Intel® MAX® 10 FPGA Device Architecture

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ID 683105
Date 10/31/2022
Public
Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 FPGA Device Architecture
1. Intel® MAX® 10 FPGA Device Architecture x
1.1. Logic Array Block 1.2. Embedded Memory 1.3. Embedded Multiplier 1.4. Clocking and PLL 1.5. General Purpose I/O 1.6. High-Speed LVDS I/O 1.7. External Memory Interface 1.8. Analog to Digital Converter 1.9. Configuration Schemes 1.10. User Flash Memory 1.11. Power Management 1.12. Document Revision History for Intel® MAX® 10 FPGA Device Architecture
1.1. Logic Array Block x
1.1.1. LAB Interconnects 1.1.2. LAB Control Signals 1.1.3. Logic Elements
1.1.3. Logic Elements x
1.1.3.1. LE Features 1.1.3.2. LE Operating Modes
1.1.3.2. LE Operating Modes x
1.1.3.2.1. Normal Mode 1.1.3.2.2. Arithmetic Mode
1.3. Embedded Multiplier x
1.3.1. 18-Bit Multipliers 1.3.2. 9-Bit Multipliers
1.4. Clocking and PLL x
1.4.1. Global Clock Networks 1.4.2. Internal Oscillator 1.4.3. PLL Block and Locations
1.5. General Purpose I/O x
1.5.1. Intel® MAX® 10 I/O Banks Architecture 1.5.2. Intel® MAX® 10 I/O Banks Locations
1.6. High-Speed LVDS I/O x
1.6.1. Intel® MAX® 10 High-Speed LVDS Circuitry 1.6.2. Intel® MAX® 10 High-Speed LVDS I/O Location
1.7. External Memory Interface x
1.7.1. Intel® MAX® 10 I/O Banks for External Memory Interface
1.8. Analog to Digital Converter x
1.8.1. ADC Block Locations
1.9. Configuration Schemes x
1.9.1. JTAG Configuration 1.9.2. Internal Configuration
1.11. Power Management x
1.11.1. Single-Supply Device 1.11.2. Dual-Supply Device 1.11.3. Power Management Controller Scheme 1.11.4. Hot Socketing
1. Intel® MAX® 10 FPGA Device Architecture

1.7. External Memory Interface

The Intel® MAX® 10 devices are capable of interfacing with a broad range of external memory standards.

This capability allows you to use the Intel® MAX® 10 devices in a wide range of applications such as image processing, storage, communications, and general embedded systems.

The external memory interface solution in Intel® MAX® 10 devices consist of:

  • The I/O elements that support external memory interfaces.
  • The UniPHY IP core that allows you to configure the memory interfaces to support different external memory interface standards.

Section Content
Intel MAX 10 I/O Banks for External Memory Interface

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