing Diagrams
4.2.2. eSRAM System Features x
4.2.2.1. eSRAM Specifications 4.2.2.2. eSRAM Usage Model
4.3. FIFO Intel® FPGA IP x
4.3.1. Release Information for FIFO Intel® FPGA IP 4.3.2. Configuration Methods 4.3.3. Specifications 4.3.4. FIFO Functional Timing Requirements 4.3.5. SCFIFO ALMOST_EMPTY Functional Timing 4.3.6. FIFO Output Status Flag and Latency 4.3.7. FIFO Metastability Protection and Related Options 4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect 4.3.9. SCFIFO and DCFIFO Show-Ahead Mode 4.3.10. Different Input and Output Width 4.3.11. DCFIFO Timing Constraint Setting 4.3.12. Coding Example for Manual Instantiation 4.3.13. Design Example 4.3.14. Gray-Code Counter Transfer at the Clock Domain Crossing 4.3.15. Guidelines for Embedded Memory ECC Feature 4.3.16. FIFO Intel® FPGA IP Parameters 4.3.17. Reset Scheme
4.3.3. Specifications x
4.3.3.1. Verilog HDL Prototype 4.3.3.2. VHDL Component Declaration 4.3.3.3. VHDL LIBRARY-USE Declaration 4.3.3.4. FIFO Signals 4.3.3.5. FIFO Parameter Settings
4.3.8. FIFO Synchronous Clear and Asynchronous Clear Effect x
4.3.8.1. Recovery and Removal Timing Violation Warnings when Compiling a DCFIFO
4.3.11. DCFIFO Timing Constraint Setting x
4.3.11.1. Embedded Timing Constraint 4.3.11.2. User Configurable Timing Constraint
4.3.11.2. User Configurable Timing Constraint x
4.3.11.2.1. SDC Commands
4.4. FIFO2 Intel® FPGA IP x
4.4.1. Release Information for FIFO2 Intel® FPGA IP 4.4.2. Configuration Methods 4.4.3. Fmax Target Measuring Methodology 4.4.4. Performance Considerations 4.4.5. FIFO2 Intel® FPGA IP Features 4.4.6. FIFO2 Intel® FPGA IP Parameters 4.4.7. FIFO2 Intel® FPGA IP Interface Signals 4.4.8. Reset and Clock Schemes
4.4.5. FIFO2 Intel® FPGA IP Features x
4.4.5.1. FIFO2 Specifications
4.4.6. FIFO2 Intel® FPGA IP Parameters x
4.4.6.1. FIFO2 Parameter Settings
4.4.7. FIFO2 Intel® FPGA IP Interface Signals x
4.4.7.1. SCFIFO Signals 4.4.7.2. DCFIFO Signals
4.4.8. Reset and Clock Schemes x
4.4.8.1. Clock Domains 4.4.8.2. Reset
4.4.8.2. Reset x
4.4.8.2.1. FIFO2 Intel® FPGA IP Reset Guidelines
4.5. Shift Register (RAM-based) Intel® FPGA IP x
4.5.1. Release Information for Shift Register (RAM-based) Intel® FPGA IP 4.5.2. Shift Register (RAM-based) Intel® FPGA IP Features 4.5.3. Shift Register (RAM-based) Intel® FPGA IP General Description 4.5.4. Shift Register (RAM-based) Intel® FPGA IP Parameter Settings 4.5.5. Shift Register Ports and Parameters Setting
5. Intel Stratix 10 Embedded Memory Design Example x
5.1. FIFO and FIFO2 Design Example
5.1. FIFO and FIFO2 Design Example x
5.1.1. Generating the Design Example 5.1.2. Simulating the Design Example
5.1.2. Simulating the Design Example x
5.1.2.1. Simulation Results
1. Stratix® 10 Embedded Memory Overview
2. Stratix® 10 Embedded Memory Architecture and Features
3. Stratix® 10 Embedded Memory Design Considerations
4. Stratix® 10 Embedded Memory IP References
5. Intel Stratix 10 Embedded Memory Design Example
6. Stratix® 10 Embedded Memory User Guide Archives
7. Document Revision History for the Stratix® 10 Embedded Memory User Guide

4.2.2.1. eSRAM Specifications

The following table summarizes the specifications of the eSRAM Intel® FPGA IP.
Table 31.  eSRAM Specifications
Feature Detail Value Description
Clock Frequency 6

-1

-2

-3

200 MHz - 750 MHz

200 MHz - 640 MHz

200 MHz - 500 MHz 7
—
Bank Capacity

without ECC

with ECC

144 Kb

128 Kb

Each bank is (2048) 2K x 72 bits
Banks per Channel —

42

 —
Channel Capacity

without ECC

with ECC

5.90625 Mb

5.25 Mb

 —
Channels per eSRAM —

8

—
eSRAM Capacity

without ECC

with ECC

47.25 Mb

42 Mb

 —
Interface Data Width

without ECC

with ECC

x72

 Maximum width
Read Latency 8

Normal

Low Power

10 +2 9

11 + 2 9

These latencies are fixed, whether ECC is enabled or not.
Write Latency — 0 +1 10 There is a zero cycle latency for write commands issued to the eSRAM.
Power (per eSRAM system)

Industrial

Extended

1.15 W - 1.5 W

2.28 W - 3.31 W

Low Power mode to Normal mode.
6 The input clock source for eSRAM must not exceed 20 ps peak-to-peak, or 1.42 ps RMS at 1e-12 BER, 1.22 ps at 1e-16 BER.
7 In Speed Grade 3 devices, the following clock frequency range is not supported:
  • 466.51 MHz - 499.99 MHz
  • 233.26 MHz - 249.99 MHz
8 Read latency is measured from a read command being presented to the interface to valid read data being returned.
9 +2 on read latency is added due to registers interfacing with eSRAM required to meet routing and timing requirement.
10 +1 on read latency is added due to registers interfacing with eSRAM required to meet routing and timing requirement.
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