PHY Lite for Parallel Interfaces FPGA IP User Guide

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ID 683716
Date 3/31/2025
Public
Document Table of Contents
Document Table of Contents x
1. About the PHY Lite for Parallel Interfaces IP 2. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 3 C-Series Devices 3. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 5 D-Series and E-Series Devices 4. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 M-Series Devices 5. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 F-Series and I-Series Devices 6. PHY Lite for Parallel Interfaces FPGA IP for Stratix® 10 Devices 7. PHY Lite for Parallel Interfaces FPGA IP for Arria® 10 and Cyclone® 10 GX Devices 8. PHY Lite for Parallel Interfaces FPGA IP User Guide Document Archives 9. Document Revision History for the PHY Lite for Parallel Interfaces FPGA IP User Guide
1. About the PHY Lite for Parallel Interfaces IP x
1.1. Device Family Support 1.2. Features
2. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 3 C-Series Devices x
2.1. Release Information 2.2. Functional Description 2.3. Getting Started 2.4. I/O Standards 2.5. Design Guidelines
2.2. Functional Description x
2.2.1. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 3 C-Series Devices Top Level Interfaces 2.2.2. Dynamic Reconfiguration 2.2.3. Design Example
2.2.1. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 3 C-Series Devices Top Level Interfaces x
2.2.1.1. Clocks 2.2.1.2. Output Path 2.2.1.3. Input Path
2.2.2. Dynamic Reconfiguration x
2.2.2.1. Calibration IP 2.2.2.2. Dynamic Reconfigurable Delays 2.2.2.3. Register Map
2.2.3. Design Example x
2.2.3.1. Generate the Design Example 2.2.3.2. Verify Simulation Design Examples using Tester IP
2.2.3.1. Generate the Design Example x
2.2.3.1.1. Design Example without Dynamic Reconfiguration 2.2.3.1.2. Design Example with Dynamic Reconfiguration
2.2.3.1.1. Design Example without Dynamic Reconfiguration x
2.2.3.1.1.1. Generate the Synthesis Design Example without Dynamic Reconfiguration 2.2.3.1.1.2. Generate the Simulation Design Example Without Dynamic Reconfiguration 2.2.3.1.1.3. Run the Simulation Design Example Without Dynamic Reconfiguration
2.2.3.1.2. Design Example with Dynamic Reconfiguration x
2.2.3.1.2.1. Generate the Synthesis Design Example With Dynamic Reconfiguration 2.2.3.1.2.2. Generate the Simulation Design Example with Dynamic Reconfiguration 2.2.3.1.2.3. Run the Simulation Design Example Without Dynamic Reconfiguration
2.2.3.2. Verify Simulation Design Examples using Tester IP x
2.2.3.2.1. PHY Lite Interface 2.2.3.2.2. I/O Model 2.2.3.2.3. IOSSM Tester 2.2.3.2.4. Write Test 2.2.3.2.5. Read Test 2.2.3.2.6. Calbus Test
2.3. Getting Started x
2.3.1. Parameter Settings 2.3.2. Signals
2.3.2. Signals x
2.3.2.1. Clock and Reset Interface Signals 2.3.2.2. Output Path Signals 2.3.2.3. Input Path Signals
2.5. Design Guidelines x
2.5.1. DQS Trees 2.5.2. Pin Placement Restrictions 2.5.3. Maximum Number of DQ Data Pin Configurations
2.5.3. Maximum Number of DQ Data Pin Configurations x
2.5.3.1. Automatic and Manual Pin Placement 2.5.3.2. Single-Ended Pin Configurations 2.5.3.3. Differential Pin Configurations 2.5.3.4. Mixed Pin Configurations
3. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 5 D-Series and E-Series Devices x
3.1. Release Information 3.2. Functional Description 3.3. Getting Started 3.4. I/O Standards 3.5. Design Example
3.2. Functional Description x
3.2.1. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 5 D-Series and E-Series Devices Top Level Interfaces 3.2.2. Dynamic Reconfiguration
3.2.1. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 5 D-Series and E-Series Devices Top Level Interfaces x
3.2.1.1. Clocks 3.2.1.2. Output Path 3.2.1.3. Input Path
3.2.2. Dynamic Reconfiguration x
3.2.2.1. Calibration IP 3.2.2.2. Dynamic Reconfigurable Delays 3.2.2.3. Register Map
3.3. Getting Started x
3.3.1. Parameter Settings 3.3.2. Signals
3.3.2. Signals x
3.3.2.1. Clock and Reset Interface Signals 3.3.2.2. Output Path Signals 3.3.2.3. Input Path Signals
3.4. I/O Standards x
3.4.1. Design Guidelines
3.4.1. Design Guidelines x
3.4.1.1. DQS Trees 3.4.1.2. Pin Placement Restrictions 3.4.1.3. Maximum Number of DQ Data Pin Configurations
3.4.1.3. Maximum Number of DQ Data Pin Configurations x
3.4.1.3.1. Automatic and Manual Pin Placement 3.4.1.3.2. Single-Ended Pin Configurations 3.4.1.3.3. Differential Pin Configurations 3.4.1.3.4. Mixed Pin Configurations
3.5. Design Example x
3.5.1. Generate the Design Example 3.5.2. Verify Simulation Design Examples using Tester IP
3.5.1. Generate the Design Example x
3.5.1.1. Design Example without Dynamic Reconfiguration 3.5.1.2. Design Example with Dynamic Reconfiguration
3.5.1.1. Design Example without Dynamic Reconfiguration x
3.5.1.1.1. Generate the Synthesis Design Example without Dynamic Reconfiguration 3.5.1.1.2. Generate the Simulation Design Example Without Dynamic Reconfiguration 3.5.1.1.3. Run the Simulation Design Example Without Dynamic Reconfiguration
3.5.1.2. Design Example with Dynamic Reconfiguration x
3.5.1.2.1. Generate the Synthesis Design Example With Dynamic Reconfiguration 3.5.1.2.2. Generate the Simulation Design Example with Dynamic Reconfiguration 3.5.1.2.3. Run the Simulation Design Example Without Dynamic Reconfiguration
3.5.2. Verify Simulation Design Examples using Tester IP x
3.5.2.1. PHY Lite Interface 3.5.2.2. I/O Model 3.5.2.3. IOSSM Tester 3.5.2.4. Write Test 3.5.2.5. Read Test 3.5.2.6. Calbus Test
4. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 M-Series Devices x
4.1. Release Information 4.2. Functional Description 4.3. Getting Started 4.4. I/O Standards 4.5. Design Guidelines 4.6. Design Example
4.2. Functional Description x
4.2.1. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 M-Series Devices Top Level Interfaces 4.2.2. Dynamic Reconfiguration 4.2.3. I/O Timing
4.2.1. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 M-Series Devices Top Level Interfaces x
4.2.1.1. Clocks 4.2.1.2. Output Path 4.2.1.3. Input Path
4.2.1.1. Clocks x
4.2.1.1.1. Clock Frequency Relationships
4.2.2. Dynamic Reconfiguration x
4.2.2.1. Calibration IP 4.2.2.2. Dynamic Reconfigurable Delays 4.2.2.3. Register Map
4.3. Getting Started x
4.3.1. Parameter Settings 4.3.2. Signals
4.3.2. Signals x
4.3.2.1. Clock and Reset Interface Signals 4.3.2.2. Output Path Signals 4.3.2.3. Input Path Signals
4.5. Design Guidelines x
4.5.1. DQS Trees 4.5.2. Pin Placement Restrictions
4.6. Design Example x
4.6.1. Generating the Design Example 4.6.2. Verifying Simulation Design Examples using Tester IP
4.6.1. Generating the Design Example x
4.6.1.1. Design Example without Dynamic Reconfiguration 4.6.1.2. Dynamic Reconfiguration Design Examples
4.6.1.1. Design Example without Dynamic Reconfiguration x
4.6.1.1.1. Generating the Synthesis Design Example 4.6.1.1.2. Generating the Simulation Design Example
4.6.1.2. Dynamic Reconfiguration Design Examples x
4.6.1.2.1. Generating the Synthesis Design Example 4.6.1.2.2. Generating the Simulation Design Example
5. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 F-Series and I-Series Devices x
5.1. Release Information 5.2. Functional Description 5.3. Getting Started 5.4. I/O Standards 5.5. Design Guidelines 5.6. Design Example
5.2. Functional Description x
5.2.1. Agilex™ 7 F-Series and I-Series I/O Sub-bank Interconnects 5.2.2. Agilex™ 7 F-Series and I-Series Input DQS/Strobe Tree 5.2.3. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 F-Series and I-Series Devices Top Level Interfaces 5.2.4. Dynamic Reconfiguration 5.2.5. I/O Timing
5.2.3. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 F-Series and I-Series Devices Top Level Interfaces x
5.2.3.1. Clocks 5.2.3.2. Output Path 5.2.3.3. Input Path
5.2.3.1. Clocks x
5.2.3.1.1. Clock Frequency Relationships
5.2.4. Dynamic Reconfiguration x
5.2.4.1. Connectivity 5.2.4.2. Reconfiguration Features and Register Addressing 5.2.4.3. Dynamic Reconfiguration Guidelines
5.2.4.2. Reconfiguration Features and Register Addressing x
5.2.4.2.1. Control Registers Addresses 5.2.4.2.2. Control Registers
5.2.4.3. Dynamic Reconfiguration Guidelines x
5.2.4.3.1. Strobe Enable Window Calibration 5.2.4.3.2. Output and Strobe Enable Minimum and Maximum Phase Settings 5.2.4.3.3. Input DQ/DQS Delay Chains Maximum Values
5.3. Getting Started x
5.3.1. Parameter Settings 5.3.2. Signals
5.3.1. Parameter Settings x
5.3.1.1. Read Latency 5.3.1.2. Write Latency
5.3.2. Signals x
5.3.2.1. Clock and Reset Interface Signals 5.3.2.2. Output Path Signals 5.3.2.3. Input Path Signals
5.4. I/O Standards x
5.4.1. Input Buffer Reference Voltage (VREF) 5.4.2. On-Chip Termination (OCT)
5.4.2. On-Chip Termination (OCT) x
5.4.2.1. RZQ_GROUP Assignment
5.5. Design Guidelines x
5.5.1. Guidelines: Group Pin Placement 5.5.2. Reference Clock 5.5.3. Reset
5.6. Design Example x
5.6.1. Generating the Design Example
5.6.1. Generating the Design Example x
5.6.1.1. Design Example without Dynamic Reconfiguration 5.6.1.2. Dynamic Reconfiguration Design Examples
5.6.1.1. Design Example without Dynamic Reconfiguration x
5.6.1.1.1. Generating the Synthesis Design Example 5.6.1.1.2. Generating the Simulation Design Example
5.6.1.2. Dynamic Reconfiguration Design Examples x
5.6.1.2.1. Generating the Synthesis Design Example 5.6.1.2.2. Generating the Simulation Design Example
6. PHY Lite for Parallel Interfaces FPGA IP for Stratix® 10 Devices x
6.1. Release Information 6.2. Functional Description 6.3. Getting Started 6.4. I/O Standards 6.5. Design Guidelines 6.6. Design Example
6.2. Functional Description x
6.2.1. Top Level Interfaces 6.2.2. Clocks 6.2.3. Output Path 6.2.4. Input Path 6.2.5. Dynamic Reconfiguration
6.2.2. Clocks x
6.2.2.1. Clock Frequency Relationships
6.2.3. Output Path x
6.2.3.1. Output Path Data Alignment
6.2.4. Input Path x
6.2.4.1. Input Path Data Alignment
6.2.5. Dynamic Reconfiguration x
6.2.5.1. RTL Connectivity 6.2.5.2. Address Lookup 6.2.5.3. Reconfiguration Features and Register Addressing 6.2.5.4. Calibration Guidelines
6.2.5.1. RTL Connectivity x
6.2.5.1.1. Daisy Chain
6.2.5.2. Address Lookup x
6.2.5.2.1. Strobes 6.2.5.2.2. Parameter Table Examples
6.2.5.3. Reconfiguration Features and Register Addressing x
6.2.5.3.1. PHY Lite for Parallel Interfaces FPGA IP for Stratix® 10 Devices Control Registers Addresses 6.2.5.3.2. Control Registers Description
6.2.5.4. Calibration Guidelines x
6.2.5.4.1. Strobe Enable Window Calibration 6.2.5.4.2. Output and Strobe Enable Minimum and Maximum Phase Settings
6.3. Getting Started x
6.3.1. Parameter Settings 6.3.2. Signals
6.3.1. Parameter Settings x
6.3.1.1. Read Latency 6.3.1.2. Write Latency
6.3.2. Signals x
6.3.2.1. Clock and Reset Interface Signals 6.3.2.2. Output Path Signals 6.3.2.3. Input Path Signals 6.3.2.4. Avalon Configuration Bus Interface Signals 6.3.2.5. Termination Signals
6.4. I/O Standards x
6.4.1. Input Buffer Reference Voltage (VREF) 6.4.2. On-Chip Termination (OCT)
6.4.1. Input Buffer Reference Voltage (VREF) x
6.4.1.1. Calibrated VREF Settings
6.4.2. On-Chip Termination (OCT) x
6.4.2.1. RZQ_GROUP Assignment 6.4.2.2. Manual Insertion of OCT Block
6.5. Design Guidelines x
6.5.1. Guidelines: Group Pin Placement 6.5.2. Reference Clock 6.5.3. Reset 6.5.4. Constraining Multiple PHY Lite for Parallel Interfaces FPGA IP to One I/O Bank 6.5.5. Dynamic Reconfiguration 6.5.6. Timing
6.5.6. Timing x
6.5.6.1. Timing Components 6.5.6.2. Timing Constraints and Files 6.5.6.3. Timing Analysis 6.5.6.4. Timing Closure Guidelines
6.5.6.2. Timing Constraints and Files x
6.5.6.2.1. <variation_name>.sdc 6.5.6.2.2. <variation_name>_parameter.tcl 6.5.6.2.3. <variation_name>_ip_parameters.tcl 6.5.6.2.4. <variation_name>_pin_map.tcl 6.5.6.2.5. <variation_name>_report_timing.tcl 6.5.6.2.6. <variation_name>_report_timing_core.tcl
6.5.6.4. Timing Closure Guidelines x
6.5.6.4.1. Timing Closure: Dynamic Reconfiguration 6.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints 6.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints 6.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data 6.5.6.4.5. I/O Timing Violation 6.5.6.4.6. Internal FPGA Path Timing Violation
6.6. Design Example x
6.6.1. Generating the Design Example
6.6.1. Generating the Design Example x
6.6.1.1. Design Example without Dynamic Reconfiguration 6.6.1.2. Dynamic Reconfiguration Design Examples
6.6.1.1. Design Example without Dynamic Reconfiguration x
6.6.1.1.1. Generating the Hardware Design Example 6.6.1.1.2. Generating the Simulation Design Example
6.6.1.2. Dynamic Reconfiguration Design Examples x
6.6.1.2.1. Dynamic Reconfiguration Using Finite State Machine
7. PHY Lite for Parallel Interfaces FPGA IP for Arria® 10 and Cyclone® 10 GX Devices x
7.1. Release Information 7.2. Functional Description 7.3. Getting Started 7.4. I/O Standards 7.5. Design Guidelines 7.6. Design Example 7.7. Application Specific Design Example
7.2. Functional Description x
7.2.1. Top Level Interfaces 7.2.2. Clocks 7.2.3. Output Path 7.2.4. Input Path 7.2.5. Dynamic Reconfiguration
7.2.2. Clocks x
7.2.2.1. Clock Frequency Relationships
7.2.3. Output Path x
7.2.3.1. Output Path Data Alignment
7.2.4. Input Path x
7.2.4.1. Input Path Data Alignment
7.2.5. Dynamic Reconfiguration x
7.2.5.1. RTL Connectivity 7.2.5.2. Address Lookup 7.2.5.3. Reconfiguration Features and Register Addressing 7.2.5.4. Calibration Guidelines
7.2.5.1. RTL Connectivity x
7.2.5.1.1. Daisy Chain
7.2.5.2. Address Lookup x
7.2.5.2.1. Strobes 7.2.5.2.2. Parameter Table Examples
7.2.5.3. Reconfiguration Features and Register Addressing x
7.2.5.3.1. PHY Lite for Parallel Interfaces FPGA IP for Arria® 10 and Cyclone® 10 GX Address Registers 7.2.5.3.2. Control Registers Description
7.2.5.4. Calibration Guidelines x
7.2.5.4.1. Strobe Enable Window Calibration 7.2.5.4.2. Output and Strobe Enable Minimum and Maximum Phase Settings
7.3. Getting Started x
7.3.1. Parameter Settings 7.3.2. Signals
7.3.1. Parameter Settings x
7.3.1.1. Read Latency 7.3.1.2. Write Latency
7.3.2. Signals x
7.3.2.1. Clock and Reset Interface Signals 7.3.2.2. Output Path Signals 7.3.2.3. Input Path Signals 7.3.2.4. Avalon Configuration Bus Interface Signals 7.3.2.5. Termination Signals
7.4. I/O Standards x
7.4.1. Input Buffer Reference Voltage (VREF) 7.4.2. On-Chip Termination (OCT)
7.4.1. Input Buffer Reference Voltage (VREF) x
7.4.1.1. Calibrated VREF Settings
7.4.2. On-Chip Termination (OCT) x
7.4.2.1. RZQ_GROUP Assignment 7.4.2.2. Manual Insertion of OCT Block
7.5. Design Guidelines x
7.5.1. Guidelines: Group Pin Placement 7.5.2. Reference Clock 7.5.3. Reset 7.5.4. Constraining Multiple PHY Lite for Parallel Interfaces to One I/O Bank 7.5.5. Dynamic Reconfiguration 7.5.6. Timing
7.5.6. Timing x
7.5.6.1. Timing Components 7.5.6.2. Timing Constraints and Files 7.5.6.3. Timing Analysis 7.5.6.4. Timing Closure Guidelines
7.5.6.2. Timing Constraints and Files x
7.5.6.2.1. <variation_name>.sdc 7.5.6.2.2. <variation_name>_parameter.tcl 7.5.6.2.3. <variation_name>_ip_parameters.tcl 7.5.6.2.4. <variation_name>_pin_map.tcl 7.5.6.2.5. <variation_name>_report_timing.tcl 7.5.6.2.6. <variation_name>_report_timing_core.tcl
7.5.6.4. Timing Closure Guidelines x
7.5.6.4.1. Timing Closure: Dynamic Reconfiguration 7.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints 7.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints 7.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data 7.5.6.4.5. I/O Timing Violation 7.5.6.4.6. Internal FPGA Path Timing Violation
7.6. Design Example x
7.6.1. Generating the Design Example
7.6.1. Generating the Design Example x
7.6.1.1. Design Example without Dynamic Reconfiguration 7.6.1.2. Dynamic Reconfiguration Design Examples
7.6.1.1. Design Example without Dynamic Reconfiguration x
7.6.1.1.1. Generating the Hardware Design Example 7.6.1.1.2. Generating the Simulation Design Example
7.6.1.2. Dynamic Reconfiguration Design Examples x
7.6.1.2.1. Dynamic Reconfiguration with Debug Kit 7.6.1.2.2. Dynamic Reconfiguration Using Finite State Machine
7.7. Application Specific Design Example x
7.7.1. Implementation using the PHY Lite for Parallel Interfaces FPGA IP
1. About the PHY Lite for Parallel Interfaces IP
2. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 3 C-Series Devices
3. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 5 D-Series and E-Series Devices
4. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 M-Series Devices
5. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 F-Series and I-Series Devices
6. PHY Lite for Parallel Interfaces FPGA IP for Stratix® 10 Devices
7. PHY Lite for Parallel Interfaces FPGA IP for Arria® 10 and Cyclone® 10 GX Devices
8. PHY Lite for Parallel Interfaces FPGA IP User Guide Document Archives
9. Document Revision History for the PHY Lite for Parallel Interfaces FPGA IP User Guide

5.2.1. Agilex™ 7 F-Series and I-Series I/O Sub-bank Interconnects

There are interconnects between the sub-banks which chain the sub-banks into a row. The following figures show how I/O lanes in various sub-banks are chained together to form the top and bottom I/O rows in various Agilex™ 7 device variants. These figures represent the top view of the silicon die that corresponds to a reverse view of the device package. Each sub-bank is labeled with an ID number to facilitate pin placement.

Figure 89. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF006 and AGF008, Package R16A
Figure 90. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF006 and AGF008, Package R16A
Figure 91. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF012 and AGF014, Package R24B
Figure 92. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF012 and AGF014, Package R24B
Figure 93. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF006 and AGF008, Package R24C
Figure 94. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF006 and AGF008, Package R24C
Figure 95. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF014, Package R24C
Figure 96. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF014, Package R24C
Figure 97. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF012 and AGF014, Package R24C
Figure 98. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF012 and AGF014, Package R24C
Figure 99. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF019 and AGF023, Package R24C
Figure 100. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF019 and AGF023, Package R24C
Figure 101. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF022 and AGF027, Package R24C
Figure 102. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF022 and AGF027, Package R24C
Figure 103. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF019 and AGF023, Package R25A
Figure 104. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF019 and AGF023, Package R25A
Figure 105. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF022 and AGF027 Devices, Package R25A
Figure 106. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF022 and AGF027 Devices, Package R25A
Figure 107. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF019 and AGF023 Devices, Package R31C
Figure 108. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF019 and AGF023 Devices, Package R31C
Figure 109. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGF022 and AGF027 Devices, Package R31C
Figure 110. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGF022 and AGF027 Devices, Package R31C
Figure 111. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGI019 and AGI023, Package R18A
Figure 112. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGI019 and AGI023, Package R18A
Figure 113. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGI022 and AGI027 Devices, Package R29A
Figure 114. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGI022 and AGI027 Devices, Package R29A
Figure 115. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGI027 Devices, Package R29B
Figure 116. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGI027 Devices, Package R29B
Figure 117. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGI041 Devices, Package R29D
Figure 118. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGI041 Devices, Package R29D
Figure 119. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGI022 and AGI027 Devices, Package R31A
Figure 120. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGI022 and AGI027 Devices, Package R31A
Figure 121. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGI019 and AGI023 Devices, Package R31B
Figure 122. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGI019 and AGI023 Devices, Package R31B
Figure 123. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGI022 and AGI027 Devices, Package R31B
Figure 124. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGI022 and AGI027 Devices, Package R31B
Figure 125. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGI041 Devices, Package R31B
Figure 126. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGI041 Devices, Package R31B
Figure 127. Sub-bank Ordering with ID in Top I/O Row in Agilex™ 7 AGI035 and AGI040 Devices, Package R39A
Figure 128. Sub-bank Ordering with ID in Bottom I/O Row in Agilex™ 7 AGI035 and AGI040 Devices, Package R39A
Related Information
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