Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide

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ID 683780
Date 9/29/2022
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Document Table of Contents
Document Table of Contents x
1. Intel Agilex General-Purpose I/O Overview 2. Intel® Agilex™ F-Series and I-Series General-Purpose I/O Banks 3. Intel® Agilex™ HPS I/O Banks 4. Intel® Agilex™ SDM I/O Banks 5. Intel® Agilex™ I/O Troubleshooting Guidelines 6. Intel® Agilex™ General-Purpose I/O IPs 7. Programmable I/O Features Description 8. Documentation Related to the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide 9. Document Revision History for the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide
1. Intel Agilex General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Intel® Agilex™ F-Series and I-Series General-Purpose I/O Banks x
2.1. GPIO Bank Overview 2.2. GPIO Features 2.3. GPIO Implementation Guide 2.4. Intel® Agilex™ I/O Termination 2.5. Intel® Agilex™ GPIO Design Guidelines 2.6. I/O Simulation
2.1. GPIO Bank Overview x
2.1.1. GPIO Bank Structure 2.1.2. I/O Buffers and Registers
2.2. GPIO Features x
2.2.1. Supported I/O Standards for GPIO Banks 2.2.2. GPIO Buffer Behavior 2.2.3. Programmable I/O Element Features for the GPIO Bank
2.2.3. Programmable I/O Element Features for the GPIO Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Open-Drain Output 2.2.3.3. Guidelines: Programmable Bus-Hold 2.2.3.4. Guidelines: Programmable Pull-Up Resistor 2.2.3.5. Guidelines: Programmable De-Emphasis
2.3. GPIO Implementation Guide x
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Intel® Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 2.3.1.3. GPIO Programmable IOE Features Assignment Names and Settings
2.4. Intel® Agilex™ I/O Termination x
2.4.1. Single-Ended I/O Termination in Intel® Agilex™ Devices 2.4.2. True Differential Signaling I/O Termination
2.4.1. Single-Ended I/O Termination in Intel® Agilex™ Devices x
2.4.1.1. Single-Ended I/O Standard OCT Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standard OCT Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination x
2.4.2.1. True Differential Signaling I/O Standard OCT Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard OCT Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. Intel® Agilex™ GPIO Design Guidelines x
2.5.1. VREF Sources and VREF Pins 2.5.2. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.3. OCT Calibration Block Requirement 2.5.4. I/O Pins Placement Requirements 2.5.5. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.6. Simultaneous Switching Noise 2.5.7. Special Pins Requirement 2.5.8. External Memory Interface Pin Placement Requirements 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. Voltage Setting for Unused GPIO Banks 2.5.14. GPIO Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. GPIO Pins for the Avalon® Streaming Interface Configuration Scheme 2.5.19. Maximum True Differential Signaling Receiver Pairs Per I/O Lane
2.6. I/O Simulation x
2.6.1. IBIS Models 2.6.2. HSPICE* Models 2.6.3. Net Length Reports
3. Intel® Agilex™ HPS I/O Banks x
3.1. HPS I/O Bank Overview 3.2. HPS I/O Features 3.3. HPS I/O Implementation Guide 3.4. Intel® Agilex™ HPS I/O Design Guidelines 3.5. HPS I/O Simulation
3.2. HPS I/O Features x
3.2.1. Supported I/O Standards for HPS I/O Banks 3.2.2. HPS I/O Buffer Behavior 3.2.3. Programmable I/O Element Features for the HPS I/O Bank
3.3. HPS I/O Implementation Guide x
3.3.1. Configuring Open Drain Feature for the HPS I/O 3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 3.3.3. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
3.3.2.1. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 3.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
3.4. Intel® Agilex™ HPS I/O Design Guidelines x
3.4.1. Unused Pins 3.4.2. HPS I/O Pins During Power Sequencing 3.4.3. HPS Shared I/O Requirements
3.5. HPS I/O Simulation x
3.5.1. HPS IBIS Models 3.5.2. Net Length Reports
4. Intel® Agilex™ SDM I/O Banks x
4.1. SDM I/O Bank Overview 4.2. SDM I/O Features 4.3. Intel® Agilex™ SDM I/O Design Guidelines 4.4. SDM I/O Simulation
4.2. SDM I/O Features x
4.2.1. Supported I/O Standards for SDM I/O Banks 4.2.2. SDM I/O Buffer Behavior 4.2.3. I/O Standards and Features for Intel® Agilex™ Configuration Pins
4.3. Intel® Agilex™ SDM I/O Design Guidelines x
4.3.1. Unused Pins 4.3.2. SDM I/O Pins During Power Sequencing
4.4. SDM I/O Simulation x
4.4.1. SDM IBIS Models 4.4.2. Net Length Reports
6. Intel® Agilex™ General-Purpose I/O IPs x
6.1. GPIO Intel® FPGA IP 6.2. OCT Intel® FPGA IP
6.1. GPIO Intel® FPGA IP x
6.1.1. Release Information for GPIO Intel® FPGA IP 6.1.2. Generating the GPIO Intel® FPGA IP 6.1.3. GPIO Intel® FPGA IP Parameter Settings 6.1.4. GPIO Intel® FPGA IP Interface Signals 6.1.5. GPIO Intel® FPGA IP Architecture 6.1.6. Verifying Resource Utilization and Design Performance 6.1.7. GPIO Intel® FPGA IP Timing 6.1.8. GPIO Intel® FPGA IP Design Examples
6.1.2. Generating the GPIO Intel® FPGA IP x
6.1.2.1. Intel® FPGA IP Generation Output
6.1.3. GPIO Intel® FPGA IP Parameter Settings x
6.1.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
6.1.4. GPIO Intel® FPGA IP Interface Signals x
6.1.4.1. Shared Signals 6.1.4.2. Data Bit-Order for Data Interface 6.1.4.3. Input and Output Bus High and Low Bits 6.1.4.4. Data Interface Signals and Corresponding Clocks
6.1.5. GPIO Intel® FPGA IP Architecture x
6.1.5.1. GPIO Intel® FPGA IP Data Paths 6.1.5.2. Register Packing
6.1.5.1. GPIO Intel® FPGA IP Data Paths x
6.1.5.1.1. Input Path 6.1.5.1.2. Output and Output Enable Paths
6.1.7. GPIO Intel® FPGA IP Timing x
6.1.7.1. Timing Components 6.1.7.2. Delay Elements 6.1.7.3. Timing Analysis 6.1.7.4. Timing Closure Guidelines
6.1.7.3. Timing Analysis x
6.1.7.3.1. Single Data Rate Input Register 6.1.7.3.2. Full-Rate or Half-Rate DDIO Input Register 6.1.7.3.3. Single Data Rate Output Register 6.1.7.3.4. Full-Rate or Half-Rate DDIO Output Register
6.1.8. GPIO Intel® FPGA IP Design Examples x
6.1.8.1. GPIO Intel® FPGA IP Synthesizable Intel® Quartus® Prime Design Example 6.1.8.2. GPIO Intel® FPGA IP Simulation Design Example
6.2. OCT Intel® FPGA IP x
6.2.1. Release Information 6.2.2. Generating the OCT Intel® FPGA IP 6.2.3. OCT Intel® FPGA IP Parameter Settings 6.2.4. OCT Intel® FPGA IP Signals 6.2.5. QSF Assignments 6.2.6. OCT Intel® FPGA IP Architecture 6.2.7. OCT Intel® FPGA IP Design Example
6.2.2. Generating the OCT Intel® FPGA IP x
6.2.2.1. Intel® FPGA IP Generation Output
6.2.7. OCT Intel® FPGA IP Design Example x
6.2.7.1. Generating the Intel® Quartus® Prime Design Example
7. Programmable I/O Features Description x
7.1. Programmable Pre-Emphasis 7.2. Programmable De-Emphasis 7.3. Programmable Differential Output Voltage
1. Intel Agilex General-Purpose I/O Overview
2. Intel® Agilex™ F-Series and I-Series General-Purpose I/O Banks
3. Intel® Agilex™ HPS I/O Banks
4. Intel® Agilex™ SDM I/O Banks
5. Intel® Agilex™ I/O Troubleshooting Guidelines
6. Intel® Agilex™ General-Purpose I/O IPs
7. Programmable I/O Features Description
8. Documentation Related to the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide
9. Document Revision History for the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide

2.2.1. Supported I/O Standards for GPIO Banks

The VCCIO_PIO and VCCPT power supplies power the Intel® Agilex™ GPIO buffers. Each I/O bank has its own VCCIO_PIO power supply and supports only one I/O voltage.

The True Differential Signaling I/O standard is compatible with the LVDS, RSDS, Mini-LVDS, and LVPECL standards at a lower signal swing.

You can place the True Differential Signaling input buffer in a GPIO bank powered by 1.2 V and 1.5 V VCCIO_PIO. The maximum input voltage to the True Differential Signaling input buffer must not exceed the value of :
  • For 1.5V VCCIO_PIO bank, the maximum input voltage is 1.7 V
  • For 1.2V VCCIO_PIO bank, the maximum input voltage is 1.4 V

By default, the Intel® Quartus® Prime software assigns 1.2 V to the VCCIO_PIO pin in unused I/O banks. To assign 0 V, 1.2 V, or 1.5 V I/O standards to the pin, specify the assignment in the .qsf file located in your design directory.

Table 2.   Intel® Agilex™ GPIO Bank Supported I/O StandardsThis table lists the input and output voltages of a GPIO bank.
I/O Standard VCCIO_PIO (V) VCCPT (V) VREF (V) VTT (V) JEDEC Standard
Input Output
1.2 V LVCMOS 1.2 1.2 1.8 — — JESD-12A.01
SSTL-12 1.2 1.2 1.8 0.6 0.6 JESD79-4B
HSTL-12 1.2 1.2 1.8 0.6 0.6 JESD-16A
HSUL-12 1.2 1.2 1.8 0.6 — JESD209-3C
POD12 1.2 1.2 1.8 Internally calibrated 1.2 JESD79-4B
Differential SSTL-12 1 1.2 1.2 1.8 — 0.6 JESD79-4B
Differential HSTL-12 1 1.2 1.2 1.8 — 0.6 JESD8-16A
Differential HSUL-12 1 1.2 1.2 1.8 — — JESD209-3C
Differential POD-12 1 1.2 1.2 1.8 Internally calibrated 1.2 JESD79-4B
True Differential Signaling 2 1.2/1.5 1.5 1.8 — — —
Related Information
1 Uses two single-ended outputs with second output programmed as inverted.
2 True Differential Signaling input buffers are powered by 1.8 V VCCPT
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