Enhanced Configuration (EPC) Devices Datasheet

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ID 683253
Date 5/04/2016
Public
Document Table of Contents
Document Table of Contents x
1. Enhanced Configuration (EPC) Devices Datasheet
1. Enhanced Configuration (EPC) Devices Datasheet x
1.1. Supported Devices 1.2. Features 1.3. Functional Description 1.4. Pin Description 1.5. Power-On Reset 1.6. Power Sequencing 1.7. Programming and Configuration File Support 1.8. IEEE Std. 1149.1 (JTAG) Boundary-Scan 1.9. Timing Information 1.10. Operating Conditions 1.11. Package 1.12. Document Revision History
1.3. Functional Description x
1.3.1. FPGA Configuration 1.3.2. External Flash Interface 1.3.3. Intel Flash-Based EPC Device Protection 1.3.4. Dynamic Configuration (Page Mode) 1.3.5. Real-Time Decompression 1.3.6. Programmable Configuration Clock 1.3.7. Flash In-System Programming (ISP)
1.3.1. FPGA Configuration x
1.3.1.1. Configuration Signals 1.3.1.2. Fast Passive Parallel Configuration 1.3.1.3. Passive Serial Configuration 1.3.1.4. Concurrent Configuration
1.3.7. Flash In-System Programming (ISP) x
1.3.7.1. JTAG-based Programming 1.3.7.2. Programming using External Flash Interface
1.11. Package x
1.11.1. Package Layout Recommendation
1. Enhanced Configuration (EPC) Devices Datasheet

1.11. Package

The EPC16 device is available in both the 88-pin UFBGA package and the 100-pin PQFP package. The UFBGA package, which is based on 0.8-mm ball pitch, maximizes board space efficiency. A board can be laid out for this package using a single PCB layer. The EPC8 and EPC4 devices are available in the 100-pin PQFP package. EPC devices support vertical migration in the 100-pin PQFP package.

The following figure shows the PCB routing for the 88-pin UFBGA package. The Gerber file for this layout is on the Altera website.

Figure 8. PCB Routing for 88-Pin UFBGA Package

Section Content
Package Layout Recommendation

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