Intel® Stratix® 10 DX FPGA Development Kit User Guide

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ID 683561
Date 9/25/2023
Public
Document Table of Contents
Document Table of Contents x
1. Getting Started 2. Development Kit Overview 3. Power Up the Development Kit 4. Board Test System (BTS) 5. Development Kit Hardware and Configuration 6. Document Revision History for Intel® Stratix® 10 DX FPGA Development Kit User Guide A. Development Kit Components B. Safety and Regulatory Information C. Compliance and Conformity Information
1. Getting Started x
1.1. About this Document 1.2. Installing the Intel® Quartus® Prime Pro Edition Software 1.3. Downloading the Board Package 1.4. Installing the Driver for Intel FPGA Download Cable II
1.2. Installing the Intel® Quartus® Prime Pro Edition Software x
1.2.1. Activating Your License
2. Development Kit Overview x
2.1. Supported Features 2.2. Recommended Operating Conditions 2.3. Handling the Board
3. Power Up the Development Kit x
3.1. Default Switch Settings 3.2. Connectors and LEDs 3.3. Performing Board Restore through Board Test System (BTS) 3.4. Controlling On-board Clock
4. Board Test System (BTS) x
4.1. Preparing the Development Kit 4.2. Running the Board Test System 4.3. Using the Board Test System 4.4. Smart VID Setting
4.3. Using the Board Test System x
4.3.1. Configure Menu 4.3.2. Sys Info Tab 4.3.3. GPIO Tab 4.3.4. QSFP Tab 4.3.5. Component DDR4 CH0 Tab 4.3.6. Component DDR4 CH1 Tab 4.3.7. DDR4 DIMM CH0 Tab 4.3.8. DDR4 DIMM CH1 Tab 4.3.9. Power Monitor 4.3.10. Clock Controller
5. Development Kit Hardware and Configuration x
5.1. FPGA Configuration 5.2. Programming the FPGA Over Intel® FPGA Download Cable 5.3. Configuration Modes
5.3. Configuration Modes x
5.3.1. Avalon® Streaming Interface x8 Mode 5.3.2. JTAG Mode
5.3.1. Avalon® Streaming Interface x8 Mode x
Avalon® Streaming Interface x8 Configuration Guideline
A. Development Kit Components x
A.1. Components Overview A.2. Power, Thermal, and Mechanical Considerations A.3. Clock Circuits A.4. Memory Interface A.5. PCIe Interface A.6. UPI Interface A.7. Transceiver Signals: PCIe and UPI Interface A.8. SlimSAS Connector A.9. QSFP Network Interface A.10. I2C Interface A.11. QSPI Flash Memory
A.2. Power, Thermal, and Mechanical Considerations x
A.2.1. Power Guidelines A.2.2. Thermal Requirements A.2.3. Mechanical Requirements
A.2.1. Power Guidelines x
A.2.1.1. Power Distribution A.2.1.2. Power Sequence A.2.1.3. Power Measurement
A.2.2. Thermal Requirements x
A.2.2.1. Operating Conditions A.2.2.2. Temperature Monitoring
A.9. QSFP Network Interface x
A.9.1. Dual Port Controller
A.11. QSPI Flash Memory x
A.11.1. Configuration QSPI Flash Memory A.11.2. NIOS QSPI Flash Memory
B. Safety and Regulatory Information x
B.1. Safety Warnings B.2. Safety Cautions
1. Getting Started
2. Development Kit Overview
3. Power Up the Development Kit
4. Board Test System (BTS)
5. Development Kit Hardware and Configuration
6. Document Revision History for Intel® Stratix® 10 DX FPGA Development Kit User Guide
A. Development Kit Components
B. Safety and Regulatory Information
C. Compliance and Conformity Information

A.2.2.2. Temperature Monitoring

A temperature sensing device (MAX6581) monitors the temperature of the Intel® Stratix® 10 DX FPGA device. The Intel® Stratix® 10 DX FPGA device has seven die temperature diodes. The MAX6581 device senses these diodes and convert the signals to a digital form for the Intel® MAX® 10 device that can be read via a I2C bus.

Additionally, the OVERTEMPn and ALERTn signals from the MAX6581 allow Intel® MAX® 10 device to immediately sense a temperature fault condition. The Intel® MAX® 10 device controls the over temperature warning LED (D40, red-colored) to indicate an over temperature fault condition. Temperature fault set points can be programmed into the MAX6581 device.
Figure 37. MAX6581 Temperature Sensor Circuit
Level Two Title