Thermal Design User Guide: MAX® 10 FPGA B610 Package

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ID 851247
Date 5/20/2025
Public
Document Table of Contents
Document Table of Contents x
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines 2. MAX® 10 FPGA B610 Package Mechanical Construction 3. MAX® 10 FPGA B610 Package CTM Construction 4. Quartus Requirements and Power Estimation 5. General FPGA Thermal Design Considerations 6. Thermal Design Process 7. Thermal Solution Mechanical Design 8. Vendor References 9. Document Revision History for the MAX® 10 FPGA B610 Package Thermal Design User Guide A. Thermal Design Elements
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines x
1.1. Thermal Design Requirements 1.2. Definitions of Thermal and Power Terms Used in this Document
2. MAX® 10 FPGA B610 Package Mechanical Construction x
2.1. Thermal Design Process Flow 2.2. Thermal Resistance Values Summary
3. MAX® 10 FPGA B610 Package CTM Construction x
3.1. CTM File Format 3.2. Thermal Modeling with the CTM 3.3. Obtaining the CTM
4. Quartus Requirements and Power Estimation x
4.1. Board Thermal Model 4.2. QPA Outputs
5. General FPGA Thermal Design Considerations x
5.1. FPGA Power Considerations 5.2. FPGA Maximum Allowed Power Dissipation 5.3. Static, Dynamic, and Standby Power
6. Thermal Design Process x
6.1. Package Heat Flow Path 6.2. Recommended Thermal Design Methodology
7. Thermal Solution Mechanical Design x
7.1. Mechanical Design 7.2. TIM2 Selection 7.3. Summary
7.1. Mechanical Design x
7.1.1. Bond Line Thickness (BLT) 7.1.2. Die Warpage 7.1.3. Package Loading 7.1.4. Recommended Pressure Variation Across the Package
7.2. TIM2 Selection x
7.2.1. Gap Pad TIMs 7.2.2. Gap Pad TIM Thermal Conductivity Data 7.2.3. Parametric Studies with Different TIM Materials
1. Introduction to MAX® 10 FPGA B610 Package Thermal Design Guidelines
2. MAX® 10 FPGA B610 Package Mechanical Construction
3. MAX® 10 FPGA B610 Package CTM Construction
4. Quartus Requirements and Power Estimation
5. General FPGA Thermal Design Considerations
6. Thermal Design Process
7. Thermal Solution Mechanical Design
8. Vendor References
9. Document Revision History for the MAX® 10 FPGA B610 Package Thermal Design User Guide
A. Thermal Design Elements

1.2. Definitions of Thermal and Power Terms Used in this Document

The following table defines terms used in this document:

Table 1.  Thermal and Power Terminology
Term Description
FPGA Field programmable gate array.
VPBGA Variable pitch ball grid array package.
FF Form factor.
IO Input/output.
PCB Printed circuit board.
CFD Computational fluid dynamic. A numerical analysis method for solving conjugated heat transfer problems.
CTM Compact thermal model. A geometric model used as an input to a CFD tool.
FAE Field application engineer.
IHS Integrated heat spreader. The top case of an FPGA.
BLT Bond line thickness.
QPA Quartus Power Analyzer.
TIM Thermal interface material.
TCASE Temperature at the center of the integrated heat spreader (IHS) or at the FPGA exposed die.
TTP The total power dissipation of the device. This includes static power, with static power savings subtracted. The PTC reports this value in the Power Summary window.
TDP Thermal Design Power, the power dissipated in a die used for thermal analysis purposes.
TA Ambient temperature, measured locally in the area surrounding the FPGA, the ambient temperature should be measured just upstream of a passive heat sink or at the fan inlet for an active heat sink.
TCORE Core fabric die temperature.
TJ Junction temperature.
TJ-MAX Maximum junction temperature. A maximum allowable absolute temperature rating of the device or a targeted value.
TB Board temperature.
PDYNAMIC Dynamic power.
ӨJB Junction to board thermal resistance.
ӨJC Junction to case thermal resistance.
ӨCS Thermal interface material (TIM) thermal resistance
ӨSA Heat sink to ambient thermal resistance.
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