AN 787: Intel® Stratix® 10 Thermal Modeling and Management with the Early Power Estimator

ID 683083
Date 7/16/2021

1.1. List of Abbreviations

Table 1.  Definition of terms
Abbreviation Description
CFD Computational Fluid Dynamic, a numerical analysis method for solving the conjugated heat transfer problems.
CTM Compact Thermal Model, a geometric model that is used as an input to CFD tool.
EPE Early Power Estimator, a tool that estimates the power consumption of the FPGA device.
FPGA Field Programmable Gate Array
HBM High Bandwidth Memory
IHS Integrated Heat Spreader - case of an Intel® Stratix® 10 FPGA.
MCM Multi-Chip Module - an integrated circuit (IC) with more than one die.
SCM Single Chip Module
TCASE Integrated Heat Spreader or Case Temperature. The case temperature of a component is measured with an attached heat sink. This temperature is measured at the top geometric center of the package case/die.
TDP Thermal Design Power, the power dissipated in a die that is used for thermal analysis purposes.
TA Ambient Temperature, measured locally surrounding the FPGA. The ambient temperature should be measured just upstream of a passive heat sink or at the fan inlet for an active heat sink.
TCORE Core Fabric Die Temperature
TJ Junction Temperature
TJ-MAX Maximum Junction Temperature, a maximum allowable absolute temperature rating of the device or a targeted value.
TTDP Total Thermal Design Power, the power dissipated in the device that is used for thermal analysis purposes.
TIM Thermal Interface Material
TSD Temperature Sensor Diode

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