Intel® MAX® 10 FPGA Device Architecture

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ID 683105
Date 10/31/2022
Public
Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 FPGA Device Architecture
1. Intel® MAX® 10 FPGA Device Architecture x
1.1. Logic Array Block 1.2. Embedded Memory 1.3. Embedded Multiplier 1.4. Clocking and PLL 1.5. General Purpose I/O 1.6. High-Speed LVDS I/O 1.7. External Memory Interface 1.8. Analog to Digital Converter 1.9. Configuration Schemes 1.10. User Flash Memory 1.11. Power Management 1.12. Document Revision History for Intel® MAX® 10 FPGA Device Architecture
1.1. Logic Array Block x
1.1.1. LAB Interconnects 1.1.2. LAB Control Signals 1.1.3. Logic Elements
1.1.3. Logic Elements x
1.1.3.1. LE Features 1.1.3.2. LE Operating Modes
1.1.3.2. LE Operating Modes x
1.1.3.2.1. Normal Mode 1.1.3.2.2. Arithmetic Mode
1.3. Embedded Multiplier x
1.3.1. 18-Bit Multipliers 1.3.2. 9-Bit Multipliers
1.4. Clocking and PLL x
1.4.1. Global Clock Networks 1.4.2. Internal Oscillator 1.4.3. PLL Block and Locations
1.5. General Purpose I/O x
1.5.1. Intel® MAX® 10 I/O Banks Architecture 1.5.2. Intel® MAX® 10 I/O Banks Locations
1.6. High-Speed LVDS I/O x
1.6.1. Intel® MAX® 10 High-Speed LVDS Circuitry 1.6.2. Intel® MAX® 10 High-Speed LVDS I/O Location
1.7. External Memory Interface x
1.7.1. Intel® MAX® 10 I/O Banks for External Memory Interface
1.8. Analog to Digital Converter x
1.8.1. ADC Block Locations
1.9. Configuration Schemes x
1.9.1. JTAG Configuration 1.9.2. Internal Configuration
1.11. Power Management x
1.11.1. Single-Supply Device 1.11.2. Dual-Supply Device 1.11.3. Power Management Controller Scheme 1.11.4. Hot Socketing
1. Intel® MAX® 10 FPGA Device Architecture

1.1.1. LAB Interconnects

The LAB local interconnect is driven by column and row interconnects and LE outputs in the same LAB.

The direct link connection minimizes the use of row and column interconnects to provide higher performance and flexibility. The direct link connection enables the neighboring elements from left and right to drive the local interconnect of an LAB. The elements are:

  • LABs
  • PLLs
  • M9K embedded memory blocks
  • Embedded multipliers

Each LE can drive up to 48 LEs through local and direct link interconnects.

Figure 3. LAB Local and Direct Link Interconnects for Intel® MAX® 10 Devices
Level Two Title