Thermal Design User Guide: MAX® 10 FPGA B610 Package

Download PDF
ID 851247
Date 5/20/2025
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines 2. MAX® 10 FPGA B610 Package Mechanical Construction 3. MAX® 10 FPGA B610 Package CTM Construction 4. Quartus Requirements and Power Estimation 5. General FPGA Thermal Design Considerations 6. Thermal Design Process 7. Thermal Solution Mechanical Design 8. Vendor References 9. Document Revision History for the MAX® 10 FPGA B610 Package Thermal Design User Guide A. Thermal Design Elements
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines x
1.1. Thermal Design Requirements 1.2. Definitions of Thermal and Power Terms Used in this Document
2. MAX® 10 FPGA B610 Package Mechanical Construction x
2.1. Thermal Design Process Flow 2.2. Thermal Resistance Values Summary
3. MAX® 10 FPGA B610 Package CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. Obtaining the CTM
4. Quartus Requirements and Power Estimation x
4.1. Board Thermal Model 4.2. QPA Outputs
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations 5.2. FPGA Maximum Allowed Power Dissipation 5.3. Static, Dynamic, and Standby Power
6. Thermal Design Process x
6.1. Package Heat Flow Path 6.2. Recommended Thermal Design Methodology
7. Thermal Solution Mechanical Design x
7.1. Mechanical Design 7.2. TIM2 Selection 7.3. Summary
7.1. Mechanical Design x
7.1.1. Bond Line Thickness (BLT) 7.1.2. Die Warpage 7.1.3. Package Loading 7.1.4. Recommended Pressure Variation Across the Package
7.2. TIM2 Selection x
7.2.1. Gap Pad TIMs 7.2.2. Gap Pad TIM Thermal Conductivity Data 7.2.3. Parametric Studies with Different TIM Materials
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines
2. MAX® 10 FPGA B610 Package Mechanical Construction
3. MAX® 10 FPGA B610 Package CTM Construction
4. Quartus Requirements and Power Estimation
5. General FPGA Thermal Design Considerations
6. Thermal Design Process
7. Thermal Solution Mechanical Design
8. Vendor References
9. Document Revision History for the MAX® 10 FPGA B610 Package Thermal Design User Guide
A. Thermal Design Elements

A. Thermal Design Elements

  • Thermal Resistance
    • Junction-to-Ambient Thermal Resistance (θJA): This parameter represents the thermal resistance from the FPGA's junction (the active region of the silicon) to the ambient environment. It is influenced by the package type, PCB design, and cooling solutions.
    • Junction-to-Case Thermal Resistance (θJC): This parameter represents the thermal resistance from the FPGA's junction to the case of the package. It is useful for designs that use heat sinks or other direct cooling methods.
    • Junction-to-Board Thermal Resistance (θJB): This parameter represents the thermal resistance from the FPGA's junction to the board. It is a critical parameter for understanding how heat is conducted from the FPGA to the PCB. Effective use of thermal vias, copper planes, and other PCB design techniques can help manage this thermal path
  • Ambient Temperature
    • Operating Temperature Range: MAX® 10 FPGAs are designed to operate within a specified ambient temperature range. It is essential to ensure that the ambient temperature around the FPGA remains within this range to prevent overheating and ensure reliable operation.
  • Cooling Solutions
    • Passive Cooling: For low-power applications, approximately 1W, a heatsink is typically unnecessary. Natural convection and radiation are usually sufficient for cooling. Additionally, an effective PCB design, incorporating thermal vias and copper planes, can significantly improve heat dissipation.
    • Active Cooling: For higher power applications, up to 5W, a heatsink is required, potentially in combination with forced air-cooling using fans or blowers. The specific cooling solution depends on the amount of power that must be dissipated.
  • Thermal Interface Materials (TIMs)
    • These materials, often thermal gap pads, are used to enhance thermal conductivity between the FPGA package and the heatsink.
  • PCB construction for enhanced thermal performance
    • Thermal Vias: Placing thermal vias under the FPGA package can help conduct heat away from the device to the PCB's inner layers and copper planes.
    • Copper Planes: Using large copper planes connected to the FPGA's ground and power pads can help spread and dissipate heat more effectively.
    • Component Placement: Placing heat-generating components away from the FPGA can help reduce the overall thermal load on the device.
  • Thermal Simulation and Analysis
    • Thermal Simulations: Utilizing thermal simulation tools can effectively predict the thermal behavior of the FPGA within the design environment. These simulations incorporate the system model, including the package, and are provided as Compact Thermal Models (CTMs). This approach ensures that the design meets all thermal requirements.
Level Two Title