126.96.36.199. Using Simulation Signal Activity Data in Power Analysis 188.8.131.52. Signal Activities from RTL (Functional) Simulation, Supplemented by Vectorless Estimation 184.108.40.206. Signal Activities from Vectorless Estimation and User-Supplied Input Pin Activities 220.127.116.11. Signal Activities from User Defaults Only
2.5.1. Complete Design Simulation Power Analysis Flow 2.5.2. Modular Design Simulation Power Analysis Flow 2.5.3. Multiple Simulation Power Analysis Flow 2.5.4. Overlapping Simulation Power Analysis Flow 2.5.5. Partial Design Simulation Power Analysis Flow 2.5.6. Vectorless Estimation Power Analysis Flow
3.4.1. Clock Power Management 3.4.2. Pipelining and Retiming 3.4.3. Architectural Optimization 3.4.4. I/O Power Guidelines 3.4.5. Dynamically Controlled On-Chip Terminations (OCT) 3.4.6. Memory Optimization (M20K/MLAB) 3.4.7. DDR Memory Controller Settings 3.4.8. DSP Implementation 3.4.9. Reducing High-Speed Tile (HST) Usage 3.4.10. Unused Transceiver Channels 3.4.11. Periphery Power reduction XCVR Settings
3.1.3. Environmental Conditions
The main environmental parameters affecting junction temperature are operating temperature and the cooling solution. Operating temperature primarily affects device static power consumption. Higher junction temperatures result in higher static power consumption. The device thermal power and cooling solution that you use must keep the device junction temperature within the maximum operating range for the device.
The following table lists the environmental conditions that influence power consumption.
|Airflow||Measures how quickly the device replaces heated air from the vicinity of the device with air at ambient temperature.
You can either specify airflow as “still air” when you are not using a fan, or as the linear feet per minute rating of the fan in the system. Higher airflow decreases thermal resistance.
|Heat Sink and Thermal Compound||A heat sink allows more efficient heat transfer from the device to the surrounding area because of its large surface area exposed to the air. The thermal compound that interfaces the heat sink to the device also influences the rate of heat dissipation. The case-to-ambient thermal resistance (θCA) parameter describes the cooling capacity of the heat sink and thermal compound employed at a given airflow. Larger heat sinks and more effective thermal compounds reduce θCA.|
|Junction Temperature||The junction temperature of a device is equal to:
in which θJA is the total thermal resistance from the device transistors to the environment, in degrees Celsius per watt. The value θJA is equal to the sum of the junction-to-case (package) thermal resistance (θJC), and the case-to-ambient thermal resistance (θCA) of the cooling solution.
|Board Thermal Model||The junction-to-board thermal resistance (θJB) is the thermal resistance of the path through the board, in degrees Celsius per watt. To compute junction temperature, you can use this board thermal model along with the board temperature, the top-of-chip θJA and ambient temperatures.|
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