Intel® MAX® 10 FPGA Device Architecture

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ID 683105
Date 10/31/2022
Public
Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 FPGA Device Architecture
1. Intel® MAX® 10 FPGA Device Architecture x
1.1. Logic Array Block 1.2. Embedded Memory 1.3. Embedded Multiplier 1.4. Clocking and PLL 1.5. General Purpose I/O 1.6. High-Speed LVDS I/O 1.7. External Memory Interface 1.8. Analog to Digital Converter 1.9. Configuration Schemes 1.10. User Flash Memory 1.11. Power Management 1.12. Document Revision History for Intel® MAX® 10 FPGA Device Architecture
1.1. Logic Array Block x
1.1.1. LAB Interconnects 1.1.2. LAB Control Signals 1.1.3. Logic Elements
1.1.3. Logic Elements x
1.1.3.1. LE Features 1.1.3.2. LE Operating Modes
1.1.3.2. LE Operating Modes x
1.1.3.2.1. Normal Mode 1.1.3.2.2. Arithmetic Mode
1.3. Embedded Multiplier x
1.3.1. 18-Bit Multipliers 1.3.2. 9-Bit Multipliers
1.4. Clocking and PLL x
1.4.1. Global Clock Networks 1.4.2. Internal Oscillator 1.4.3. PLL Block and Locations
1.5. General Purpose I/O x
1.5.1. Intel® MAX® 10 I/O Banks Architecture 1.5.2. Intel® MAX® 10 I/O Banks Locations
1.6. High-Speed LVDS I/O x
1.6.1. Intel® MAX® 10 High-Speed LVDS Circuitry 1.6.2. Intel® MAX® 10 High-Speed LVDS I/O Location
1.7. External Memory Interface x
1.7.1. Intel® MAX® 10 I/O Banks for External Memory Interface
1.8. Analog to Digital Converter x
1.8.1. ADC Block Locations
1.9. Configuration Schemes x
1.9.1. JTAG Configuration 1.9.2. Internal Configuration
1.11. Power Management x
1.11.1. Single-Supply Device 1.11.2. Dual-Supply Device 1.11.3. Power Management Controller Scheme 1.11.4. Hot Socketing
1. Intel® MAX® 10 FPGA Device Architecture

1.11.4. Hot Socketing

The Intel® MAX® 10 device offers hot socketing, which is also known as hot plug-in or hot swap, and power sequencing support without the use of any external devices. You can insert or remove the Intel® MAX® 10 device on a board in a system during system operation. This does not affect the running system bus or the board that is inserted into the system.

The hot-socketing feature removes some encountered difficulties when using the Intel® MAX® 10 device on a PCB that contains a mixture of devices with different voltage levels.

With the Intel® MAX® 10 device hot-socketing feature, you no longer need to ensure a proper power-up sequence for each device on the board. Intel® MAX® 10 device hot-socketing feature provides:
  • Board or device insertion and removal without external components or board manipulation
  • Support for any power-up sequence
  • Non-intrusive I/O buffers to system buses during hot insertion
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