Thermal Design User Guide: MAX® 10 FPGA B610 Package

Download PDF
ID 851247
Date 5/20/2025
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines 2. MAX® 10 FPGA B610 Package Mechanical Construction 3. MAX® 10 FPGA B610 Package CTM Construction 4. Quartus Requirements and Power Estimation 5. General FPGA Thermal Design Considerations 6. Thermal Design Process 7. Thermal Solution Mechanical Design 8. Vendor References 9. Document Revision History for the MAX® 10 FPGA B610 Package Thermal Design User Guide A. Thermal Design Elements
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines x
1.1. Thermal Design Requirements 1.2. Definitions of Thermal and Power Terms Used in this Document
2. MAX® 10 FPGA B610 Package Mechanical Construction x
2.1. Thermal Design Process Flow 2.2. Thermal Resistance Values Summary
3. MAX® 10 FPGA B610 Package CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. Obtaining the CTM
4. Quartus Requirements and Power Estimation x
4.1. Board Thermal Model 4.2. QPA Outputs
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations 5.2. FPGA Maximum Allowed Power Dissipation 5.3. Static, Dynamic, and Standby Power
6. Thermal Design Process x
6.1. Package Heat Flow Path 6.2. Recommended Thermal Design Methodology
7. Thermal Solution Mechanical Design x
7.1. Mechanical Design 7.2. TIM2 Selection 7.3. Summary
7.1. Mechanical Design x
7.1.1. Bond Line Thickness (BLT) 7.1.2. Die Warpage 7.1.3. Package Loading 7.1.4. Recommended Pressure Variation Across the Package
7.2. TIM2 Selection x
7.2.1. Gap Pad TIMs 7.2.2. Gap Pad TIM Thermal Conductivity Data 7.2.3. Parametric Studies with Different TIM Materials
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines
2. MAX® 10 FPGA B610 Package Mechanical Construction
3. MAX® 10 FPGA B610 Package CTM Construction
4. Quartus Requirements and Power Estimation
5. General FPGA Thermal Design Considerations
6. Thermal Design Process
7. Thermal Solution Mechanical Design
8. Vendor References
9. Document Revision History for the MAX® 10 FPGA B610 Package Thermal Design User Guide
A. Thermal Design Elements

2. MAX® 10 FPGA B610 Package Mechanical Construction

The MAX® 10 FPGA B610 package uses wire bond BGA package technology. The BGA die is mounted on the substrate and connected to the substrate by wire bonding technology.

The BGA package consists of an array of solder balls on the bottom of the package, which are used to connect the FPGA to the PCB. It is widely used for their high pin count and excellent thermal and electrical performance.

Figure 2.  MAX® 10 FPGA B610 Package Mechanical Drawing

The package mechanical drawing provides a reference for PCB layout and design, to ensure proper alignment and soldering during assembly.

Each compact thermal model (CTM) is provided with the relevant package mechanical drawing (PMD). Contact your Altera FAE for more information.


Section Content
Thermal Design Process Flow
Thermal Resistance Values Summary

Level Two Title