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1. About the PHY Lite for Parallel Interfaces IP
2. PHY Lite for Parallel Interfaces Intel Agilex 7 FPGA IP for M-Series
3. PHY Lite for Parallel Interfaces Intel Agilex 7 FPGA IP for F-Series and I-Series
4. PHY Lite for Parallel Interfaces Intel Stratix 10 FPGA IP
5. PHY Lite for Parallel Interfaces Intel Arria 10 and Intel Cyclone 10 GX FPGA IPs
6. PHY Lite for Parallel Interfaces Intel® FPGA IP User Guide Document Archives
7. Document Revision History for the PHY Lite for Parallel Interfaces IP User Guide
3.2.1. Intel® Agilex™ 7 for F-Series and I-Series I/O Sub-bank Interconnects
3.2.2. Intel® Agilex™ 7 for F-Series and I-Series Input DQS/Strobe Tree
3.2.3. PHY Lite for Parallel Interfaces Intel® Agilex™ 7 for F-Series and I-Series FPGA IP Top Level Interfaces
3.2.4. Dynamic Reconfiguration
3.2.5. I/O Timing
4.5.6.4.1. Timing Closure: Dynamic Reconfiguration
4.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
4.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
4.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
4.5.6.4.5. I/O Timing Violation
4.5.6.4.6. Internal FPGA Path Timing Violation
5.5.6.4.1. Timing Closure: Dynamic Reconfiguration
5.5.6.4.2. Timing Closure: Input Strobe Setup and Hold Delay Constraints
5.5.6.4.3. Timing Closure: Output Strobe Setup and Hold Delay Constraints
5.5.6.4.4. Timing Closure: Non Edge-Aligned Input Data
5.5.6.4.5. I/O Timing Violation
5.5.6.4.6. Internal FPGA Path Timing Violation
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3.2.1. Intel® Agilex™ 7 for F-Series and I-Series I/O Sub-bank Interconnects
There are interconnects between the sub-banks which chain the sub-banks into a row. The following figures show how I/O lanes in various sub-banks are chained together to form the top and bottom I/O rows in various Intel® Agilex™ device variants. These figures represent the top view of the silicon die that corresponds to a reverse view of the device package. Each sub-bank is labeled with ID number to facilitate pin placement.
Figure 16. Sub-bank Ordering with ID in Top I/O Row in Intel® Agilex™ AGF012 and AGF014, Package R24B
Figure 17. Sub-bank Ordering with ID in Bottom I/O Row in Intel® Agilex™ AGF012 and AGF014, Package R24B
Figure 18. Sub-bank Ordering with ID in Top I/O Row in Intel® Agilex™ AGF014, Package R24C
Figure 19. Sub-bank Ordering with ID in Bottom I/O Row in Intel® Agilex™ AGF014, Package R24C
Figure 20. Sub-bank Ordering with ID in Top I/O Row in Intel® Agilex™ AGF022 and AGF027 Devices, Package R25A
Figure 21. Sub-bank Ordering with ID in Bottom I/O Row in Intel® Agilex™ AGF022 and AGF027 Devices, Package R25A
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