Thermal Design User Guide: MAX® 10 FPGA B610 Package

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ID 851247
Date 5/20/2025
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines 2. MAX® 10 FPGA B610 Package Mechanical Construction 3. MAX® 10 FPGA B610 Package CTM Construction 4. Quartus Requirements and Power Estimation 5. General FPGA Thermal Design Considerations 6. Thermal Design Process 7. Thermal Solution Mechanical Design 8. Vendor References 9. Document Revision History for the MAX® 10 FPGA B610 Package Thermal Design User Guide A. Thermal Design Elements
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines x
1.1. Thermal Design Requirements 1.2. Definitions of Thermal and Power Terms Used in this Document
2. MAX® 10 FPGA B610 Package Mechanical Construction x
2.1. Thermal Design Process Flow 2.2. Thermal Resistance Values Summary
3. MAX® 10 FPGA B610 Package CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. Obtaining the CTM
4. Quartus Requirements and Power Estimation x
4.1. Board Thermal Model 4.2. QPA Outputs
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations 5.2. FPGA Maximum Allowed Power Dissipation 5.3. Static, Dynamic, and Standby Power
6. Thermal Design Process x
6.1. Package Heat Flow Path 6.2. Recommended Thermal Design Methodology
7. Thermal Solution Mechanical Design x
7.1. Mechanical Design 7.2. TIM2 Selection 7.3. Summary
7.1. Mechanical Design x
7.1.1. Bond Line Thickness (BLT) 7.1.2. Die Warpage 7.1.3. Package Loading 7.1.4. Recommended Pressure Variation Across the Package
7.2. TIM2 Selection x
7.2.1. Gap Pad TIMs 7.2.2. Gap Pad TIM Thermal Conductivity Data 7.2.3. Parametric Studies with Different TIM Materials
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines
2. MAX® 10 FPGA B610 Package Mechanical Construction
3. MAX® 10 FPGA B610 Package CTM Construction
4. Quartus Requirements and Power Estimation
5. General FPGA Thermal Design Considerations
6. Thermal Design Process
7. Thermal Solution Mechanical Design
8. Vendor References
9. Document Revision History for the MAX® 10 FPGA B610 Package Thermal Design User Guide
A. Thermal Design Elements

3.1. CTM File Format

Altera offers the latest CTMs in ECXML format and as STEP files.

ECXML files are compatible with the following CFD tools:

  • Icepak* from ANSYS
  • Flotherm* from Siemens*
  • Celsius EC* from Cadence*

STEP files work with CAD-based CFD tools like SolidWorks or Autodesk but lack built-in thermal properties, sensors, or 2D power planes found in ECXML files. Altera provides thermal properties separately, which you must add manually to the model. Power should be assigned to the die, and a virtual thermal sensor placed at die center.

Level Two Title