Intel® Arria® 10 Device Overview

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ID 683332
Date 2/14/2022
Public
Document Table of Contents

Package Plan

Table 7.  Package Plan for Intel® Arria® 10 GX Devices (U19, F27, and F29) Refer to I/O and High Speed I/O in Intel® Arria® 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and LVDS channels in each device package.

Product Line

U19

(19 mm × 19 mm, 484-pin UBGA)

F27

(27 mm × 27 mm, 672-pin FBGA)

F29

(29 mm × 29 mm, 780-pin FBGA)

3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR
GX 160 48 192 6 48 192 12 48 240 12
GX 220 48 192 6 48 192 12 48 240 12
GX 270 48 192 12 48 312 12
GX 320 48 192 12 48 312 12
GX 480 48 312 12
Table 8.  Package Plan for Intel® Arria® 10 GX Devices (F34, F35, NF40, and KF40) Refer to I/O and High Speed I/O in Intel® Arria® 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and LVDS channels in each device package.

Product Line

F34

(35 mm × 35 mm, 1152-pin FBGA)

F35

(35 mm × 35 mm, 1152-pin FBGA)

KF40

(40 mm × 40 mm, 1517-pin FBGA)

NF40

(40 mm × 40 mm, 1517-pin FBGA)

3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR
GX 270 48 336 24 48 336 24
GX 320 48 336 24 48 336 24
GX 480 48 444 24 48 348 36
GX 570 48 444 24 48 348 36 96 600 36 48 540 48
GX 660 48 444 24 48 348 36 96 600 36 48 540 48
GX 900 504 24 600 48
GX 1150 504 24 600 48
Table 9.  Package Plan for Intel® Arria® 10 GX Devices (RF40, NF45, SF45, and UF45) Refer to I/O and High Speed I/O in Intel® Arria® 10 Devices chapter for the number of 3 V I/O, LVDS I/O, and LVDS channels in each device package.

Product Line

RF40

(40 mm × 40 mm, 1517-pin FBGA)

NF45

(45 mm × 45 mm) 1932-pin FBGA)

SF45

(45 mm × 45 mm) 1932-pin FBGA)

UF45

(45 mm × 45 mm) 1932-pin FBGA)

3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR 3 V I/O LVDS I/O XCVR
GX 900 342 66 768 48 624 72 480 96
GX 1150 342 66 768 48 624 72 480 96

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