Intel® Stratix® 10 DX FPGA Development Kit User Guide

ID 683561
Date 9/25/2023
Document Table of Contents

A.2.2. Thermal Requirements

The thermal solution is an active cooling system designed to cool up to 250W total power of the board. The heatsink is designed to meet the height constraints of a 2-slot PCIe card form-factor as defined by the PCIe CEM specification revision 3.0.

The heatsink is securely mounted to the board using screws for easy assembly and removal. The thermal material used between FPGA and heatsink also ensures good thermal contact.
Figure 36. Air-cooled Heatsink Setup