Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide

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ID 683780
Date 9/29/2022
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Document Table of Contents
Document Table of Contents x
1. Intel Agilex General-Purpose I/O Overview 2. Intel® Agilex™ F-Series and I-Series General-Purpose I/O Banks 3. Intel® Agilex™ HPS I/O Banks 4. Intel® Agilex™ SDM I/O Banks 5. Intel® Agilex™ I/O Troubleshooting Guidelines 6. Intel® Agilex™ General-Purpose I/O IPs 7. Programmable I/O Features Description 8. Documentation Related to the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide 9. Document Revision History for the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide
1. Intel Agilex General-Purpose I/O Overview x
1.1. Package Selection and I/O Vertical Migration Support 1.2. Types of I/O Banks
2. Intel® Agilex™ F-Series and I-Series General-Purpose I/O Banks x
2.1. GPIO Bank Overview 2.2. GPIO Features 2.3. GPIO Implementation Guide 2.4. Intel® Agilex™ I/O Termination 2.5. Intel® Agilex™ GPIO Design Guidelines 2.6. I/O Simulation
2.1. GPIO Bank Overview x
2.1.1. GPIO Bank Structure 2.1.2. I/O Buffers and Registers
2.2. GPIO Features x
2.2.1. Supported I/O Standards for GPIO Banks 2.2.2. GPIO Buffer Behavior 2.2.3. Programmable I/O Element Features for the GPIO Bank
2.2.3. Programmable I/O Element Features for the GPIO Bank x
2.2.3.1. Guidelines: Programmable Output Slew Rate Control 2.2.3.2. Guidelines: Programmable Open-Drain Output 2.2.3.3. Guidelines: Programmable Bus-Hold 2.2.3.4. Guidelines: Programmable Pull-Up Resistor 2.2.3.5. Guidelines: Programmable De-Emphasis
2.3. GPIO Implementation Guide x
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 2.3.2. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
2.3.1. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
2.3.1.1. Assigning Pin I/O Standards in the Intel® Quartus® Prime Assignment Editor 2.3.1.2. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 2.3.1.3. GPIO Programmable IOE Features Assignment Names and Settings
2.4. Intel® Agilex™ I/O Termination x
2.4.1. Single-Ended I/O Termination in Intel® Agilex™ Devices 2.4.2. True Differential Signaling I/O Termination
2.4.1. Single-Ended I/O Termination in Intel® Agilex™ Devices x
2.4.1.1. Single-Ended I/O Standard OCT Termination 2.4.1.2. OCT Calibration Block 2.4.1.3. Single-Ended I/O Standards External Termination 2.4.1.4. Single-Ended I/O Termination Implementation Guide
2.4.1.1. Single-Ended I/O Standard OCT Termination x
2.4.1.1.1. RS OCT 2.4.1.1.2. RT OCT 2.4.1.1.3. Dynamic OCT
2.4.1.4. Single-Ended I/O Termination Implementation Guide x
2.4.1.4.1. Configuring OCT Using the Assignment Editor 2.4.1.4.2. OCT Features Assignment Names and Settings
2.4.2. True Differential Signaling I/O Termination x
2.4.2.1. True Differential Signaling I/O Standard OCT Termination 2.4.2.2. True Differential Signaling I/O Standard External Termination
2.4.2.1. True Differential Signaling I/O Standard OCT Termination x
2.4.2.1.1. Configuring Differential Input RD OCT Using the Assignment Editor 2.4.2.1.2. Guidelines: Differential Input RD OCT
2.5. Intel® Agilex™ GPIO Design Guidelines x
2.5.1. VREF Sources and VREF Pins 2.5.2. I/O Standards Implementation Based on VCCIO_PIO Voltages 2.5.3. OCT Calibration Block Requirement 2.5.4. I/O Pins Placement Requirements 2.5.5. I/O Standard Selection and I/O Bank Supply Compatibility Check 2.5.6. Simultaneous Switching Noise 2.5.7. Special Pins Requirement 2.5.8. External Memory Interface Pin Placement Requirements 2.5.9. HPS Shared I/O Requirements 2.5.10. Clocking Requirements 2.5.11. SDM Shared I/O Requirements 2.5.12. Unused Pins 2.5.13. Voltage Setting for Unused GPIO Banks 2.5.14. GPIO Pins During Power Sequencing 2.5.15. Drive Strength Requirement for GPIO Input Pins 2.5.16. Maximum DC Current Restrictions 2.5.17. 1.2 V I/O Interface Voltage Level Compatibility 2.5.18. GPIO Pins for the Avalon® Streaming Interface Configuration Scheme 2.5.19. Maximum True Differential Signaling Receiver Pairs Per I/O Lane
2.6. I/O Simulation x
2.6.1. IBIS Models 2.6.2. HSPICE* Models 2.6.3. Net Length Reports
3. Intel® Agilex™ HPS I/O Banks x
3.1. HPS I/O Bank Overview 3.2. HPS I/O Features 3.3. HPS I/O Implementation Guide 3.4. Intel® Agilex™ HPS I/O Design Guidelines 3.5. HPS I/O Simulation
3.2. HPS I/O Features x
3.2.1. Supported I/O Standards for HPS I/O Banks 3.2.2. HPS I/O Buffer Behavior 3.2.3. Programmable I/O Element Features for the HPS I/O Bank
3.3. HPS I/O Implementation Guide x
3.3.1. Configuring Open Drain Feature for the HPS I/O 3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor 3.3.3. Assigning Pin I/O Standards in the Intel® Quartus® Prime Pin Planner
3.3.2. I/O Assignments with the Intel® Quartus® Prime Assignment Editor x
3.3.2.1. Assigning Programmable IOE Features in the Intel® Quartus® Prime Assignment Editor 3.3.2.2. HPS I/O Programmable IOE Features Assignment Names and Settings
3.4. Intel® Agilex™ HPS I/O Design Guidelines x
3.4.1. Unused Pins 3.4.2. HPS I/O Pins During Power Sequencing 3.4.3. HPS Shared I/O Requirements
3.5. HPS I/O Simulation x
3.5.1. HPS IBIS Models 3.5.2. Net Length Reports
4. Intel® Agilex™ SDM I/O Banks x
4.1. SDM I/O Bank Overview 4.2. SDM I/O Features 4.3. Intel® Agilex™ SDM I/O Design Guidelines 4.4. SDM I/O Simulation
4.2. SDM I/O Features x
4.2.1. Supported I/O Standards for SDM I/O Banks 4.2.2. SDM I/O Buffer Behavior 4.2.3. I/O Standards and Features for Intel® Agilex™ Configuration Pins
4.3. Intel® Agilex™ SDM I/O Design Guidelines x
4.3.1. Unused Pins 4.3.2. SDM I/O Pins During Power Sequencing
4.4. SDM I/O Simulation x
4.4.1. SDM IBIS Models 4.4.2. Net Length Reports
6. Intel® Agilex™ General-Purpose I/O IPs x
6.1. GPIO Intel® FPGA IP 6.2. OCT Intel® FPGA IP
6.1. GPIO Intel® FPGA IP x
6.1.1. Release Information for GPIO Intel® FPGA IP 6.1.2. Generating the GPIO Intel® FPGA IP 6.1.3. GPIO Intel® FPGA IP Parameter Settings 6.1.4. GPIO Intel® FPGA IP Interface Signals 6.1.5. GPIO Intel® FPGA IP Architecture 6.1.6. Verifying Resource Utilization and Design Performance 6.1.7. GPIO Intel® FPGA IP Timing 6.1.8. GPIO Intel® FPGA IP Design Examples
6.1.2. Generating the GPIO Intel® FPGA IP x
6.1.2.1. Intel® FPGA IP Generation Output
6.1.3. GPIO Intel® FPGA IP Parameter Settings x
6.1.3.1. Guideline: Swap datain_h and datain_l Ports in Migrated IP
6.1.4. GPIO Intel® FPGA IP Interface Signals x
6.1.4.1. Shared Signals 6.1.4.2. Data Bit-Order for Data Interface 6.1.4.3. Input and Output Bus High and Low Bits 6.1.4.4. Data Interface Signals and Corresponding Clocks
6.1.5. GPIO Intel® FPGA IP Architecture x
6.1.5.1. GPIO Intel® FPGA IP Data Paths 6.1.5.2. Register Packing
6.1.5.1. GPIO Intel® FPGA IP Data Paths x
6.1.5.1.1. Input Path 6.1.5.1.2. Output and Output Enable Paths
6.1.7. GPIO Intel® FPGA IP Timing x
6.1.7.1. Timing Components 6.1.7.2. Delay Elements 6.1.7.3. Timing Analysis 6.1.7.4. Timing Closure Guidelines
6.1.7.3. Timing Analysis x
6.1.7.3.1. Single Data Rate Input Register 6.1.7.3.2. Full-Rate or Half-Rate DDIO Input Register 6.1.7.3.3. Single Data Rate Output Register 6.1.7.3.4. Full-Rate or Half-Rate DDIO Output Register
6.1.8. GPIO Intel® FPGA IP Design Examples x
6.1.8.1. GPIO Intel® FPGA IP Synthesizable Intel® Quartus® Prime Design Example 6.1.8.2. GPIO Intel® FPGA IP Simulation Design Example
6.2. OCT Intel® FPGA IP x
6.2.1. Release Information 6.2.2. Generating the OCT Intel® FPGA IP 6.2.3. OCT Intel® FPGA IP Parameter Settings 6.2.4. OCT Intel® FPGA IP Signals 6.2.5. QSF Assignments 6.2.6. OCT Intel® FPGA IP Architecture 6.2.7. OCT Intel® FPGA IP Design Example
6.2.2. Generating the OCT Intel® FPGA IP x
6.2.2.1. Intel® FPGA IP Generation Output
6.2.7. OCT Intel® FPGA IP Design Example x
6.2.7.1. Generating the Intel® Quartus® Prime Design Example
7. Programmable I/O Features Description x
7.1. Programmable Pre-Emphasis 7.2. Programmable De-Emphasis 7.3. Programmable Differential Output Voltage
1. Intel Agilex General-Purpose I/O Overview
2. Intel® Agilex™ F-Series and I-Series General-Purpose I/O Banks
3. Intel® Agilex™ HPS I/O Banks
4. Intel® Agilex™ SDM I/O Banks
5. Intel® Agilex™ I/O Troubleshooting Guidelines
6. Intel® Agilex™ General-Purpose I/O IPs
7. Programmable I/O Features Description
8. Documentation Related to the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide
9. Document Revision History for the Intel® Agilex™ F-Series and I-Series General-Purpose I/O User Guide

7. Programmable I/O Features Description

Table 63.  I/O Features and Description
I/O Features Description
Programmable Output Slew Rate Control

Each I/O pin contains a slew rate control, allowing you to specify the slew rate on a pin-by-pin basis. The slew rate control affects both the rising and falling edges of the signal.

A faster slew rate provides high-speed transitions for high-performance systems while a slower slew rate reduces system noise and crosstalk but adds a nominal delay to the rising and falling edges.

Programmable IOE Delay

You can activate the programmable IOE delays to ensure zero hold time, minimize setup time, or increase the clock-to-output time. This feature helps read and write timing margins because it minimizes the uncertainties between signals on the bus.

Each pin can have a different input delay from the pin-to-input register or a delay from output register-to-output pin values. This is to ensure that the signals within a bus have the same delay going into or out of the device.

Programmable Open-Drain Output

The programmable open-drain output provides a high-impedance state on output when logic to the output buffer is high. If logic to the output buffer is low, the output is low.

You can attach several open-drain outputs to a wire. This connection type is like a logical OR function and is commonly called an active-low wired-OR circuit. If at least one of the outputs is in logic 0 state (active), the circuit sinks the current and brings the line to low voltage.

You can use open-drain output if you are connecting multiple devices to a bus. For example, you can use the open-drain output for system-level control signals that can be asserted by any device or as an interrupt.

Programmable Bus-Hold

Each I/O pin supports an optional bus-hold feature that is active only after configuration. When the device enters user mode, the bus-hold circuit captures the value that is present on the pin by the end of the configuration.

The bus-hold circuitry uses a resistor to weakly pull the signal level to the last-driven state of the pin. The bus-hold circuitry holds this pin state until the next input signal is present. Therefore, you do not require an external pull-up or pull-down resistor to hold a signal level when the bus is tri-stated.

For each I/O pin, you can individually specify that the bus-hold circuitry pulls non-driven pins away from the input threshold voltage—where noise can cause unintended high-frequency switching. To prevent over-driving signals, the bus-hold circuitry drives the voltage level of the I/O pin lower than the I/O bank power supply level.

Programmable Pull-Up Resistor

Each I/O pin on supported banks provides an optional programmable pull-up resistor during user mode. The pull-up resistor weakly holds the I/O to the I/O bank power supply level.

Programmable Pull-Down Resistor

Each I/O pin on supported banks provides an optional programmable pull-down resistor during user mode. The pull-down resistor weakly holds the I/O to the ground level.

Programmable Pre-Emphasis

Pre-emphasis momentarily boosts the high-frequency component of the output signal during switching to increase the output slew rate. The amount of pre-emphasis required depends on the attenuation of the high-frequency component along the transmission line.

For more information, refer to Programmable Pre-Emphasis.

Programmable De-Emphasis

De-emphasis attenuates the I/O signal height when the symbol is longer than the specified duration. You can use de-emphasis to alter the signal amplitude to compensate for signal degradation over long transmission path.

For more information, refer to Programmable De-Emphasis.

Programmable Differential Output Voltage

The programmable VOD settings allow you to adjust the output eye-opening to optimize the trace length and power consumption. A higher VOD swing improves voltage margins at the receiver end, and a smaller VOD swing reduces power consumption.

For more information, refer to Programmable Differential Output Voltage.

Schmitt Trigger

The Schmitt Trigger allows input buffers to respond to slow input edge rates with a fast output edge rate. Most importantly, Schmitt Triggers provide hysteresis on the input buffer, preventing slow-rising noisy input signals from ringing or oscillating on the input signal driven into the logic array.

This feature provides system noise tolerance on the device inputs but adds a small, nominal input delay.

Section Content
Programmable Pre-Emphasis
Programmable De-Emphasis
Programmable Differential Output Voltage

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