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1.1. Logic Array Block
1.2. Embedded Memory
1.3. Embedded Multiplier
1.4. Clocking and PLL
1.5. General Purpose I/O
1.6. High-Speed LVDS I/O
1.7. External Memory Interface
1.8. Analog to Digital Converter
1.9. Configuration Schemes
1.10. User Flash Memory
1.11. Power Management
1.12. Document Revision History for Intel® MAX® 10 FPGA Device Architecture
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1.6.2. Intel® MAX® 10 High-Speed LVDS I/O Location
All I/O banks in Intel® MAX® 10 devices support 2.5 V true LVDS input and 2.5 V emulated LVDS output. The high-speed I/O banks also support 1.8 V true LVDS input. Only the bottom I/O banks support 2.5 V and 1.8 V true LVDS outputs.
Note: The 1.8 V LVDS buffers are supported as inputs on all high-speed I/O banks but as outputs only on the bottom banks. The low-speed and high-speed DDR3 I/O banks do not support 1.8 V LVDS. The 1.8 V LVDS I/O standard is supported in industrial- and commercial-grade Intel® MAX® 10 dual supply devices except in packages V36 and V81. Refer to the related information.
Figure 21. LVDS Support in I/O Banks of 10M02 Devices (Except Single Power Supply U324 Package)This figure shows a top view of the silicon die. Each bank is labeled with the actual bank number. LVPECL support only in banks 2 and 6.
Figure 22. LVDS Support in I/O Banks of 10M02 (Single Power Supply U324 Package), 10M04, and 10M08 (Except V81, M153, and U169 Packages) DevicesThis figure shows a top view of the silicon die. Each bank is labeled with the actual bank number. LVPECL support only in banks 2 and 6.
Figure 23. LVDS Support in I/O Banks of 10M08 V81, M153, and U169 Packages Devices
Figure 24. LVDS Support in I/O Banks of 10M16, 10M25, 10M40, and 10M50 DevicesThis figure shows a top view of the silicon die. Each bank is labeled with the actual bank number. LVPECL support only in banks 2, 3, 6, and 8.