184.108.40.206. Using Simulation Signal Activity Data in Power Analysis 220.127.116.11. Signal Activities from RTL (Functional) Simulation, Supplemented by Vectorless Estimation 18.104.22.168. Signal Activities from Vectorless Estimation and User-Supplied Input Pin Activities 22.214.171.124. Signal Activities from User Defaults Only
2.5.1. Complete Design Simulation Power Analysis Flow 2.5.2. Modular Design Simulation Power Analysis Flow 2.5.3. Multiple Simulation Power Analysis Flow 2.5.4. Overlapping Simulation Power Analysis Flow 2.5.5. Partial Design Simulation Power Analysis Flow 2.5.6. Vectorless Estimation Power Analysis Flow
3.4.1. Clock Power Management 3.4.2. Pipelining and Retiming 3.4.3. Architectural Optimization 3.4.4. I/O Power Guidelines 3.4.5. Dynamically Controlled On-Chip Terminations (OCT) 3.4.6. Memory Optimization (M20K/MLAB) 3.4.7. DDR Memory Controller Settings 3.4.8. DSP Implementation 3.4.9. Reducing High-Speed Tile (HST) Usage 3.4.10. Unused Transceiver Channels 3.4.11. Periphery Power reduction XCVR Settings
3.1.1. Design Activity and Power Analysis
Power consumption of a device also depends on the design's activity over time. Static power (PSTATIC) is the thermal power that a chip dissipates independent of user clocks. PSTATIC includes leakage power from all FPGA functional blocks, except for I/O DC bias power and transceiver DC bias power, which are accounted for in the I/O and transceiver sections. Dynamic power is the additional power consumption of a device due to signal activity or switching.
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