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1. About the PHY Lite for Parallel Interfaces IP
2. PHY Lite for Parallel Interfaces Intel Agilex 7 FPGA IP for M-Series
3. PHY Lite for Parallel Interfaces Intel Agilex 7 FPGA IP for F-Series and I-Series
4. PHY Lite for Parallel Interfaces Intel Stratix 10 FPGA IP
5. PHY Lite for Parallel Interfaces Intel Arria 10 and Intel Cyclone 10 GX FPGA IPs
6. PHY Lite for Parallel Interfaces Intel® FPGA IP User Guide Document Archives
7. Document Revision History for the PHY Lite for Parallel Interfaces IP User Guide
4.5.6.4.1. Timing Closure: Dynamic Reconfiguration
4.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
4.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
4.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
4.5.6.4.5. I/O Timing Violation
4.5.6.4.6. Internal FPGA Path Timing Violation
5.5.6.4.1. Timing Closure: Dynamic Reconfiguration
5.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
5.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
5.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
5.5.6.4.5. I/O Timing Violation
5.5.6.4.6. Internal FPGA Path Timing Violation
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3.2. Functional Description
The PHY Lite for Parallel Interfaces Intel Agilex® 7 FPGA IP utilizes the I/O banks in Intel Agilex® 7 F-Series and I-Series devices. Each I/O bank has two I/O sub-banks in each device. The top sub-bank is placed near the edge of the die, and the bottom sub-bank is placed near the FPGA core.
Each sub-bank contains the following components:
- Hard memory controller
- I/O PLL and PHY clock trees
- DLL
- Input DQS/strobe trees
- 48 pins, organized into four I/O lanes of 12 pins each
Figure 15. Intel Agilex® 7 F-Series and I-Series I/O Bank Structure (Die Top View)This figure shows the I/O bank structure of the Intel Agilex® 7 F-Series and I-Series devices. The figure shows the view of the die as shown in the Intel® Quartus® Prime Chip Planner. In the Pin Planner, this corresponds to the "Bottom View". Different device packages have different number of I/O banks. Refer to the device pin-out files for available I/O banks and the locations of the SDM and HPS shared I/O banks for each device package.