Agilex™ 3 FPGA and SoC C-Series Development Kits User Guide
ID
851698
Date
9/02/2025
Public
1. Overview
2. Getting Started
3. Development Kit Setup
4. Board Test System
5. Development Kit Hardware and Configuration
6. Custom Projects for the Development Kit
7. Document Revision History for the Agilex™ 3 FPGA and SoC C-Series Development Kits User Guide
A. Development Kit Components
B. Developer Resources
C. Safety and Regulatory Compliance Information
3.4.1. Restoring Board QSPI Flash U51 with Default Factory Image on Agilex™ 3 FPGA C-Series Development Kit
3.4.2. Restoring Board QSPI Flash U51 with Default Factory Image on Agilex™ 3 FPGA and SoC C-Series Development Kit
3.4.3. Restoring SD Card with Default Factory Image on Agilex™ 3 FPGA and SoC C-Series Development Kit
2.2.1. Handling the DIP Switches
Operating the DIP Switch Safely
- Do not apply excessive force when operating the slide-type switch, as this might cause damage or deformation, leading to malfunction.
- Apply the operating load from the side of the striker.
- Avoid applying force at an angle or from above the striker, as this might deform the switch contact.
Setting the DIP Switch
- To set the slide-type switch, use a small, rounded object like the end of a ballpoint pen or a tiny screwdriver.
- Do not use sharp tools, such as tweezers, to set the switch as they might damage it.
- Do not use a mechanical pencil, as its point could leave lead particles behind. These particles might interfere with the switch and the internal circuit board, potentially causing malfunction. Lead buildup can also reduce the dielectric strength of the circuit board.