External Memory Interfaces Intel® Agilex™ FPGA IP User Guide

ID 683216
Date 12/19/2022
Public

A newer version of this document is available. Customers should click here to go to the newest version.

Document Table of Contents

6.5.5.1. One DIMM per Channel (1DPC) for UDIMM, RDIMM, LRDIMM, and SODIMM DDR4 Topologies

The interface covers data bytes (DQ/DQS), address signals, command signals (BA, BG, RAS, CAS, WE, ACT, PAR), control signals (CKE, CS, ODT) and clocks (CLK).

The following figure illustrates the signal connection topology for a PTH type of connector for UDIMM, RDIMM, and LRDIMM topologies.

Figure 131. Signal connections for DDR4 1DPC DIMM configuration using PTH DIMM connector

The following figure illustrates the signal connection topology for an SMT type of connector for UDIMM, RDIMM, LRDIMM, and SODIMM topologies.

Figure 132. Signal connections for DDR4 1DPC DIMM configuration using SMT DIMM connector

The following table provides specific routing guidelines for one DIMM per channel in UDIMM, RDIMM, LRDIMM, and SODIMM topologies for all supported signals in the interface.

Table 109.  Specific DDR4 1DPC routing guidelines for UDIMM, RDIMM, LRDIMM, and SODIMM configurations
Signal Group Segment Routing Layer Max Length (mil) Target Zse (ohms) Target Width, W (mil) Trace Spacing, S1 (mil): Within Group Trace Spacing, S2 (mil): CMD/CTRL/CLK to DQ/DQS Trace Spacing, S3 (mil):DQ Nibble to Nibble Trace Spacing (mil), Within DIFF pair Trace Spacing (mil), DQS pair to DQ Trace Spacing (mil), CLK pair to CMD/CTRL/CKE Channel to Channel Spacing (DQ to DQ, between two channels)
Segment Total MB
CLK BO1 US 50 4500   4 5, 17 5, 17   4   17  
BO2 SL 1000   4 5, 17 5, 17   4   17  
M SL   45 4.5   12 (3h)   4   12 (3)  
BI US 50   4   12 (3h)   4   12 (3h)  
CMD, CTRL, ALERT BO1 US 50 4500   4 5, 17 5, 17          
BO2 SL 1000   4 5, 17 5, 17          
M SL   45 4.5 8 (2h) 12 (3h)          
BI US 100   4 8 (2h) 12 (3h)          
DQ BO1 US 50 4500   3 5, 17   17       17
BO2 SL 1000   3 5, 17   17       17
M SL   50 3.5 8 (2h)   12 (3h)       16 (4h)
BI US 50   3.5 8 (2h)   12 (3h)       16 (4h)
DQS BO1 US 50 4500   3 5, 17     4 17    
BO2 SL 1000   3 5, 17     4 17    
M SL   50 3.5       4 12 (3h)    
BI US 50   3.5              
For an explanation of the guidelines represented in this table, refer to the bullet points immediately following Figure 130.

The following figure shows the RESET signal scheme and routing guideline for one DIMM per channel topologies.

Figure 133. Reset scheme for 1DPC DIMM topologies

The target impedance for the RESET signal is 50 ohms. The RESET signal shall have at least 3×h (where h stands for trace to nearest reference plane height or distance) spacing to other nearby signals on the same layer. The end-to-end RESET trace length is not limited but shall not exceed 5 inches.