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1. About the PHY Lite for Parallel Interfaces IP
2. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 3 C-Series Devices
3. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 5 D-Series and E-Series Devices
4. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 M-Series Devices
5. PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 F-Series and I-Series Devices
6. PHY Lite for Parallel Interfaces FPGA IP for Stratix® 10 Devices
7. PHY Lite for Parallel Interfaces FPGA IP for Arria® 10 and Cyclone® 10 GX Devices
8. PHY Lite for Parallel Interfaces FPGA IP User Guide Document Archives
9. Document Revision History for the PHY Lite for Parallel Interfaces FPGA IP User Guide
6.5.6.4.1. Timing Closure: Dynamic Reconfiguration
6.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
6.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
6.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
6.5.6.4.5. I/O Timing Violation
6.5.6.4.6. Internal FPGA Path Timing Violation
7.5.6.4.1. Timing Closure: Dynamic Reconfiguration
7.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
7.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
7.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
7.5.6.4.5. I/O Timing Violation
7.5.6.4.6. Internal FPGA Path Timing Violation
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5.2. Functional Description
The PHY Lite for Parallel Interfaces FPGA IP for Agilex™ 7 devices utilizes the I/O banks in Agilex™ 7 F-Series and I-Series devices. Each I/O bank has two I/O sub-banks in each device. The top sub-bank is placed near the edge of the die, and the bottom sub-bank is placed near the FPGA core.
Each sub-bank contains the following components:
- Hard memory controller
- I/O PLL and PHY clock trees
- DLL
- Input DQS/strobe trees
- 48 pins, organized into four I/O lanes of 12 pins each
Figure 88. Agilex™ 7 F-Series and I-Series I/O Bank Structure (Die Top View)This figure shows the I/O bank structure of the Agilex™ 7 F-Series and I-Series devices. The figure shows the view of the die as shown in the Quartus® Prime Chip Planner. In the Pin Planner, this corresponds to the "Bottom View". Different device packages have different number of I/O banks. Refer to the device pin-out files for available I/O banks and the locations of the SDM and HPS shared I/O banks for each device package.