GTS Transceiver PHY User Guide: Agilex™ 3 FPGAs and SoCs

ID 848344
Date 8/04/2025
Public
Document Table of Contents

2.7.1. Bonding Architecture

The objective of bonding is to minimize the TX lane-to-lane skew for multi-lane configurations to support protocols that have stringent skew requirements.
Bonding is applied for the following modes:
  • PMA Direct (x2 and x4)
  • PCS Direct (x2 and x4)
Supported channel bonding configurations are x2 and x4 as shown in Channel Placement Rules and Design Requirements . Bonding works with the following clocking modes:
Table 13.  Bonding Clocking Modes
Modes Clocking Modes
PMA Direct PMA Clocking/System Clocking
PCS Direct System Clocking
For bonded configurations, only phase compensation mode of the core interface FIFO is supported.