Agilex™ 3 FPGA and SoC C-Series Development Kits User Guide
ID
851698
Date
9/02/2025
Public
1. Overview
2. Getting Started
3. Development Kit Setup
4. Board Test System
5. Development Kit Hardware and Configuration
6. Custom Projects for the Development Kit
7. Document Revision History for the Agilex™ 3 FPGA and SoC C-Series Development Kits User Guide
A. Development Kit Components
B. Developer Resources
C. Safety and Regulatory Compliance Information
3.4.1. Restoring Board QSPI Flash U51 with Default Factory Image on Agilex™ 3 FPGA C-Series Development Kit
3.4.2. Restoring Board QSPI Flash U51 with Default Factory Image on Agilex™ 3 FPGA and SoC C-Series Development Kit
3.4.3. Restoring SD Card with Default Factory Image on Agilex™ 3 FPGA and SoC C-Series Development Kit
A.7. Power Distribution System
The following figure shows the power distribution and power sequencing on the Agilex™ 3 FPGA/FPGA and SoC C-Series development board. This figure shows the complete power rail connections for the Agilex™ 3 FPGA and SoC C-Series development board. For the Agilex™ 3 FPGA C-Series development board, you can omit any "*_HPS" or "*_HPS_*" named power rails.
Figure 33. Power Tree
The Agilex™ 3 FPGA/FPGA and SoC C-Series Development Kit is designed to operate in a typical laboratory environment with an ambient temperature of approximately 25°C. The cooling solution provided with the development kit allows sufficient cooling for the board to operate up to a maximum power consumption of 54 W with a maximum FPGA workload of 16 W.