AN 787: Intel® Stratix® 10 Thermal Modeling and Management with the Early Power Estimator

ID 683083
Date 7/16/2021

1.11. Transceiver Channel Spreading

Reducing the thermal resistances of the package in each design improves the efficiency of the cooling system. One way to achieve this is by spreading out the transceiver channels or use an extra transceiver tile to reduce the power density of a transceiver die. Targeted spreading can reduce ΨJC and increase ΨCA, thereby reducing the cooling requirement.