Thermal Design User Guide: MAX® 10 FPGA B610 Package

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ID 851247
Date 5/20/2025
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines 2. MAX® 10 FPGA B610 Package Mechanical Construction 3. MAX® 10 FPGA B610 Package CTM Construction 4. Quartus Requirements and Power Estimation 5. General FPGA Thermal Design Considerations 6. Thermal Design Process 7. Thermal Solution Mechanical Design 8. Vendor References 9. Document Revision History for the MAX® 10 FPGA B610 Package Thermal Design User Guide A. Thermal Design Elements
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines x
1.1. Thermal Design Requirements 1.2. Definitions of Thermal and Power Terms Used in this Document
2. MAX® 10 FPGA B610 Package Mechanical Construction x
2.1. Thermal Design Process Flow 2.2. Thermal Resistance Values Summary
3. MAX® 10 FPGA B610 Package CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. Obtaining the CTM
4. Quartus Requirements and Power Estimation x
4.1. Board Thermal Model 4.2. QPA Outputs
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations 5.2. FPGA Maximum Allowed Power Dissipation 5.3. Static, Dynamic, and Standby Power
6. Thermal Design Process x
6.1. Package Heat Flow Path 6.2. Recommended Thermal Design Methodology
7. Thermal Solution Mechanical Design x
7.1. Mechanical Design 7.2. TIM2 Selection 7.3. Summary
7.1. Mechanical Design x
7.1.1. Bond Line Thickness (BLT) 7.1.2. Die Warpage 7.1.3. Package Loading 7.1.4. Recommended Pressure Variation Across the Package
7.2. TIM2 Selection x
7.2.1. Gap Pad TIMs 7.2.2. Gap Pad TIM Thermal Conductivity Data 7.2.3. Parametric Studies with Different TIM Materials
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines
2. MAX® 10 FPGA B610 Package Mechanical Construction
3. MAX® 10 FPGA B610 Package CTM Construction
4. Quartus Requirements and Power Estimation
5. General FPGA Thermal Design Considerations
6. Thermal Design Process
7. Thermal Solution Mechanical Design
8. Vendor References
9. Document Revision History for the MAX® 10 FPGA B610 Package Thermal Design User Guide
A. Thermal Design Elements

6.1. Package Heat Flow Path

MAX® 10 FPGA B610 package are wire bonded with an encapsulation and the thermal solution requirement driven by the package powers, which can vary from 1 to 5W depends on use case scenarios.

This section outlines the differences and describes the steps to optimally size the thermal solution for MAX® 10 FPGA B610 package using QPA and compact thermal model (CTM).

The power output from QPA estimation, ambient temperature and the maximum junction temperature target determines whether a heatsink is needed. If a heatsink is needed, then the size of the heatsink must be estimated.

For use cases over 5W, a heatsink may be required, mounted on top of the package. Such use cases generally include forced air flow over the heat sink. The figure below illustrates this example.

Figure 7. High Power FPGA with Large and Effective Heat Sink

Usually, in systems that have low power FPGAs (from 1 to 5W), the packages might have small (hence, low performance) heat sinks, commonly without any additional airflow. In such cases, only a fraction of the heat generated in the die flows through the top of the package into the heat sink. The remaining heat flows through the substrate of the package and into the PCB. The fraction of heat passed through to the PCB depends on system design and other boundary conditions as shown in the figure below.

Figure 8. Low Power FPGA with Small Heat Sink

For these system conditions, due to lack of sufficient airflow and/or available space, it is not possible to increase the heat sink performance significantly. In such scenarios, to avoid designing unnecessarily large heat sinks, it is important to size the heat sink while taking into consideration only the amount of heat dissipated through the top of the die and not the amount of heat that can be dissipated through the PCB. In certain cases, a heat sink may not be required.

The fraction of heat dissipated through the substrate into the PCB depends on various factors:

  • Local ambient temperature inside the system.
  • Air flow above and below the PCB.
  • Heat sink type, material, size, and clamping load.
  • Thermal interface material (TIM) between FPGA and heat sink – TIM material and thickness.
  • Shared heat sink contacting other components that potentially have larger heat loss or higher temperatures.
  • Other high power and high temperature components on the PCB and close to the FPGA that might affect the local PCB temperature.
  • PCB construct – number of layers, copper density in the layers, etcetera.
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