MAX® 10 FPGA Signal Integrity Design Guidelines

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ID 683572
Date 3/17/2025
Public
Document Table of Contents
Document Table of Contents x
1. MAX® 10 FPGA Signal Integrity Design Guidelines
1. MAX® 10 FPGA Signal Integrity Design Guidelines x
1.1. Definitions 1.2. Understanding SSN 1.3. Guidelines: Data Input Pin 1.4. Guidelines: Clock and Asynchronous Control Input Signal 1.5. Guidelines: Clock and Data Input Signal for MAX® 10 E144 Package 1.6. Guidelines: I/O Restriction Rules 1.7. Guidelines: Placement Restrictions for 1.0 V I/O Pin 1.8. Guidelines: LVTTL/LVCMOS I/O Utilization for MAX® 10 FPGA Package B610 1.9. Guidelines: External Memory Interface I/O Restrictions 1.10. Guidelines: Board Design Requirement for DDR2, DDR3, and LPDDR2 1.11. Guidelines: Analog-to-Digital Converter I/O Restriction 1.12. Guidelines: Voltage-Referenced I/O Standards Restriction 1.13. Guidelines: Adhere to the LVDS I/O Restrictions Rules 1.14. Guidelines: Enable Clamp Diode for LVTTL/LVCMOS Input Buffers 1.15. Guidelines: ADC Ground Plane Connection 1.16. Guidelines: Board Design for ADC Reference Voltage Pin 1.17. Guidelines: Board Design for Analog Input 1.18. Guidelines: Board Design for Power Supply Pin and ADC Ground (REFGND) 1.19. Guidelines: MAX® 10 Variable Pitch BGA (VPBGA) Package Overview and Board Fan-Out Recommendations 1.20. Document Revision History for the MAX® 10 FPGA Signal Integrity Design Guidelines
1.4. Guidelines: Clock and Asynchronous Control Input Signal x
1.4.1. Schmitt-Trigger Input Buffer
1.7. Guidelines: Placement Restrictions for 1.0 V I/O Pin x
1.7.1. Calculating the Total Inductance for 1.0 V Pin Placement
1.8. Guidelines: LVTTL/LVCMOS I/O Utilization for MAX® 10 FPGA Package B610 x
1.8.1. GPIO SSO Estimator Tool for MAX® 10 FPGA Package B610
1.8.1. GPIO SSO Estimator Tool for MAX® 10 FPGA Package B610 x
1.8.1.1. GPIO SSO Estimator Tool for MAX® 10 FPGA Package B610 Parameters 1.8.1.2. GPIO SSO Estimator Tool for MAX® 10 FPGA Package B610 Result Analysis 1.8.1.3. GPIO SSO Estimator Tool for MAX® 10 FPGA Package B610 Result Mitigation
1.19. Guidelines: MAX® 10 Variable Pitch BGA (VPBGA) Package Overview and Board Fan-Out Recommendations x
1.19.1. Overview of MAX® 10 VPBGA 1.19.2. MAX® 10 VPBGA Board Fan-Out
1. MAX® 10 FPGA Signal Integrity Design Guidelines

1.18. Guidelines: Board Design for Power Supply Pin and ADC Ground (REFGND)

The crosstalk requirement for analog to digital signal is -100 dB up to 2 GHz. There must be no parallel routing between power, ground, and surrounding general purpose I/O traces. If a power plane is not possible, route the power and ground traces as wide as possible.
  • To reduce IR drop and switching noise, keep the impedance as low as possible for the ADC power and ground. The maximum DC resistance for power is 1.5 Ω.
  • The power supplies connected to the ADC should have ferrite beads in series followed by a 10 µF capacitor to the ground. This setup ensures that no external noise goes into the device power supply pins.
  • Decouple each of the device power supply pin with a 0.1 µF capacitor. Place the capacitor as close as possible to the device pin.
Figure 11. Recommended RC Filter for Power Traces


There is no impedance requirement for the REFGND. Altera recommends that you use the lowest impedance with the most minimum DC resistance possible. Typical resistance is less than 1 Ω.

Altera recommends that you set a REFGND plane that extends as close as possible to the corresponding decoupling capacitor and FPGA:

  • If possible, define a complete REFGND plane in the layout.
  • Otherwise, route the REFGND using a trace that is as wide as possible from the island to the FPGA pins and decoupling capacitor.
  • The REFGND ground is the analog ground plane for the ADC VREF and analog input.
  • Connect REFGND ground to the system digital ground through ferrite beads. You can also evaluate the ferrite bead option by comparing the impedance with the frequency specifications.
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