Enhanced Configuration (EPC) Devices Datasheet

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ID 683253
Date 5/04/2016
Public
Document Table of Contents
Document Table of Contents x
1. Enhanced Configuration (EPC) Devices Datasheet
1. Enhanced Configuration (EPC) Devices Datasheet x
1.1. Supported Devices 1.2. Features 1.3. Functional Description 1.4. Pin Description 1.5. Power-On Reset 1.6. Power Sequencing 1.7. Programming and Configuration File Support 1.8. IEEE Std. 1149.1 (JTAG) Boundary-Scan 1.9. Timing Information 1.10. Operating Conditions 1.11. Package 1.12. Document Revision History
1.3. Functional Description x
1.3.1. FPGA Configuration 1.3.2. External Flash Interface 1.3.3. Intel Flash-Based EPC Device Protection 1.3.4. Dynamic Configuration (Page Mode) 1.3.5. Real-Time Decompression 1.3.6. Programmable Configuration Clock 1.3.7. Flash In-System Programming (ISP)
1.3.1. FPGA Configuration x
1.3.1.1. Configuration Signals 1.3.1.2. Fast Passive Parallel Configuration 1.3.1.3. Passive Serial Configuration 1.3.1.4. Concurrent Configuration
1.3.7. Flash In-System Programming (ISP) x
1.3.7.1. JTAG-based Programming 1.3.7.2. Programming using External Flash Interface
1.11. Package x
1.11.1. Package Layout Recommendation
1. Enhanced Configuration (EPC) Devices Datasheet

1.10. Operating Conditions

Table 14.  Absolute Maximum Rating for EPC Devices
Symbol Parameter Condition Min Max Unit
VCC Supply voltage With respect to ground -0.2 4.6 V
VI DC input voltage With respect to ground -0.5 3.6 V
IMAX DC VCC or ground current — — 100 mA
IOUT DC output current, per pin — -25 25 mA
PD Power dissipation — — 360 mW
TSTG Storage temperature No bias -65 150 C
TAMB Ambient temperature Under bias -65 135 C
TJ Junction temperature Under bias — 135 C
Table 15.  Recommended Operating Conditions for EPC Devices
Symbol Parameter Condition Min Max Unit
VCC Supplies voltage for 3.3-V operation — 3 3.6 V
VI Input voltage With respect to ground –0.3 VCC + 0.3 V
VO Output voltage — 0 VCC V
TA Operating temperature For commercial use 0 70 C
For industrial use –40 85 C
For military use10 –55 125 C
TR Input rise time — — 20 ns
TF Input fall time — — 20 ns
Table 16.  DC Operating Conditions for EPC Devices
Symbol Parameter Condition Min Typ Max Unit
VCC Supplies voltage to core — 3 3.3 3.6 V
VIH High-level input voltage — 2 — VCC + 0.3 V
VIL Low-level input voltage — — — 0.8 V
VOH 3.3-V mode high-level TTL output voltage IOH = –4 mA 2.4 — — V
3.3-V mode high-level CMOS output voltage IOH = –0.1 mA VCC – 0.2 — — V
VOL Low-level output voltage TTL IOL = –4 mA DC — — 0.45 V
Low-level output voltage CMOS IOL = –0.1 mA DC — — 0.2 V
II Input leakage current VI = VCC or ground –10 — 10 µA
IOZ Tri-state output off-state current VO = VCC or ground –10 — 10 µA
Table 17.  ICC Supply Current Values for EPC Devices
Symbol Parameter Condition Min Typ Max Unit
ICC0 Current (standby) — — 50 150 µA
ICC1 VCC supply current (during configuration) — — 60 90 mA
ICCW VCCW supply current — — 11 11 —
Table 18.  Capacitance for EPC Devices
Symbol Parameter Condition Min Max Unit
CIN Input pin capacitance — — 10 pF
COUT Output pin capacitance — — 10 pF
10 Applicable for UBGA88 package of the EPC16 device only.
11 For the VCCW supply current information, refer to the appropriate flash memory data sheet at www.altera.com.
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