AN 787: Intel® Stratix® 10 Thermal Modeling and Management with the Early Power Estimator

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ID 683083
Date 7/16/2021
Public
Document Table of Contents
Document Table of Contents x
1. Intel® Stratix® 10 Thermal Modeling and Management with the Early Power Estimator
1. Intel® Stratix® 10 Thermal Modeling and Management with the Early Power Estimator x
1.1. List of Abbreviations 1.2. Introduction 1.3. Intel® Stratix® 10 Early Power Estimator Tool (EPE) 1.4. Intel® Stratix® 10 FPGA Package Physical Design 1.5. Physical Package Structure 1.6. Intel® Stratix® 10 FPGA Thermal Design Parameters 1.7. Intel® Stratix® 10 Compact Thermal Model (CTM) 1.8. Intel® Stratix® 10 Temperature Sensing Diodes (TSD) 1.9. Intel® Stratix® 10 Thermal Design Process 1.10. Early Power Estimator (EPE) 1.11. Transceiver Channel Spreading 1.12. Thermal Parameter Dependencies 1.13. Intel® Stratix® 10 Thermal Design Example 1.14. Document Revision History for AN 787: Intel® Stratix® 10 Thermal Modeling and Management with the Early Power Estimator
1.13. Intel® Stratix® 10 Thermal Design Example x
1.13.1. CFD Analysis Setup 1.13.2. CFD Analysis Results 1.13.3. Transceiver Channel Placement Optimization 1.13.4. TSD offset Assessment for the Example
1. Intel® Stratix® 10 Thermal Modeling and Management with the Early Power Estimator

1.1. List of Abbreviations

Table 1.  Definition of terms
Abbreviation Description
CFD Computational Fluid Dynamic, a numerical analysis method for solving the conjugated heat transfer problems.
CTM Compact Thermal Model, a geometric model that is used as an input to CFD tool.
EPE Early Power Estimator, a tool that estimates the power consumption of the FPGA device.
FPGA Field Programmable Gate Array
HBM High Bandwidth Memory
IHS Integrated Heat Spreader - case of an Intel® Stratix® 10 FPGA.
MCM Multi-Chip Module - an integrated circuit (IC) with more than one die.
SCM Single Chip Module
TCASE Integrated Heat Spreader or Case Temperature. The case temperature of a component is measured with an attached heat sink. This temperature is measured at the top geometric center of the package case/die.
TDP Thermal Design Power, the power dissipated in a die that is used for thermal analysis purposes.
TA Ambient Temperature, measured locally surrounding the FPGA. The ambient temperature should be measured just upstream of a passive heat sink or at the fan inlet for an active heat sink.
TCORE Core Fabric Die Temperature
TJ Junction Temperature
TJ-MAX Maximum Junction Temperature, a maximum allowable absolute temperature rating of the device or a targeted value.
TTDP Total Thermal Design Power, the power dissipated in the device that is used for thermal analysis purposes.
TIM Thermal Interface Material
TSD Temperature Sensor Diode
Level Two Title

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