Intel® Stratix® 10 TX Transceiver Signal Integrity Development Kit User Guide

ID 683591
Date 9/27/2019
Document Table of Contents

4.11.5. Thermal Limitations and Protection Guidelines

With 25 °C ambient temperature and 50 °C printed circuit board (PCB) temperature, you must ensure that your FPGA designs do not consume more than 200 W with the liquid cooling solution.

MAX6581 chip is connected to the Intel® Stratix® 10 TX FPGA internal temperature diode to continuously monitor FPGA die temperature. Meanwhile, a dedicated FPGA TSD real-time monitor solution under ~\ip\onchip_sensors\ is added to each transceiver example design to monitor the temperatures of both FPGA core and each transceiver tile.

Based on the data from both MAX6581 and FPGA, MAX V will run fan at its maximum speed whenever any temperature is over 60 °C or immediately power off the board whenever any temperature is over 100 °C. Remember to unplug the power supply when the board is powered off after the temperature crosses 100 °C. Plug the power supply back again to ensure that the board can be normally turned on/off again.

The cooling parts (air duct and fan) for QSFPDD modules are pre-installed, but not powered by default. Plug them into the J60 header if your designs require additional cooling on these interfaces. You can adjust fan speed for both FPGA and optical modules through Power GUI.