Agilex™ 3 FPGA and SoC C-Series Development Kits User Guide

ID 851698
Date 9/02/2025
Public
Document Table of Contents

A.7. Power Distribution System

The following figure shows the power distribution and power sequencing on the Agilex™ 3 FPGA/FPGA and SoC C-Series development board. This figure shows the complete power rail connections for the Agilex™ 3 FPGA and SoC C-Series development board. For the Agilex™ 3 FPGA C-Series development board, you can omit any "*_HPS" or "*_HPS_*" named power rails.
Figure 33. Power Tree

The Agilex™ 3 FPGA/FPGA and SoC C-Series Development Kit is designed to operate in a typical laboratory environment with an ambient temperature of approximately 25°C. The cooling solution provided with the development kit allows sufficient cooling for the board to operate up to a maximum power consumption of 54 W with a maximum FPGA workload of 16 W.