Intel® MAX® 10 FPGA Device Architecture

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ID 683105
Date 10/31/2022
Public
Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 FPGA Device Architecture
1. Intel® MAX® 10 FPGA Device Architecture x
1.1. Logic Array Block 1.2. Embedded Memory 1.3. Embedded Multiplier 1.4. Clocking and PLL 1.5. General Purpose I/O 1.6. High-Speed LVDS I/O 1.7. External Memory Interface 1.8. Analog to Digital Converter 1.9. Configuration Schemes 1.10. User Flash Memory 1.11. Power Management 1.12. Document Revision History for Intel® MAX® 10 FPGA Device Architecture
1.1. Logic Array Block x
1.1.1. LAB Interconnects 1.1.2. LAB Control Signals 1.1.3. Logic Elements
1.1.3. Logic Elements x
1.1.3.1. LE Features 1.1.3.2. LE Operating Modes
1.1.3.2. LE Operating Modes x
1.1.3.2.1. Normal Mode 1.1.3.2.2. Arithmetic Mode
1.3. Embedded Multiplier x
1.3.1. 18-Bit Multipliers 1.3.2. 9-Bit Multipliers
1.4. Clocking and PLL x
1.4.1. Global Clock Networks 1.4.2. Internal Oscillator 1.4.3. PLL Block and Locations
1.5. General Purpose I/O x
1.5.1. Intel® MAX® 10 I/O Banks Architecture 1.5.2. Intel® MAX® 10 I/O Banks Locations
1.6. High-Speed LVDS I/O x
1.6.1. Intel® MAX® 10 High-Speed LVDS Circuitry 1.6.2. Intel® MAX® 10 High-Speed LVDS I/O Location
1.7. External Memory Interface x
1.7.1. Intel® MAX® 10 I/O Banks for External Memory Interface
1.8. Analog to Digital Converter x
1.8.1. ADC Block Locations
1.9. Configuration Schemes x
1.9.1. JTAG Configuration 1.9.2. Internal Configuration
1.11. Power Management x
1.11.1. Single-Supply Device 1.11.2. Dual-Supply Device 1.11.3. Power Management Controller Scheme 1.11.4. Hot Socketing
1. Intel® MAX® 10 FPGA Device Architecture

1.1. Logic Array Block

The LABs are configurable logic blocks that consist of a group of logic resources.

Each LAB consists of the following:

  • 16 logic elements (LEs)—smallest logic unit in Intel® MAX® 10 devices
  • LE carry chains—carry chains propagated serially through each LE within an LAB
  • LAB control signals—dedicated logic for driving control signals to LEs within an LAB
  • Local interconnect—transfers signals between LEs in the same LAB
  • Register chains—transfers the output of one LE register to the adjacent LE register in an LAB
Figure 2. LAB Structure of Intel® MAX® 10 Devices

The Intel® Quartus® Prime Compiler places associated logic in an LAB or adjacent LABs, allowing the use of local and register chain connections for performance and area efficiency.


Section Content
LAB Interconnects
LAB Control Signals
Logic Elements

Level Two Title